1. A human fatigue assessment device comprising:
a physiological signal measuring unit configured to measure a pulse wave signal of a user;
a feature value extracting unit configured to extract first feature values each of which is obtained from a systolic posterior component of the pulse wave signal measured by said physiological signal measuring unit;
a storage unit in which the first feature values extracted by said feature value extracting unit are stored; and
a fatigue determining unit configured to determine whether or not the user is fatigued, using the first feature values extracted by said feature value extracting unit,
wherein said fatigue determining unit is configured to compare a first feature value among the first feature values extracted by said feature value extracting unit and at least one of the first feature values stored in said storage unit, to determine whether or not the user is fatigued,
wherein said human fatigue assessment device further comprises
a checking unit configured to generate checking information for checking whether the user is in an open-eye state or in a closed-eye state,
wherein said physiological signal measuring unit is further configured to measure a brain signal of the user as a physiological signal, and to attach the checking information to the measured physiological signal,
wherein said feature value extracting unit is further configured to extract second feature values each of which (i) is obtained from the physiological signal measured by said physiological signal measuring unit and (ii) is related to at least one of (a) a power value in an \u03b1 waveband in a time period during which the checking information indicates that the user is in the closed-eye state and (b) a power value in a \u03b2 waveband in a time period during which the checking information indicates that the user is in the open-eve state or the closed-eye state,
wherein said storage unit stores the second feature values extracted by said feature value extracting unit, and
wherein said human fatigue assessment device further comprises
a fatigue type determining unit configured to determine, when said fatigue determining unit determines that the user is fatigued, a type of the fatigue of the user as to whether the fatigue is due to a first work or due to a second work that is more monotonous than the first work, by comparing a second feature value among the second feature values extracted by said feature value extracting unit and at least one of the second feature values stored in said storage unit.
2. The human fatigue assessment device according to claim 1,
wherein said feature value extracting unit is configured to calculate an accelerated plethysmogram from the pulse wave signal, and to extract the first feature values, using information on at least a c wave or a d wave which is a component wave of an accelerated plethysmogram corresponding to the systolic posterior component.
3. The human fatigue assessment device according to claim 2,
wherein said feature value extracting unit is configured to extract a ratio of a peak value of the c wave with respect to a peak value of an a wave, a b wave, or an e wave in the accelerated plethysmogram as the first feature value, and
wherein said fatigue determining unit is configured to determine that the user is fatigued, when absolute values of the first feature values increase in time-series.
4. The human fatigue assessment device according to claim 2,
wherein said feature value extracting unit is configured to extract a difference between peak values of the a wave and the c wave in the accelerated plethysmogram, and
wherein said fatigue determining unit is configured to determine that the user is fatigued when absolute values of the first feature values decrease in time-series.
5. The human fatigue assessment device according to claim 2,
wherein said feature value extracting unit is configured to extract a value obtained by dividing a difference between peak values of the c wave and the d wave in the accelerated plethysmogram by the a wave in the accelerated plethysmogram, and
wherein said fatigue determining unit is configured to determine that the user is fatigued when absolute values of the first feature values increase in time-series.
6. The human fatigue assessment device according to claim 1, further comprising
a device controller for controlling an external device which stimulates the user when said fatigue determining unit determines that the user is fatigued.
7. The human fatigue assessment device according to claim 1,
wherein when said feature value extracting unit extracts the second feature values as being related to a power value in the \u03b1 waveband in a time period during which the checking information indicates that the user is in the closed-eye state, said fatigue type determining unit is configured to determine that the fatigue is due to the first work when the second feature values increase in time-series.
8. The human fatigue assessment device according to claim 1,
wherein when said feature value extracting unit extracts the second feature values as being related to a power value in a \u03b2 waveband in a time period during which the checking information indicates that the user is in the open-eye state or the closed-eye state, said fatigue type determining unit is configured to determine that the fatigue is due to the second work when the second feature values decrease in time-series.
