1-17. (canceled)
18. A pharmaceutical composition for orally administering progesterone to a subject in need thereof comprising:
suspended progesterone;
solubilized progesterone;
a carrier, the carrier comprising a C6-C14 medium chain oil; and
a non-ionic surfactant.
19. The pharmaceutical composition of claim 18, wherein the carrier comprises at least one of mono-, di-, triglycerides, and combinations thereof, wherein the at least one mono-, di-, and triglycerides are predominantly C6-C12 fatty acid chain lengths.
20. The pharmaceutical composition of claim 19, wherein the at least one mono-, di-, and triglycerides are predominantly about >50 wt % C6-C12 fatty acid chain lengths.
21. The pharmaceutical composition of claim 19, wherein the medium chain oils are predominantly about >50 wt % C6-C12 mono- and diglycerides.
22. The pharmaceutical composition of claim 19, wherein the medium chain oils are predominantly about <10 wt % C6-C12 triglycerides.
23. The pharmaceutical composition of claim 18, wherein the non-ionic surfactant comprises C8 to C18 fatty acid esters of glycerol and polyethylene glycol and has an HLB value of about 15.
24. The pharmaceutical composition of claim 18, wherein the total suspended progesterone and solubilized progesterone comprises from about 25 mg to about 200 mg of progesterone.
25. The pharmaceutical composition of claim 24, wherein the total suspended progesterone and solubilized progesterone is one of the group consisting of 75 mg and 150 mg.
26. The pharmaceutical composition of claim 18, wherein the composition is formulated as a gelatin capsule.
27. The pharmaceutical composition of claim 18, wherein the composition provides increased bioavailability compared to micronized progesterone suspended in peanut oil.
28. A method comprising:
administering to a subject having endometrial hyperplasia a pharmaceutical composition comprising:
suspended progesterone;
solubilized progesterone;
a carrier; and
a non-ionic surfactant;
wherein the carrier comprises a C6-C14 medium chain oil.
29. The method of claim 28, wherein the carrier comprises at least one of mono-, di-, triglycerides, and combinations thereof, wherein the at least one mono-, di-, and triglycerides are predominantly C6-C12 fatty acid chain lengths.
30. The pharmaceutical composition of claim 28, wherein the total suspended progesterone and solubilized progesterone comprises from about 25 mg to about 200 mg of progesterone.
31. The method of claim 28, wherein the composition is formulated as a gelatin capsule.
32. The method of claim 28, wherein the composition comprises increased bioavailability compared to micronized progesterone suspended in peanut oil.
33. A method comprising:
administering to a subject in need of treatment for amenorrhea a pharmaceutical composition comprising:
suspended progesterone;
solubilized progesterone;
a carrier; and
a non-ionic surfactant;
wherein the carrier comprises a C6-C14 medium chain oil.
34. The method of claim 33, wherein the carrier comprises at least one of mono-, di-, triglycerides, and combinations thereof, wherein the at least one mono-, di-, and triglycerides are predominantly C6-C12 fatty acid chain lengths.
35. The pharmaceutical composition of claim 33, wherein the total suspended progesterone and solubilized progesterone comprises from about 25 mg to about 200 mg of progesterone.
36. The method of claim 33, wherein the composition is formulated as a gelatin capsule.
37. The method of claim 33, wherein the composition comprises increased bioavailability compared to micronized progesterone suspended in peanut oil.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of forming a FinFET transistor above a semiconductor substrate, wherein the method comprises:
performing at least one etching process so as to define first and second fins in said substrate;
forming a raised isolation post structure between said first and second fins, said raised isolation post structure having an upper surface that is at a level that is approximately equal to or greater than a level of an upper surface of each of said first and second fins, said raised isolation post structure partially defining a first space between said raised isolation post structure and said first fin and a second space between said raised isolation post structure and said second fin, wherein a depth of said first and second spaces defines a final fin height of said respective first and second fins; and
after forming said raised isolation post structure, forming a gate structure around a portion of each of said first and second fins and around a portion of said raised isolation post structure, wherein at least portions of said gate structure are positioned in said first and second spaces.
2. The method of claim 1, wherein forming said gate structure comprises:
depositing a high-k gate insulation material on and in contact with said first and second fins and on and in contact with said raised isolation post structure; and
depositing a work function adjusting metal layer on and in contact with said high-k gate insulation layer.
3. The method of claim 1, wherein forming said gate structure comprises forming said gate structure such that it fills said first and second spaces.
4. The method of claim 1, wherein said upper surface of said raised isolation post structure is level with said upper surface of each of said first and second fins.
