Author: claimsbot

What is claimed is:

1. A method for manufacturing a master substrate for producing a grooved molding substrate, comprising:
a preparing step that prepares a substrate on which a photoresist is coated;
an exposing step that exposes the photoresist to light with a predetermined pattern such that the exposed part corresponds to a land of the grooved molding substrate to be produced; and
a developing step that obtains the master substrate by developing the photoresist.
2. A method for manufacturing a master substrate for producing a grooved molding substrate, comprising:
a preparing step that prepares a substrate on which a photoresist is coated;
an exposing step that exposes the photoresist to light with a predetermined pattern such that the exposed part corresponds to a land of the grooved molding substrate to be produced;
a developing step that forms a resist pattern by developing the photoresist, the resist pattern exposing a part of the substrate;
an etching step that etches the part of the substrate exposed in the developing step; and
a removing step that obtains the master substrate by removing the photoresist.
3. A method for manufacturing a master substrate for use in producing a grooved molding substrate, comprising:
a first step that prepares a substrate on which a photoresist is coated;
a second step that exposes the photoresist with exposing light, the resultant photoresist having a portion that is exposed to the exposing light and a portion that is not exposed to the exposing light, the exposed portion corresponding to a land of the grooved molding substrate to be produced, the unexposed portion corresponding to a groove of the grooved molding substrate to be produced; and
a third step that obtains the master substrate by developing the photoresist exposed in the second step.
4. The method according to claim 3, wherein the second step includes the steps of:
forming a part corresponding to a first land of the grooved molding substrate to be produced, by illuminating and exposing the photoresist along a first line with the exposing light;
moving an illuminating position from the first line to a second line that is separated from the first line by a distance corresponding to the sum of a groove width Gw and a land width Lw of the grooved molding substrate to be produced; and
forming a part corresponding to a second land of the grooved molding substrate to be produced, by illuminating and exposing the photoresist along the second line with the exposing light.
5. The method according to claim 4, wherein the groove width Gw is about 0.1 m or less.
6. The method according to claim 4, wherein the groove width Gw is about 0.06 m or less.
7. The method according to claim 4, wherein the groove of the grooved molding substrate is at least one of a pit, a hollow, and discontinuity.
8. The method according to claim 4, wherein the step of moving an illuminating position from the first line to a second line and the step of forming a part corresponding to a second land of the grooved molding substrate to be produced are repeated in that order a plurality of times by successively regarding the second line in the previous execution of the two steps as the first line in the repetition.
9. The method according to claim 3, wherein the second step includes a step that forms a part corresponding to a spiral-shaped land of the grooved molding substrate to be produced, by illuminating and exposing the photoresist along a spiral line, the spiral line having an interval corresponding to the sum of a groove width Gw and a land width Lw of the grooved molding substrate to be produced.
10. The method according to claim 9, wherein the groove width Gw is about 0.1 m or less.
11. The method according to claim 9, wherein the groove width Gw is about 0.06 m or less.
12. The method according to claim 9, wherein the groove of the grooved molding substrate is at least one of a pit, a hollow, and discontinuity.
13. A method for manufacturing a master substrate for use in producing a grooved molding substrate, comprising:
a first step that prepares a substrate on which a photoresist is coated;
a second step that exposes the photoresist with exposing light, the resultant photoresist having a portion that is exposed to the exposing light and a portion that is not exposed to the exposing light, the exposed portion corresponding to a land of the grooved molding substrate to be produced, the unexposed portion corresponding to a groove of the grooved molding substrate to be produced;
a third step that obtains a resist pattern by developing the photoresist exposed in the second step;
a fourth step that etches a part of the substrate in accordance with the resist pattern; and
a fifth step that removes the photoresist from the substrate processed in the third step to obtain the master substrate for use in producing the grooved molding substrate.
14. The method according to claim 13, wherein the second step includes the steps of:
forming a part corresponding to a first land of the grooved molding substrate to be produced, by illuminating and exposing the photoresist along a first line with the exposing light;
moving an illuminating position from the first line to a second line that is separated from the first line by a distance corresponding to the sum of a groove width Gw and a land width Lw of the grooved molding substrate to be produced; and
forming a part corresponding to a second land of the grooved molding substrate to be produced, by illuminating and exposing the photoresist along the second line with the exposing light.
15. The method according to claim 14, wherein the groove width Gw is about 0.1 m or less.
16. The method according to claim 14, wherein the groove width Gw is about 0.06 m or less.
17. The method according to claim 14, wherein the groove of the grooved molding substrate is at least one of a pit, a hollow, and discontinuity.
18. The method according to claim 14, wherein the step of moving an illuminating position from the first line to a second line and the step of forming a part corresponding to a second land of the grooved molding substrate to be produced are repeated in that order a plurality of times by successively regarding the second line in the previous execution of the two steps as the first line in the repetition.
