1. An ultrasonic testing method, the method comprising the steps of:
causing a transverse ultrasonic wave to be incident on a test object that has acoustic anisotropy and is constituted by a crystal structure, in a direction perpendicular to a surface of the test object; and
measuring a thickness of the test object on the basis of a velocity of the transverse ultrasonic wave propagating in the test object and a time period for the propagation of the transverse ultrasonic wave, while using, as the time period for the propagation of the transverse ultrasonic wave, a time period for propagation of a transverse wave component that propagates in the test object for the shortest time period, among a plurality of transverse wave components that are obtained by dividing the transverse ultrasonic wave and have polarizations in the different directions (vibration direction) due to the acoustic anisotropy.
2. The ultrasonic testing method according to claim 1,
wherein as the velocity of the transverse ultrasonic wave, a velocity of a transverse ultrasonic wave is used which is higher than that of the other transverse ultrasonic wave, the transverse ultrasonic wave being among transverse ultrasonic waves that propagate in a direction of a crystal orientation <100> and have polarizations in two directions.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1-10. (canceled)
11. An arrangement for heat dissipation, comprising:
a printed circuit board (22); and
at least one electrical component (21) arranged the circuit board, wherein a current supply unit (23) supplies the electrical component (21) with electrical power and the electronic component (21) and the current supply unit (23) are thermally coupled and the current supply unit (23) provides dissipation of thermal power losses from the electrical component (21).
12. The arrangement for heat dissipation of claim 11, wherein the current supply unit (23) consists of a material with high heat conductivity and low electrical resistance.
13. The arrangement for heat dissipation of claim 12, wherein the current supply unit (23) is connected to the printed circuit board (22) in so that the current supply unit (23) dissipates the thermal power loss transferred by the component by at leas ton of convection, radiation, or conduction and releases it to the environment.
14. The arrangement for heat dissipation of claim 11, wherein the current supply unit (23) thermally contacts the electrical component (21) on a surface which is as large as possible.
15. The arrangement for heat dissipation of claim 11, wherein the current supply unit (23) contacts the electrical component (21) laterally or from above and that the current supply unit and the electrical andor electrical component (21) are arranged on the same side of the printed circuit board (22).
16. The arrangement for heat dissipation of claim 11, wherein the current supply unit (23) contacts the electrical component (21) via a break through or an opening of the printed circuit board (22) via the thermal coupling and the current supply unit (23) and the electrical component (21) are arranged on an opposite side of the printed circuit board (22).
17. The arrangement for heat dissipation of claim 11, wherein the current supply unit (23) comprises cooling fins (55).
18. The arrangement for heat dissipation of claim 17, wherein the cooling fins (55) are formed so that the natural heat flow is supported in the current supply unit (23).
19. The arrangement for heat dissipation of claim 11, wherein the current supply unit (23) comprises at least one meander (66).
20. The arrangement for heat dissipation of claim 11, wherein the current supply unit (23) is a bus bar.
21. The arrangement for heat dissipation of claim 11, wherein the electrical component is an electronic component.