5. The method of claim 1, wherein forming said raised isolation post structure between said first and second fins comprises:
forming a liner layer on said first and second fins and above a bottom surface of a trench between said first and second fins, said liner layer defining a recess;
forming a layer of insulating material above said liner layer and in said recess defined by said liner layer; and
performing at least one planarization process on at least said layer of insulating material to thereby define said raised isolation post structure positioned within said recess defined by said liner layer.
6. The method of claim 5, wherein said at least one planarization process is performed until it stops on an upper surface of said liner layer.
7. The method of claim 5, wherein said at least one planarization process is performed until it stops on said upper surfaces of said first and second fins.
8. The method of claim 5, further comprising performing at least one etching process to remove at least some portions of said liner layer positioned on said first and second fins.
9. The method of claim 1, wherein forming said gate structure around a portion of each of said first and second fins and around a portion of said raised isolation post structure comprises depositing a layer of a work function adjusting metal material with a target thickness of about one-half of an overall target thickness of said work function adjusting metal material in a gate cavity and in said first and second spaces.
10. A method of forming a FinFET transistor above a semiconductor substrate, wherein the method comprises:
performing at least one etching process so as to define a plurality of trenches in said substrate that define first and second fins in said substrate;
forming a liner layer on said fins and in the trench between said first and second fins, said liner layer defining a recess;
forming a layer of insulation material between said first and second fins and in said recess defined by said liner layer;
forming a sacrificial gate structure above said first and second fins, said liner layer and said layer of insulating material;
forming a sidewall spacer adjacent said sacrificial gate structure;
removing said sacrificial gate structure so as to define a gate cavity between said sidewall spacers and to expose said liner layer and said layer of insulating material within said gate cavity;
performing an etching process on said exposed portion of said liner layer within said gate cavity so as to remove portions of said liner layer positioned on each of said first and second fins, thereby resulting in the formation of a raised isolation post structure between said first and second fins and a first space and a second space between said raised isolation post structure and said first and second fins, respectively; and
forming a replacement gate structure around a portion of each of said first and second fins and around a portion of said raised isolation post structure within said gate cavity, wherein at least portions of said replacement gate structure are positioned in said first and second spaces.
11. The method of claim 10, wherein forming said replacement gate structure comprises:
depositing a high-k gate insulation material on and in contact with said first and second fins and on and in contact with said raised isolation post structure; and
depositing a work function adjusting metal layer on and in contact with said high-k gate insulation layer.
12. The method of claim 10, wherein forming said replacement gate structure comprises forming said replacement gate structure such that it fills said first and second spaces.
13. The method of claim 10, wherein said raised isolation post structure has an upper surface that is at a level that is approximately equal to or greater than a level of an upper surface of each of said first and second fins.
14. The method of claim 10, wherein an upper surface of said raised isolation post structure is level with an upper surface of each of said first and second fins.
15. The method of claim 10, wherein forming said liner layer and forming said layer of insulation material comprises:
forming said liner layer on said first and second fins and above a bottom surface of the trench between said first and second fins;
forming said layer of insulating material above said liner layer and in said recess defined by said liner layer; and
performing at least one planarization process on at least said layer of insulating material.
16. The method of claim 15, wherein said at least one planarization process is performed until it stops on an upper surface of said liner layer.
17. The method of claim 15, wherein said at least one planarization process is performed until it stops on said upper surfaces of said first and second fins.
18. The method of claim 10, wherein forming said replacement gate structure around a portion of each of said first and second fins and around a portion of said raised isolation post structure comprises depositing a layer of a work function adjusting metal material with a target thickness of about one-half of an overall target thickness of said work function adjusting metal material in a gate cavity and in said first and second spaces.
19. A method of forming a FinFET transistor above a semiconductor substrate, wherein the method comprises:
performing at least one etching process so as to define first and second fins in said substrate;
forming a raised isolation post structure between said first and second fins, said raised isolation post structure having an upper surface that is at a level that is approximately equal to or greater than a level of an upper surface of each of said first and second fins, said raised isolation post structure partially defining a first space between said raised isolation post structure and said first fin and a second space between said raised isolation post structure and said second fin; and
forming a gate structure around a portion of each of said first and second fins and around a portion of said raised isolation post structure, at least portions of said gate structure being positioned in said first and second spaces, wherein forming said gate structure comprises depositing a layer of a work function adjusting metal material with a target thickness of about one-half of an overall target thickness of said work function adjusting metal material in a gate cavity and in said first and second spaces.
20. The method of claim 1, wherein said gate structure is a replacement gate structure, the method further comprising removing a sacrificial gate structure from above said first and second fins prior to forming said raised isolation post structure.