1. A solid electrolytic capacitor comprising:
a porous anode body formed with a dielectric layer, by anodic oxidation, on a surface of a porous sintered body made of a valve-acting metal and embedded with part of an anode lead having a protruding portion protruding from said porous sintered body;
a cathode layer including a solid electrolyte layer formed in contact with said dielectric layer of said porous anode body;
a mounting anode terminal member;
a mounting cathode terminal member;
an insulating casing resin covering said protruding portion of said anode lead and said cathode layer except at least part of each of said mounting anode terminal member and said mounting cathode terminal member; and
a small piece of a metal frame made of a valve-acting metal, said small piece formed integral with said protruding portion of said anode lead by cutting, after said anodic oxidation, said metal frame to which said protruding portion of said anode lead is fixed by resistance welding,
wherein said small piece of said metal frame and said mounting anode terminal member are connected together by wire bonding so that said anode lead and said mounting anode terminal member are electrically connected together.
2. A solid electrolytic capacitor according to claim 1, further comprising:
an insulating substrate having one surface formed with said mounting anode terminal member and said mounting cathode terminal member; and
an internal anode terminal and an internal cathode terminal formed on another surface, opposite to said one surface, of said insulating substrate,
wherein said small piece of said metal frame and said internal anode terminal are connected together by wire bonding so that said anode lead and said internal anode terminal are electrically connected together,
said internal anode terminal and said mounting anode terminal member are electrically connected together through a through hole formed in said insulating substrate, and
said internal cathode terminal and said mounting cathode terminal member are electrically connected together through a through hole formed in said insulating substrate.
3. A solid electrolytic capacitor according to claim 1, wherein two or more conduction paths are formed by said wire bonding.
4. A solid electrolytic capacitor according to claim 1, wherein said wire bonding is performed using a gold line.
5. A solid electrolytic capacitor according to claim 1, wherein said small piece of said metal frame and said mounting anode terminal member are fixed together by an adhesive.
6. A solid electrolytic capacitor according to claim 5, wherein said adhesive is a conductive adhesive.
7. A solid electrolytic capacitor according to claim 2, wherein said small piece of said metal frame and said internal anode terminal are fixed together by an adhesive.
8. A solid electrolytic capacitor according to claim 7, wherein said adhesive is a conductive adhesive.
9. A solid electrolytic capacitor according to claim 1, wherein said anode lead and said porous sintered body are each formed of tantalum.
10. A solid electrolytic capacitor according to claim 1, wherein said anode lead and said porous sintered body are each formed of niobium.
11. A solid electrolytic capacitor according to claim 1, wherein said small piece of said metal frame is made of aluminum.
12. A solid electrolytic capacitor according to claim 1, wherein a distance from a welding portion between said small piece of said metal frame and said protruding portion of said anode lead to an end, from which said anode lead protrudes, of said porous sintered body is 0.2 mm or less.
13. A solid electrolytic capacitor according to claim 1, wherein said solid electrolytic capacitor is a chip-type solid electrolytic capacitor.
14. A solid electrolytic capacitor comprising:
a porous anode body formed with a dielectric layer, by anodic oxidation, on a surface of a porous sintered body made of a valve-acting metal and embedded with part of an anode lead having a protruding portion protruding from said porous sintered body;
a cathode layer including a solid electrolyte layer formed in contact with said dielectric layer of said porous anode body;
an internal anode terminal and an internal cathode terminal formed on one surface of a substrate having a first and a second through hole;
a mounting anode terminal member and a mounting cathode terminal member formed on a surface, opposite to said one surface, of said substrate;
an insulating casing resin covering said protruding portion of said anode lead and said cathode layer except at least part of each of said mounting anode terminal member and said mounting cathode terminal member; and
a small piece of a metal frame made of a valve-acting metal, said small piece formed integral with said protruding portion of said anode lead by cutting, after said anodic oxidation, said metal frame to which said protruding portion of said anode lead is fixed by resistance welding,
wherein said small piece of said metal frame and said internal anode terminal are connected together by wire bonding so that said anode lead and said internal anode terminal are electrically connected together,
said internal anode terminal and said mounting anode terminal member are electrically connected together through said first through hole formed in said substrate, and
said internal cathode terminal and said mounting cathode terminal member are electrically connected together through said second through hole formed in said substrate.
