1461154247-212d37b7-db03-4294-8c9f-04aa5f08eaa8

1-20. (canceled)
21. A method of calibrating a receiver apparatus comprising at least one analog signal processing component and an intermediate frequency (IF) mixer for converting IF signals comprising an in-phase (I) signal and a quadrature-phase (Q) signal to baseband frequency signals, wherein the IF mixer is arranged downstream of the at least one analog signal processing component, the method comprising:
determining, in a digital signal processing domain downstream of the IF mixer, a metric which is affected by a frequency-dependency of an imbalance between the I signal and the Q signal (IQ-imbalance) over a signal bandwidth;
generating, based on the metric thus determined, a calibration signal configured to at least partially compensate a frequency-dependency of the IQ-imbalance;
feeding the calibration signal to the at least one analog signal processing component so as to calibrate the at least one analog signal processing component.
22. The method of claim 21, wherein the calibration signal is configured to reduce a frequency dependency of one or both of a gain imbalance and a phase imbalance between the I signal and the Q signal upstream of the IF mixer over the signal bandwidth.
23. The method of claim 21, wherein the calibration signal affects a frequency transfer function of the at least one analog signal processing component.
24. The method of claim 21, further comprising calibrating the IF mixer so as to at least partially compensate at least one of a gain imbalance and a phase imbalance between the I signal and the Q signal.
25. The method of claim 24, further comprising:
determining a compensation performance of the IF mixer;
selectively calibrating the at least one analog signal processing component based on the compensation performance.
26. The method of claim 25, further comprising:
determining a compensation performance of the at least one analog processing signal component;
selectively calibrating the IF mixer based on the compensation performance of the at least one analog processing signal component.
27. The method of claim 25, wherein the compensation performance is determined in terms of a metric which is related to an image-rejection ratio.
28. The method of claim 24:
wherein the calibration signal is configured to update one or more parameters of the at least one analog signal processing component;
further comprising determining IF mixer settings for compensating at least one of the gain imbalance and the phase imbalance responsive to the parameter update.
29. The method of claim 21, further comprising:
determining that a compensation performance criterion cannot be met;
requesting a signal bandwidth reduction responsive to the determination that a compensation performance criterion cannot be met.
30. The method of claim 21, wherein the calibration signal is generated using a calibration algorithm that is based on one or both of an estimated signal-to-noise ratio in an IQ-diagram and a power of the received signal as metric.
31. The method of claim 21, wherein the at least one analog signal processing component is selected from the set of signal processing components comprising at least one radio frequency mixer and at least one IF filter.
32. The method of claim 31:
wherein the analog signal processing components comprise a first IF filter for the I signal and a second IF filter for the Q signal;
wherein the calibration signal is fed to only one of the first IF filter and the second IF filter.
33. The method of claim 31, wherein the signal bandwidth is determined by a passband of the at least one IF filter.
34. A computer program product stored in a non-transitory computer readable medium for controlling a computing device to aid in calibrating an associated receiver apparatus comprising at least one analog signal processing component and an intermediate frequency (IF) mixer for converting IF signals comprising an in-phase (I) signal and a quadrature-phase (Q) signal to baseband frequency signals, wherein the IF mixer is arranged downstream of the at least one analog signal processing component, the computer program product comprising software instructions which, when run on one or more processing circuits of the computing device apparatus, causes the computing device to:
determine, in a digital signal processing domain downstream of the IF mixer, a metric which is affected by a frequency-dependency of an imbalance between the I signal and the Q signal (IQ-imbalance) over a signal bandwidth;
generate, based on the metric thus determined, a calibration signal configured to at least partially compensate a frequency-dependency of the IQ-imbalance;
feed the calibration signal to the at least one analog signal processing component so as to calibrate the at least one analog signal processing component.
35. A device for calibrating a receiver apparatus comprising at least one analog signal processing component and an intermediate frequency (IF) mixer for converting IF signals comprising an in-phase (I) signal and a quadrature-phase (Q) signal to baseband frequency signals, wherein the IF mixer is arranged downstream of the at least one analog signal processing component, the device comprising:
memory;
one or more processing circuits operatively connected to the memory and configured to:
determine, in a digital signal processing domain downstream of the IF mixer, a metric which is affected by a frequency-dependency of an imbalance between the I signal and the Q signal (IQ-imbalance) over a signal bandwidth;
generate, based on the metric thus determined, a calibration signal configured to at least partially compensate the frequency-dependency of the IQ-imbalance;
feed the calibration signal to the at least one analog signal processing component so as to calibrate the at least one analog signal processing component.