9. A human fatigue assessment method for assessing a fatigue of a living body by a computer, said method comprising:
measuring a pulse wave signal of a user;
extracting first feature values each of which is obtained from a systolic posterior component of the pulse wave signal measured in said measuring;
storing, in a storage unit, the first feature values extracted in said extracting; and
determining, using the computer, whether or not the user is fatigued, using the first feature values extracted in said extracting,
wherein, in said determining, a first feature value among the first feature values extracted in said extracting and at least one of the first feature values read from the storage unit among the first feature values stored in the storage unit are compared to determine whether or not the user is fatigued,
wherein said human fatigue assessment method further comprises
generating checking information for checking whether the user is in an open-eye state or in a closed-eye state,
wherein said measuring includes measuring a brain signal of the user as a physiological signal, and attaching the checking information to the measured physiological signal,
wherein said extracting includes extracting second feature values each of which (i) is obtained from the physiological signal and (ii) is related to at least one of (a) a power value in an \u03b1 waveband in a time period during which the checking information indicates that the user is in the closed-eye state and (b) a power value in a \u03b2 waveband in a time period during which the checking information indicates that the user is in the open-eye state or the closed-eye state,
wherein said human fatigue assessment method further comprises
storing, in the storage unit, the second feature values extracted in said extracting, and wherein said determining includes, when it is determined that the user is fatigued, determining a type of the fatigue of the user as to whether the fatigue is due to a first work or due to a second work that is more monotonous than the first work, by comparing a second feature value among the second feature values extracted in said extracting and at least one of the second feature values stored in the storage unit.
10. A program stored in a non-transitory computer readable recording medium, said program causing a computer to execute the human fatigue assessment method according to claim 9.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An optoelectronic device packaging assembly, comprising:
an electrical sub-mount including a mounting area and a sub-mount bonding pad;
a device turning mount having a sub-mount mounting side attached to the mounting area of the electrical sub-mount and a device mounting side having a device mounting area oriented in a plane substantially perpendicular to the mounting area of the electrical sub-mount;
a light-emitting device including a device bonding pad and one or more semiconductor layers terminating at a common light-emitting surface and operable to emit light from the light-emitting surface, wherein the light-emitting device is attached to the device mounting area of the device turning mount with the light-emitting surface oriented in a plane substantially parallel to the mounting area of the electrical sub-mount and the device bonding pad adjacent the sub-mount bonding pad; and
a direct electrical connection between the device bonding pad and the sub-mount bonding pad, wherein the electrical connection includes one or more electrically conductive bumps forming a continuous electrical connection from the device bonding pad to the sub-mount bonding pad.
2. The packaging assembly of claim 1, wherein the light-emitting surface of the light-emitting device is oriented to emit light away from the electrical sub-mount.
3. The packaging assembly of claim 1, wherein the light-emitting surface of the light-emitting device is oriented to emit light toward the electrical sub-mount.
4. An optoelectronic device packaging assembly, comprising:
an electrical sub-mount including a mounting area;
a device turning mount having a sub-mount mounting side attached to the mounting area of the electrical sub-mount and a device mounting side having a device mounting area oriented in a plane substantially perpendicular to the mounting area of the electrical sub-mount, wherein the device turning mount includes an electrical trace having a sub-mount bonding portion oriented in a plane substantially parallel to the mounting area of the electrical sub-mount and a device bonding portion oriented in a plane substantially perpendicular to the mounting area of the electrical sub-mount; and
a light-emitting device including one or more semiconductor layers terminating at a common light-emitting surface and operable to emit light from the light-emitting surface, wherein the light-emitting device is attached to the device mounting area of the device turning mount with the light-emitting surface oriented in a plane substantially parallel to the mounting area of the electrical sub-mount.
5. The packaging assembly of claim 4, wherein the electrical trace extends through a volume of the device turning mount.
6. The packaging assembly of claim 4, wherein the device bonding portion of the electrical trace corresponds to electrically conducting material formed in a groove defined in a surface of the device mounting side of the device turning mount.