15. A solid electrolytic capacitor manufacturing method comprising:
burying an anode lead made of a valve-acting metal in porous powder made of a valve-acting metal so that part of said anode lead protrudes from said porous powder, and sintering said porous powder with the anode lead to form a porous sintered body;
resistance-welding a metal frame made of a valve-acting metal to a protruding portion of said anode lead of said porous sintered body;
anodizing said porous sintered body to form a porous anode body formed with a dielectric layer on a surface of said porous sintered body;
cutting said metal frame so that part of said metal frame remains at said protruding portion of said anode lead, thereby forming a small piece of said metal frame;
forming a cathode layer including a solid electrolyte layer on a surface of said porous anode body;
electrically connecting a mounting anode terminal member and said small piece of said metal frame together by wire bonding;
electrically connecting a mounting cathode terminal member and said cathode layer together by a conductive adhesive; and
covering said protruding portion of said anode lead and said cathode layer with an insulating casing resin except at least part of each of said mounting anode terminal member and said mounting cathode terminal member.
16. A solid electrolytic capacitor manufacturing method according to claim 15, further comprising fixing said mounting anode terminal member and said small piece of said metal frame together by an adhesive.
17. A solid electrolytic capacitor manufacturing method according to claim 15, wherein said anode lead and said porous sintered body are made of tantalum or niobium and said metal frame is made of aluminum.
18. A solid electrolytic capacitor manufacturing method according to claim 15, wherein a distance from a welding portion between said small piece of said metal frame and said protruding portion of said anode lead to an end, from which said anode lead protrudes, of said porous sintered body is 0.2 mm or less.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An antenna comprising:
a conductive cylindrical tube having:
a longitudinal axis;
an inner surface having a first inner diameter; and
an outer surface having a first outer diameter;
a ground plane, wherein:
the ground plane comprises a first annulus having:
a first circular inner periphery having a second inner diameter; and
a first circular outer periphery having a second outer diameter;
the ground plane is orthogonal to the longitudinal axis; and
the first circular inner periphery is electrically connected to the outer surface;
a low-frequency radiator, wherein:
the low-frequency radiator comprises a second annulus having:
a second circular inner periphery having a third inner diameter; and
a second circular outer periphery having a third outer diameter;
the low-frequency radiator is orthogonal to the longitudinal axis;
the second circular inner periphery is electrically connected to the outer surface;
the low-frequency radiator is spaced apart from the ground plane; and
a low-frequency radiating gap is configured between the second circular outer periphery and the ground plane;
a high-frequency radiator, wherein:
the high-frequency radiator comprises a third annulus having:
a third circular inner periphery having a fourth inner diameter; and
a third circular outer periphery having a fourth outer diameter;
the high-frequency radiator is orthogonal to the longitudinal axis;
the high-frequency radiator is spaced apart from the low-frequency radiator such that the low-frequency radiator is disposed between the high-frequency radiator and the ground plane;
the third circular outer periphery is electrically connected to the low-frequency radiator; and
a high-frequency radiating gap is configured between the third circular inner periphery and the outer surface; and
a set of high-frequency capacitive elements, wherein:
the set of high-frequency capacitive elements is spaced apart from the high-frequency radiator;
each high-frequency capacitive element in the set of high-frequency capacitive elements has a first end and a second end; and
the first end of each high-frequency capacitive element is electrically connected to the outer surface.
2. The antenna of claim 1, further comprising a set of parasitic elements, wherein:
the set of parasitic elements is disposed around the low-frequency radiator and the high-frequency radiator;
each parasitic element in the set of parasitic elements has a first end and a second end; and
the first end of each parasitic element is electrically connected to the ground plane.