36. A receiver, comprising:
at least one analog signal processing component;
an intermediate frequency (IF) mixer for converting IF signals comprising an in-phase (I) signal and a quadrature-phase (Q) signal to baseband frequency signals, wherein the IF mixer is arranged downstream of the at least one analog signal processing component;
one or more processing circuits operatively connected to at least one analog signal processing component and configured to:
determine, in a digital signal processing domain downstream of the IF mixer, a metric which is affected by a frequency-dependency of an imbalance between the I signal and the Q signal (IQ-imbalance) over a signal bandwidth;
generate, based on the metric thus determined, a calibration signal configured to at least partially compensate the frequency-dependency of the IQ-imbalance;
feed the calibration signal to the at least one analog signal processing component so as to calibrate the at least one analog signal processing component.
37. The receiver of claim 36, wherein the at least one signal processing component has a frequency transfer function that is affectable by the calibration signal.
38. The receiver of claim 36, wherein the at least one analog signal processing component is selected from the set of signal processing components comprising at least one radio frequency mixer and at least one IF filter.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. Air conditioning system, in particular air conditioning system having carbon dioxide as refrigerant, particularly for use in a motor vehicle,
said air conditioning system comprising a compressor, a gas cooler, an expansion valve and an evaporator arranged in series and forming a closed circuit for said refrigerant;
said compressor having a compressor capacity control element and said air conditioning system further comprising a controller for controlling said compressor capacity control element and said expansion valve so as to regulate an expansion valve inlet pressure;
said controller regulating said expansion valve inlet pressure by
controlling said compressor capacity control element so as to align evaporator air off temperature with a set point;
monitoring expansion valve inlet temperature;
determining a required expansion valve inlet pressure corresponding to said monitored expansion valve inlet temperature by means of a control algorithm; and
adjusting said expansion valve and said compressor capacity control element together along an iso-capacity curve to said required expansion valve inlet pressure.
2. System according to claim 1, wherein said control algorithm comprises one or more control parameters chosen from the list comprising:
front end air flow;
gas cooler air inlet temperature;
evaporator air flow;
evaporator air inlet temperature;
evaporator air inlet humidity;
compressor speed; and
set point.
3. System according to claim 2, wherein said control parameters are set, estimated or measured.
4. System according to claim 2 or 3, wherein said front end air flow is estimated as a function of vehicle speed and fan speed.
5. System according to any of claims 2 to 4, wherein said gas cooler air inlet temperature is estimated as a function of vehicle speed and ambient temperature.
6. System according to any of claims 2 to 5, wherein said evaporator air flow is estimated as a function of blower speed, air temperature door setting, air distribution mode and air recirculation mode.
7. System according to any of claims 2 to 6, wherein said evaporator air inlet temperature is estimated as a function of cabin temperature, ambient temperature and air recirculation mode.
8. System according to any of claims 1 to 7, wherein said compressor is a variable stroke compressor and said compressor capacity control element is a compressor control valve.
9. System according to any of claims 1 to 7, wherein said compressor is a variable speed compressor and said compressor capacity control element is a variable speed electric drive.
10. System according to any of claims 1 to 9, wherein an internal heat exchanger is arranged between said gas cooler and said expansion valve.

1461154237-a82e5c66-c53d-4b10-9120-253efd4d833a

1. A solid-state imaging device comprising:
a pixel region which is configured such that a photoelectric conversion unit and a signal scanning circuit unit are included in a semiconductor substrate, and a matrix of unit pixels is disposed; and
a driving circuit region which is configured such that a device driving circuit for driving the signal scanning circuit unit is disposed on the semiconductor substrate,
wherein the photoelectric conversion unit is provided on a back surface side of the semiconductor substrate, which is opposite to a front surface of the semiconductor substrate where the signal scanning circuit unit is formed, and
the unit pixel includes an insulation film which is provided in a manner to surround a boundary part with the unit pixel that neighbors and defines a device isolation region.
2. The device according to claim 1, wherein the signal scanning circuit unit includes a photodiode which is provided in the semiconductor substrate and includes a diffusion layer of a first conductivity type which constitutes a signal charge accumulation region.
3. The device according to claim 1, wherein the unit pixel further includes a diffusion layer of a second conductivity type which is provided in the semiconductor substrate along a side wall of the insulation film.
4. The device according to claim 1, wherein the insulation film is disposed in a lattice-like plan-view shape in a manner to surround the unit pixel.
5. The device according to claim 1, wherein the insulation film is disposed in a discontinuous hole-like plan-view shape in a manner to surround a boundary part with the unit pixel that neighbors.
6. The device according to claim 1, further comprising a vertical shift register which selects the unit pixels on a row-by-row basis.
7. The device according to claim 1, further comprising an analog-digital conversion circuit which converts an analog signal, which is input from the unit pixel, to a digital signal.