19. The method according to claim 13, wherein the second step includes a step that forms a part corresponding to a spiral-shaped land of the grooved molding substrate to be produced, by illuminating and exposing the photoresist along a spiral line, the spiral line having an interval corresponding to the sum of a groove width Gw and a land width Lw of the grooved molding substrate to be produced.
20. The method according to claim 19, wherein the groove width Gw is about 0.1 m or less.
21. The method according to claim 19, wherein the groove width Gw is about 0.06 m or less.
22. The method according to claim 19, wherein the groove of the grooved molding substrate is at least one of a pit, a hollow, and discontinuity.
23. A method for manufacturing a stamper for producing a grooved molding substrate, comprising the steps of:
obtaining a master substrate manufactured using the method according to any one of claims 1-4, 9, 13-14, and 19 using a positive type photoresist as the photoresist;
forming a replica from the master substrate, the replica having a surface profile that is reverse of the surface profile of the master substrate; and
producing the stamper from the replica using an electroforming method.
24. The method for manufacturing a stamper for producing a grooved molding substrate according to claim 23, wherein the replica is made of at least one of a metal and a resin.
25. A method for manufacturing a stamper for producing a grooved molding substrate, comprising the steps of:
obtaining a master substrate manufactured using the method according to any one of claims 1-4, 9, 13-14, and 19 using a negative type photoresist as the photoresist, and producing the stamper from the master substrate using an electroforming method.
26. A method for manufacturing a stamper comprising steps of:
a preparing step that prepares a substrate on which a photoresist is coated;
an exposing step that exposes the photoresist to light with a predetermined pattern;
a developing step that forms a resist pattern by developing the photoresist;
an etching step that etches a part of the substrate not covered by the photoresist;
a removing step that obtains a master substrate by removing the photoresist;
a replica forming step that forms a resin replica from the master substrate; and
a stamper producing step that produces the stamper from the replica using an electroforming method.
27. A method for manufacturing a grooved molding substrate comprising the steps of:
obtaining a stamper manufactured using the method of claim 23; and
producing the grooved molding substrate by forming one of a glass and a resin with the stamper.
28. A method for manufacturing a grooved molding substrate comprising the steps of:
obtaining a stamper manufactured using the method of claim 25, and
producing the grooved molding substrate by forming one of a glass and a resin with the stamper.
29. A grooved molding substrate manufactured by an injection molding method using a stamper, wherein the groove width Gw is about 0.1 m or less.
30. The grooved molding substrate according to claim 29, wherein the groove width Gw is about 0.06 m or less.
31. The grooved molding substrate according to claim 29, wherein the slope angle of the sidewall of the groove is about 85 or more.
32. The grooved molding substrate according to claim 29, wherein the ratio of the groove depth d to the groove width Gw is about 0.1 or more.
33. The grooved molding substrate according to claim 29, wherein the groove is at least one of a pit and a discontinuity.
34. A memory medium a substrate of which is manufactured by the method for manufacturing a grooved molding substrate according to claim 27.
35. A memory medium a substrate of which is manufactured by the method for manufacturing a grooved molding substrate according to claim 28.
36. A memory medium a substrate of which is the grooved molding substrate of claim 29.
37. A memory device having the memory medium according to claim 34.
38. A memory device having the memory medium according to claim 35.
39. A memory device having the memory medium according to claim 36.
40. A computer having the memory device according to claim 37.
41. A computer having the memory device according to claim 38.
42. A computer having the memory device according to claim 39.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for manufacturing an image sensor, comprising:
forming an oxide layer on a color filter layer;
etching the oxide layer to form a first oxide layer microlens;
forming a second oxide layer microlens on the first oxide layer microlens;
performing a chemical treatment on the second oxide layer microlens; and
forming a third oxide layer microlens on the second oxide layer microlens after performing the chemical treatment.
2. The method according to claim 1, wherein performing the chemical treatment comprises applying a chemical to the second oxide layer microlens, wherein the chemical comprises TMH, H2O2 and H2O.
3. The method according to claim 2, wherein etching the oxide layer comprises using a photoresist pattern as an etching mask.
4. The method according to claim 2, wherein etching the oxide layer to form the first oxide layer microlens comprises:
depositing a photoresist pattern on the oxide layer;
forming a microlens pattern by performing a reflow process on the photoresist pattern; and
etching the oxide layer using the microlens pattern as an etching mask.
5. The method according to claim 2, wherein performing the chemical treatment comprises performing the chemical treatment for about 1 minute to about 5 minutes.
6. The method according to claim 2, wherein the chemical comprises about 1.5 to about 2.3 times as much H2O2 as TMH, and wherein the chemical comprises about 20 to about 36.7 times as much H2O as TMH.
7. The method according to claim 6, wherein performing the chemical treatment comprises performing the chemical treatment for about 1 minute to about 5 minutes.
