1. A method for manufacturing an integrated pressure sensor, comprising the steps of:
providing a substrate with a first side and a second side, wherein the substrate includes conductive electrical traces located on the first and second sides;
positioning a plurality of compensation circuits on the first side of the substrate in electrical contact with one or more of the conductive electrical traces on the first side of the substrate, wherein the compensation circuits are positioned in an array;
positioning a plurality of pressure sensors on the second side of the substrate in electrical contact with one or more of the conductive electrical traces on the second side of the substrate, wherein each one of the sensors is associated with one of the compensation circuits to form a plurality of pressure sensor-compensation circuit pairs, and wherein the substrate includes conductive vias to electrically connect each of the sensor-compensation circuit pairs, where each of the compensation circuits provides temperature compensation for an associated one of the sensors;
calibrating each of the sensor-compensation circuit pairs; and
singulating each of the sensor-compensation circuit pairs for final packaging.
2. The method of claim 1, wherein the substrate is a low-temperature co-fired ceramic (LTCC).
3. The method of claim 1, wherein the compensation circuits each include an application specific integrated circuit (ASIC).
4. The method of claim 3, wherein the ASIC is configured to provide temperature and long-term drift compensation for an associated one of the sensors.
5. The method of claim 1, wherein the array is a 9 by 10 array.
6. The method of claim 1, wherein the sensor-compensation circuit pairs are calibrated in parallel.
7. A method for manufacturing an integrated pressure sensor, comprising the steps of:
providing a substrate with a first side and a second side, wherein the substrate includes conductive electrical traces located on the first and second sides;
positioning a plurality of compensation circuits on the first side of the substrate in electrical contact with one or more of the conductive electrical traces on the first side of the substrate, wherein the compensation circuits are positioned in an array;
positioning a plurality of pressure sensors on the second side of the substrate in electrical contact with or more of the conductive electrical traces on the second side of the substrate, wherein each one of the sensors is associated with one of the compensation circuits to form a plurality of pressure sensor-compensation circuit pairs, and wherein the substrate includes conductive vias to electrically connect each of the sensor-compensation circuit pairs, where each of the compensation circuits provides temperature compensation for an associated one of the sensors;
calibrating each of the sensor-compensation circuit pairs, wherein the sensor-compensation circuit pairs are calibrated in parallel; and
singulating each of the sensor-compensation circuit pairs for final packaging.
8. The method of claim 7, wherein the substrate is a low-temperature co-fired ceramic (LTCC).
9. he method of claim 7, wherein the substrate is a printed circuit board (PCB).
10. The method of claim 7, wherein the compensation circuits each include an application specific integrated circuit (ASIC).
11. The method of claim 10, wherein the ASIC is configured to provide temperature and long-term drift compensation for an associated one of the sensors.
12. The method of claim 7, wherein the array is a 9 by 10 array.
13. An integrated pressure sensor assembly, comprising:
a substrate with a first side and a second side, wherein the substrate includes conductive electrical traces located on the first and second sides;
a plurality of compensation circuits positioned on the first side of the substrate in electrical contact with one or more of the conductive electrical traces on the first side of the substrate, wherein the compensation circuits are positioned in an array; and
a plurality of pressure sensors positioned on the second side of the substrate in electrical contact with one or more of the conductive electrical traces on the second side of the substrate, wherein each one of the sensors is associated with one of the compensation circuits to form a plurality of pressure sensor-compensation circuit pairs, and wherein the substrate includes conductive vias to electrically connect the sensor-compensation circuit pairs, where each of the compensation circuits provides temperature compensation for an associated one of the sensors, and where each of the sensor-compensation circuit pairs are calibrated in parallel before being singulated for final packaging.
14. The integrated pressure sensor assembly of claim 13, wherein the substrate is a low-temperature co-fired ceramic (LTCC).
15. The integrated pressure sensor assembly of claim 13, wherein the substrate is a printed circuit board (PCB).
16. The integrated pressure sensor assembly of claim 13, wherein the compensation circuits each include an application specific integrated circuit (ASIC).
17. The integrated pressure sensor assembly of claim 16, wherein the ASIC is configured to provide temperature and long-term drift compensation for an associated one of the sensors.
18. The integrated pressure sensor assembly of claim 13, wherein the array is a 9 by 10 array.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A manufacturing method of a temperature-controlling plate, which has an arrangement in which a film heater (3) constituted by a heat absorbing and radiating section (5) formed on a surface of a resin film (4) is bonded to a surface of a heat conducting plate (1) having a plate shape, comprising the steps of: forming an adhesive layer (2) by drying and setting liquid resin that has been applied to the surface of said heat conducting plate (1); placing said film heater (3) and the heat-conducting plate (1) so as to be aligned face to face with each other with the adhesive layer (2) interpolated in between; and heating this to a predetermined temperature while applying a predetermined pressure to this so as to bond said film heater (3) to the heat-conducting plate (1).
2. The manufacturing method of a temperature-controlling plate according to claim 1, wherein: the heat absorbing and radiating section (5) of said film heater (3) is formed on the side opposite to the adhesive face of said heat-conducting plate (1) so that the liquid resin is applied, dried and set in a manner so as to coat the heat absorbing and radiating section (5).
3. The manufacturing method of a temperature-controlling plate according to claim 1 or claim 2, wherein: said resin film (4) of said film heater (3) Is a polyimide film, said heat-conducting plate (1) is aluminum, and said liquid resin Is liquid polyimide.