8. A solid-state imaging device comprising:
a pixel region which is configured such that a photoelectric conversion unit and a signal scanning circuit unit are included in a semiconductor substrate, and a matrix of unit pixels is disposed, the photoelectric conversion unit being provided on a back surface side of the semiconductor substrate, which is opposite to a front surface of the semiconductor substrate where the signal scanning circuit unit is formed, and the unit pixel including an insulation film which is provided in a manner to surround a boundary part with the unit pixel that neighbors and defines a device isolation region, and being provided in the semiconductor substrate with an offset from the front surface of the semiconductor substrate where the signal scanning circuit unit is formed; and
a driving circuit region which is configured such that a device driving circuit for driving the signal scanning circuit unit is disposed on the semiconductor substrate.
9. The device according to claim 8, wherein the signal scanning circuit unit includes a photodiode which is provided in the semiconductor substrate and includes a diffusion layer of a first conductivity type which constitutes a signal charge accumulation region.
10. The device according to claim 8, wherein the unit pixel further includes a diffusion layer of a second conductivity type which is provided in the semiconductor substrate along a side wall of the insulation film.
11. The device according to claim 8, wherein the insulation film is disposed in a lattice-like plan-view shape in a manner to surround the unit pixel.
12. The device according to claim 8, wherein the insulation film is disposed in a discontinuous hole-like plan-view shape in a manner to surround a boundary part with the unit pixel that neighbors.
13. The device according to claim 8, further comprising a vertical shift register which selects the unit pixels on a row-by-row basis.
14. The device according to claim 8, further comprising an analog-digital conversion circuit which converts an analog signal, which is input from the unit pixel, to a digital signal.
15. A method of manufacturing a solid-state imaging device, comprising:
attaching a first support substrate on a front surface of a semiconductor substrate on a side on which a signal scanning circuit is formed;
reducing a thickness of a back surface of the semiconductor substrate on a side opposite to the side on which the signal scanning circuit is formed;
forming, in the semiconductor substrate on the back surface side, a trench which defines a device isolation region in a manner to surround a unit pixel;
forming an insulation film by burying an insulative material in the trench;
attaching a second support substrate on the back surface side of the semiconductor substrate;
removing the first support substrate;
forming a signal scanning circuit unit on the front-side surface of the semiconductor substrate;
removing the second support substrate; and
forming a light-receiving surface on the back-side surface of the semiconductor substrate.
16. The method according to claim 15, further comprising doping a dopant in a semiconductor surface on a side wall in the trench, and forming an impurity diffusion layer.
17. The method according to claim 15, wherein when the trench which defines the device isolation region is formed, the trench is offset in the semiconductor substrate with a predetermined distance from a surface of the first support substrate.
18. The method according to claim 15, wherein a plan-view arrangement of the insulation film is such a lattice-shaped arrangement as to surround the unit pixel.
19. The method according to claim 15, wherein when the trench for forming the device isolation region is formed, a plan-view shape thereof is formed as a lattice-like shape in a manner to surround the unit pixel.
20. The method according to claim 15, wherein when the trench for forming the device isolation region is formed, a plan-view shape thereof is formed as a discontinuous hole-like shape in a manner to surround a boundary part with the unit pixel.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1-7. (canceled).
8. A method of improving the sun protection factor of human skin, the method comprising:
(i) providing a composition comprising (a) \u03b2-carotene, (b) lutein and (c) lycopene, in a ratio by weight (a):(b):(c) of from 1:0.5:0.5 to 1:1.5:1.5; and
(ii) orally administering the composition to a human.
9. The method according to claim 8, wherein the composition further comprises one or more components selected from the group consisting of \u03b1-carotene, astaxanthin, \u03b1-cryptoxanthin, \u03b2-cryptoxanthin, zeaxanthin, phytoene, phtyofluene, \u03b3-carotene and neurosporin.
10. The method according to claim 8, wherein the \u03b2-carotene, the lutein and the lycopene in a ratio by weight of from 1:0.5:0.5 to 1:1.0:1.0.
11. The method according to claim 8, wherein the composition is dispersed in an edible oil.
12. The method according to claim 8, wherein the \u03b2-carotene, the lutein and the lycopene are each present in an amount of from 1 to 40 mg.
13. A method of inhibiting the aging of human skin, the method comprising:
(i) providing a composition comprising (a) \u03b2-carotene, (b) lutein and (c) lycopene, in a ratio by weight (a):(b):(c) of from 1:0.5:0.5 to 1:1.5:1.5; and
(ii) orally administering the composition to a human.
14. The method according to claim 13, wherein the composition further comprises one or more components selected from the group consisting of \u03b1-carotene, astaxanthin, \u03b1-cryptoxanthin, \u03b2-cryptoxanthin, zeaxanthin, phytoene, phtyofluene, \u03b3-carotene and neurosporin.
15. The method according to claim 13, wherein the \u03b2-carotene, the lutein and the lycopene in a ratio by weight of from 1:0.5:0.5 to 1:1.0:1.0.
16. The method according to claim 13, wherein the composition is dispersed in an edible oil.
17. The method according to claim 13, wherein the \u03b2-carotene, the lutein and the lycopene are each present in an amount of from 1 to 40 mg.