7. The packaging assembly of claim 4, further comprising a wire bond connected between the electrical sub-mount and the sub-mount bonding portion of the electrical trace and a wire bond connected between the device bonding portion of the electrical trace and the light-emitting device.
8. The packaging assembly of claim 1, wherein one of the electrically conductive bumps is a solder bump directly bonded to the sub-mount bonding pad.
9. The packaging assembly of claim 8, wherein the one or more electrically conductive bumps include a second solder bump directly bonded to the device bonding pad and directly bonded to the first solder bump.
10. The packaging assembly of claim 8, wherein the one or more electrically conductive bumps include a wire stud bump directly bonded to the device bonding pad and directly bonded to the solder bump.
11. The packaging assembly of claim 1, wherein the one or more electrically conductive bumps correspond to a continuous solder mass electrically directly connecting the device bonding pad to the sub-mount bonding pad.
12. The packaging assembly of claim 1, wherein the electrical sub-mount is formed of silicon.
13. The packaging assembly of claim 1, wherein the device turning mount is electrically insulating.
14. The packaging assembly of claim 1, wherein the electrical sub-mount comprises multiple sub-mount bonding pads, and further comprising:
one or more additional light-emitting devices each including a respective device bonding pads and one or more semiconductor layers terminating at a common light-emitting surface and operable to emit light from the light-emitting surface, wherein each light-emitting device is attached to the device mounting area of the device turning mount with a respective light-emitting surface oriented in a plane substantially parallel to the mounting area of the electrical sub-mount and the respective device bonding pad adjacent a corresponding one of the sub-mount bonding pads; and
direct electrical connections between the device bonding pads and respective ones of the corresponding sub-mount bonding pads, wherein each of the electrical connections includes one or more electrically conductive bumps forming a continuous electrical connection from a respective one of the device bonding pads to the corresponding sub-mount bonding pad.
15. The packaging assembly of claim 1, further comprising a housing formed of silicon, attached to the electrical sub-mount, and enclosing the device turning mount and the light-emitting device.
16. The packaging assembly of claim 1, wherein the light-emitting device is an edge-emitting laser.
17. An optoelectronic device packaging assembly, comprising:
an electrical sub-mount including a mounting area;
a device turning mount having a sub-mount mounting side attached to the mounting area of the electrical sub-mount and a device mounting side having a device mounting area oriented in a plane substantially perpendicular to the mounting area of the electrical sub-mount; and
an array of edge-emitting lasers attached to the device mounting area of the device turning mount with each edge-emitting laser oriented to emit light in a direction substantially perpendicular to the electrical sub-mount, each edge-emitting laser being electrically connected to the electrical sub-mount by a direct electrical connection between a respective laser bonding pad and a corresponding bonding pad of the electrical sub-mount.
18. The packaging assembly of claim 17, wherein each electrical connection includes a wire, one end of each wire being wire bonded to a respective laser bonding pad and another end of each wire being wire bonded to a respective electrical sub-mount bonding pad.
19. The packaging assembly of claim 18, wherein one end of each wire is stud bump bonded to a respective laser bonding pad and another end of each wire is wire bonded to a respective electrical sub-mount bonding pad.
20. The packaging assembly of claim 18, wherein each electrical connection includes a solder bump bonded to a respective electrical sub-mount bonding pad.
21. The packaging assembly of claim 20, wherein each electrical connection includes a second solder bump bonded to a respective laser bonding pad and to a solder ball bonded to a respective electrical sub-mount bonding pad.
22. The packaging assembly of claim 20, wherein each electrical connection includes a wire stud bump electrically coupled between a respective laser bonding pad and a solder ball bonded to a respective electrical sub-mount bonding pad.
23. The packaging assembly of claim 18, wherein each electrical connection corresponds to a solder mass electrically connecting a respective laser bonding pad to a respective electrical sub-mount bonding pad.
24. The packaging assembly of claim 1, wherein the electrical sub-mount is formed of silicon.
25. The packaging assembly of claim 4, wherein the device turning mount is electrically insulating.
26. The packaging assembly of claim 25, wherein the device turning mount comprises two electrically insulating substrates.