3. The antenna of claim 1, further comprising a set of low-frequency capacitive elements, wherein:
the set of low-frequency capacitive elements is disposed between the low-frequency radiator and the ground plane;
each low-frequency capacitive element in the set of low-frequency capacitive elements has a first end and a second end; and
the first end of each low-frequency capacitive element is electrically connected to the second circular outer periphery.
4. The antenna of claim 1, wherein:
the low-frequency radiator is configured to operate with circularly-polarized electromagnetic radiation having a frequency greater than or equal to a first specified frequency and less than or equal to a second specified frequency, wherein the second specified frequency is greater than the first specified frequency; and
the high-frequency radiator is configured to operate with circularly-polarized electromagnetic radiation having a frequency greater than or equal to a third specified frequency and less than or equal to a fourth specified frequency, wherein the third specified frequency is greater than the second specified frequency, and the fourth specified frequency is greater than the third specified frequency.
5. The antenna of claim 4, wherein a reference operational wavelength is selected such that the reference operational wavelength is greater than or equal to a first specified wavelength and less than or equal to a second specified wavelength, wherein the first specified wavelength corresponds to the fourth specified frequency and the second specified wavelength corresponds to the first specified frequency.
6. The antenna of claim 5, wherein the first outer diameter has a value from about 0.15 times the reference operational wavelength to about 0.4 times the reference operational wavelength.
7. The antenna of claim 4, wherein:
the first specified frequency is about 1165 MHz;
the second specified frequency is about 1300 MHz;
the third specified frequency is about 1525 MHz; and
the fourth specified frequency is about 1605 MHz.
8. The antenna of claim 7, wherein a reference operational wavelength is selected such that the reference operational wavelength is greater than or equal to about 187 mm and less than or equal to about 258 mm.
9. The antenna of claim 8, wherein the first outer diameter has a value from about 28 mm to about 103 mm.
10. The antenna of claim 9, wherein the first inner diameter has a value from about 27 mm to about 102 mm.
11. The antenna of claim 1, further comprising:
a set of four low-frequency excitation pins electrically connected to the low-frequency radiator, the set of four low-frequency excitation pins comprising:
a first low-frequency excitation pin configured to excite a first low-frequency electromagnetic signal having a first phase;
a second low-frequency excitation pin configured to excite a second low-frequency electromagnetic signal having a second phase, wherein a difference between the second phase and the first phase is about 90 degrees;
a third low-frequency excitation pin configured to excite a third low-frequency electromagnetic signal having a third phase, wherein a difference between the third phase and the first phase is about 180 degrees; and
a fourth low-frequency excitation pin configured to excite a fourth low-frequency electromagnetic signal having a fourth phase, wherein a difference between the second phase and the first phase is about 270 degrees;
and
a set of four high-frequency excitation pins electrically connected to the high-frequency radiator, the set of four high-frequency excitation pins comprising:
a first high-frequency excitation pin configured to excite a first high-frequency electromagnetic signal having a fifth phase;
a second high-frequency excitation pin configured to excite a second high-frequency electromagnetic signal having a sixth phase, wherein a difference between the sixth phase and the fifth phase is about 90 degrees;
a third high-frequency excitation pin configured to excite a third high-frequency electromagnetic signal having a seventh phase, wherein a difference between the seventh phase and the fifth phase is about 180 degrees; and
a fourth high-frequency excitation pin configured to excite a fourth high-frequency electromagnetic signal having an eighth phase, wherein a difference between the eighth phase and the first phase is about 270 degrees.
12. The antenna of claim 1, further comprising:
a first printed circuit board having a first top side and a first bottom side, wherein:
the ground plane is fabricated on the first top side; and
a low-frequency excitation system is fabricated on the first bottom side; and
a second printed circuit board having a second top side and a second bottom side, wherein:
the high-frequency radiator is fabricated on the second bottom side;
the set of high-frequency capacitive elements is fabricated on the second top side; and
a high-frequency excitation system is fabricated on the second top side.
13. The antenna of claim 12, further comprising a low-noise amplifier operably coupled to the low-frequency excitation system and the high-frequency excitation system.
14. The antenna of claim 13, wherein the low-noise amplifier is disposed on the first bottom side.