1. An integrated circuit comprising:
first solder bumps coupled to receive a first power supply voltage;
second solder bumps coupled to receive a second power supply voltage;
a first conductive layer having first traces electrically connected to the first solder bumps and having second traces electrically connected to the second solder bumps, wherein the first traces are interleaved between the second traces such that at least one of the first traces is located in between two of the second traces, and at least one of the second traces in located in between two of the first traces; and
a second conductive layer comprising first conductive pads electrically connected to the first solder bumps and second conductive pads electrically connected to the second solder bumps;
the second conductive layer further including first conductive fingers electrically connected to the first conductive pads and extending outwardly from the first conductive pads and second conductive fingers electrically connected to the second conductive pads and extending outwardly from the second conductive pads;
first vias extending from the first conductive fingers to the first traces and second vias extending from the second conductive fingers to the second traces;
each. of the first conductive fingers and the second conductive fingers including four conductive fingers per conductive pad an the fingers are arranged such that two fingers extend outwardly in opposite directions along a first axis and two other fingers extend outwardly in opposite directions along a second axis; and
wherein the second axis is substantially perpendicular to the first axis.
2. The integrated circuit of claim 1 wherein the first and the second traces are deposed in the first conductive layer diagonally with respect to orientation of the conductive fingers.
3. The integrated circuit of claim 2 further comprising additional electrically conductive regions disposed in the second conductive layer, the additional electrically conductive regions being electrically connected to circuit elements in the integrated circuit and to selected ones of the first traces and the second traces.
4. The integrated circuit of claim 1 wherein the integrated circuit includes a previously defined block of circuitry connected to receive electrical signals from the first traces and the second traces.
5. An integrated circuit comprising:
an array of solder bumps for being connected to external power supply and ground potential, the first solder bumps for receiving a power supply voltage and the second solder bumps for receiving a ground voltage;
a first conductive layer having interspersed traces with first traces electrically connected to the first solder bumps and second traces electrically connected to the second solder bumps, wherein the first traces are interleaved between the second traces such that substantially each first trace is located between two second traces, and substantially each second trace is located between two first traces; and
a second conductive layer comprising first conductive pads electrically connected to the first solder bumps to receive the power supply voltage and second conductive pads electrically connected to the second solder bumps to receive the ground voltage;
the second conductive layer further including first conductive fingers electrically connected to, and extending outward from, at least some of the first conductive pads and second conductive fingers electrically connected to, and extending outwardly from at least some of the second conductive pads;
first vias extending from the first conductive fingers to the first traces and second vias extending from the conductive fingers associated with the second conductive pads to the second traces; and wherein
substantially all of the first traces are connected to at least two of the first conductive fingers and substantially all of the second traces are connected to at least two of the second conductive fingers.
6. The integrated circuit defined in claim 5 further comprising additional conductors formed in the second conductive layer, the additional conductors being connected to one of the first traces and the second traces through vias.
7. The integrated circuit defined in claim 6 wherein circuit elements in the integrated circuit are coupled to receive the power supply voltage and the ground voltage through the additional conductors.
8. The integrated circuit defined in claim 6 wherein both the first traces and the second traces are disposed at about a 45degree angle with respect to an edge of the integrated circuit.
9. The integrated circuit of claim 5 wherein the integrated circuit includes a previously defined block of circuitry connected to the power supply voltage through the first traces and to the ground voltage through the second traces.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A hand-operated tool for transferring a film from a tape to a substrate, said tool comprising a housing from which a film transfer member (4) projects outwards and in which a film supply reel, from which the tape is pulled over the transfer member for transferring the film, as well as a winding-up reel, which is coaxial to the supply reel, are rotatably mounted, and a sliding coupling provided for a torque transmission from the supply reel to the winding-up reel, the tape being wound up on the winding-up reel after transfer of the film at the transfer member, wherein at a bottom side of the housing which, when transferring the film to the substrate, faces this substrate, in a transition region between a housing part accommodating the transfer member and a housing part housing the reels, two separate supporting means defining a tilting support for the housing, which tilting support is fixed relative to the housing, are externally provided on both sides of a housing main middle plane, which supporting means, in combination with the transfer member, provide a three-point support on the substrate, wherein the supporting means are formed by rollers laterally mounted on the housing.
2. A hand-operated tool according to claim 1, wherein the rollers are put onto an axle which passes through the housing.
3. A hand-operated tool according to claim 2, wherein the axle in the housing interior additionally supports the transfer member.
4. A hand-operated tool according to claim 2, wherein the axle is mounted on the bottom side of the housing.
5. A hand-operated tool according to claim 4, wherein the axle is snapped into bearing projections provided on the bottom side of the housing.
6. A hand-operated tool according to claim 4 or 5, wherein the rollers are integrally formed with the axle.
7. A hand-operated tool according to claim 6, wherein the rollers are integrally formed as an injection molded part.
8. A hand-operated tool according to claim 1, the rollers are put onto separate lateral axles.
9. A hand-operated tool according to claim 8, wherein the rollers are mounted in snap fit on the respective axles.
10. A hand-operated tool according to claim 1, wherein the rollers are inserted into undercut housing recesses.
11. A hand-operated tool according to claim 10, wherein the rollers are snapped into the undercut housing recesses.