1. A memory device comprising:
a memory array comprising a plurality of storage locations disposed above a plurality of generally parallel lines,
wherein each storage location comprises a programmable material disposed on a sidewall of a conductive element.
2. The memory device of claim 1, wherein the sidewall is substantially vertical.
3. The memory device of claim 1, wherein, at each storage location, the programmable material is disposed substantially only on the sidewall of the conductive element.
4. The memory device of claim 1, wherein the conductive element comprises a dielectric material and a conductive material thereover, the conductive element is disposed over a memory cell contact, and the programmable material electrically connects the conductive material and the memory cell contact.
5. The memory device of claim 4, wherein the memory cell contact and the conductive material are misaligned.
6. The memory device of claim 1, wherein the programmable material comprises a chalcogenide alloy.
7. The memory device of claim 6, wherein the chalcogenide alloy comprises at least one of germanium, antimony, or tellurium.
8. The memory device of claim 1, wherein the programmable material comprises at least one of a dielectric material, a transition-metal oxide, or a perovskite.
9. The memory device of claim 1, wherein the memory array is a single block of a multiple-block memory circuit.
10. The memory device of claim 9, wherein the memory circuit has a three-dimensional topology.
11. A method of forming a memory element, the method comprising:
providing a substrate having a memory cell contact thereon;
forming a conductive element over only a portion of the memory cell contact, thereby leaving exposed an area of the memory cell contact; and
electrically connecting the memory cell contact and the conductive element by forming a programmable material over at least the exposed area of the memory cell contact.
12. The method of claim 11, wherein forming the programmable material comprises depositing a layer of the programmable material over the substrate and anisotropically etching the layer of programmable material.
13. The method of claim 11, wherein the conductive element comprises a conductive material disposed over a dielectric material.
14. The method of claim 11, wherein the exposed area of the memory cell contact is substantially covered by the programmable material.
15. A method of forming a memory element, the method comprising:
providing a substrate having a memory cell contact thereon;
forming, over the substrate, a conductive element having at least one sidewall; and
forming a programmable material on at least the at least one sidewall.
16. The method of claim 15, wherein the at least one sidewall is substantially vertical.
17. The method of claim 15, wherein forming the programmable material comprises depositing a layer of the programmable material over the substrate and anisotropically etching portions of the layer of programmable material not contacting the at least one sidewall.
18. The method of claim 15, wherein the conductive element is formed over only a portion of the memory cell contact, thereby leaving exposed an area of the memory cell contact, and wherein the programmable material is disposed in contact with the exposed area.
19. The method of claim 18, wherein the programmable material electrically connects the memory cell contact and the conductive element.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A manufacturing method for a semi-rigid RFID card, the method comprising the following steps in the following order:
continuously feeding strips by reels, said strips each having a width at least equal to a dimension of a RFID card and defining an upper layer, a lower layer, and a compensator of the RFID card;
continuously printing an outer surface of the strip of the lower layer;
continuously recessing the strip of the compensator to form a recess;
continuously adhering the strip of the compensator to an inner face of the strip of the lower layer or to an inner surface of the strip of the upper layer with a layer of adhesive durably holding the strip of the compensator with the strip of the lower layer or with the strip of the upper layer;
continuously feeding at least one strip of a functional layer of the RFID card by at least another reel, the at least one strip of the functional layer having an antenna etched or printed thereon;
continuously adhering the at least one strip of the functional layer to the strip of the compensator by placing an electronic component from the at least one strip of the functional layer in coincidence with the recess of the strip of the compensator after having continuously adhered the strip of the compensator to an inner face of the strip of the lower layer or to an inner surface of the strip of the upper layer, and after having continuously fed at least one strip of the functional layer;
continuously pressurising the at least one strip of the functional layer with the strip of the compensator after placing the electronic component in coincidence with the recess of the strip of the compensator;
continuously adhering the at least one strip of the functional layer to the inner face of the strip of the upper layer or to the inner face of the strip of the lower layer with another layer of adhesive durably holding the strip of the functional layer with the strip of the upper layer or the strip of the lower layer; and
continuously cutting.
2. The manufacturing method as claimed in claim 1, wherein the continuously printing the outer surface of the strip of the lower layer is followed by continuously printing the outer surface of the strip of the upper layer.
3. The manufacturing method as claimed in claim 1, wherein the continuously printing the outer surface of the strip of the lower layer is preceded by continuously printing the outer surface of the strip of the upper layer.
4. The manufacturing method as claimed in claim 1, wherein the continuously recessing the strip of the compensator is carried out continuously by a holing system.
5. The manufacturing method as claimed in claim 1, wherein the recess of the strip of the compensator has a form and dimensions to house each electronic component in each recess.
6. The manufacturing method as claimed in claim 1, wherein the continuously adhering the strip of the compensator to the inner face of the strip of the lower layer or to the inner face of the strip of the upper layer is followed by continuously pressurising the strip of the compensator and the strip of the lower layer or the strip of the upper layer.
7. The manufacturing method as claimed in claim 1, wherein the continuously adhering the strip of the functional layer or strips of functional layers to the inner face of the strip of the upper layer or to the inner face of the strip of the lower layer is followed by continuously pressurising the strip of the lower layer, the strip of the compensator, the strips of the functional layers, and the strip of the upper layer.
8. The manufacturing method as claimed in claim 1, wherein the step of continuously printing the outer surface of the strip of the lower layer is followed by continuously stabilizing the strip of the lower layer.
9. The manufacturing method as claimed in claim 1, wherein the continuously pressurising the strip of the compensator and the strip of the lower layer or the strip of the upper layer is followed by continuously tension stabilizing the strip of the upper layer or the lower layer.
10. The manufacturing method as claimed in claim 1, wherein the continuously cutting comprises longitudinal cutting the strips of the functional layer, of the compensator, of the upper layer, and of the lower layer, then winding up in the form of bobbins.
11. The manufacturing method as claimed in claim 1, wherein the continuously cutting comprises longitudinal and transversal cutting the strips of the functional layer, of the compensator, of the upper layer, and of the lower layer, then folding in the form of fanfolds.
12. The manufacturing method as claimed in claim 1, wherein the continuously cutting comprises cutting the strips of the functional layer, of the compensator, of the upper layer, and of the lower layer, which are assembled into individual RFID cards.
13. The manufacturing method as claimed in claim 1, wherein the continuously cutting is followed by an on-line control step by a reading antenna.
14. The manufacturing method as claimed in claim 13, wherein the on-line control step is followed by a continuous customization step.
15. The manufacturing method as claimed in claim 14, wherein the continuous customization step is followed by a conditioning step.