8. The method according to claim 6, wherein etching the oxide layer comprises using a photoresist pattern as an etching mask.
9. The method according to claim 6, wherein etching the oxide layer to form the first oxide layer microlens comprises:
depositing a photoresist pattern on the oxide layer;
forming a microlens pattern by performing a reflow process on the photoresist pattern; and
etching the oxide layer using the microlens pattern as an etching mask.
10. The method according to claim 1, wherein performing the chemical treatment comprises performing the chemical treatment for about 1 minute to about 5 minutes.
11. The method according to claim 1, wherein etching the oxide layer comprises using a photoresist pattern as an etching mask.
12. The method according to claim 1, wherein etching the oxide layer to form the first oxide layer microlens comprises:
depositing a photoresist pattern on the oxide layer;
forming a microlens pattern by performing a reflow process on the photoresist pattern; and
etching the oxide layer using the microlens pattern as an etching mask.
13. The method according to claim 1, wherein etching the oxide layer comprises using a photoresist pattern as an etching mask.
14. The method according to claim 1, wherein etching the oxide layer to form the first oxide layer microlens comprises:
depositing a photoresist pattern on the oxide layer;
forming a microlens pattern by performing a reflow process on the photoresist pattern; and
etching the oxide layer using the microlens pattern as an etching mask.
15. The method according to claim 1, wherein forming the oxide layer comprises depositing the oxide layer at a temperature of about 200\xb0 C. or less.
16. The method according to claim 1, wherein forming the oxide layer comprises depositing the oxide layer to a thickness of about 700 nm to about 800 nm.
17. The method according to claim 1, wherein forming the second oxide layer microlens comprises forming a second oxide layer on the first oxide layer microlens to a thickness of about 100 nm to about 300 nm.
18. The method according to claim 1, wherein forming the third oxide layer microlens comprises forming a third oxide layer on the second oxide layer microlens to a thickness of about 100 nm to about 300 nm.
19. The method according to claim 1, wherein the second oxide layer microlens comprises a low temperature oxide.

1. A method of applying a watermark to an image, the method comprising:
(a) providing image data that represents the image;
(b) providing a first message string that includes a first plurality of message bits and a second message string that includes a second plurality of message bits;
(c) arraying the message bits of the first message string at points of a four-dimensional lattice, the four-dimensional lattice being formed as a product of a two-dimensional position-domain lattice and a two-dimensional frequency-domain lattice;
(d) generating wavepacket data by convolving each of the message bits of the first message string with a respective watermark function in accordance with a position of the respective bit of the first message string in the four-dimensional lattice, thereby forming data corresponding to a respective wavepacket for each \u201c1\u201d bit of the first message string;
(e) modifying at least one of an intensity level and a phase of the respective wavepacket data for at least some of the \u201c1\u201d bits of the first message string to encode in the wavepacket data a message which corresponds to the second message string; and
(f) combining the modified wavepacket data generated at step (e) with the image data provided at step (a) to generate combined image data.
2. The method according to claim 1, further comprising:
(g) transforming pixel values of the combined image data.
3. The method according to claim 2, further comprising:
(h) printing an image using the transformed pixel values resulting from step (g).
4. The method according to claim 3, wherein the image is printed as part of a postage meter indicium.
5. The method according to claim 1, wherein phases of the wavepacket data are not modified in step (e).
6. The method according to claim 5, wherein two bits of the second message string are encoded in the wavepacket data for each \u201c1\u201d bit of the first message string.
7. The method according to claim 1, wherein the second message string represents an encrypted message.
8. A method of determining whether a printed-image-under-examination (PIUE) is authentic, the PIUE including a watermark formed of a plurality of wavepackets, the method comprising:
(a) scanning the PIUE to generate scanned image data comprising pixel data, the pixel data comprising gray scale values and representing the PIUE as a set of scanning pixels;
(b) forming a plurality of data blocks from the scanned image data, each data block consisting of pixel data which corresponds to a respective region of the PIUE;
(c) transforming the pixel data in at least some of the data blocks to obtain transform domain data;
(d) applying a watermark detecting operation to the transform domain data for respective ones of the data blocks to detect at least one of (i) variations in intensity among the wavepackets, and (ii) variations in phase among the wavepackets; and
(e) analyzing the detected variations in intensity andor variations in phase to detect a message encoded with said variations in intensity andor variations in phase.
9. The method according to claim 8, wherein step (c) includes applying at least one of a Fourier transform, a fast Fourier transform, a discrete cosine transform (DCT) and a wavelet transform to the pixel data in the at least some of the data blocks to obtain the transform domain data.
10. The method according to claim 8, wherein the PIUE is part of a postal indicium.
11. The method according to claim 8, wherein the regions of the PIUE to which the data blocks correspond are at least partially overlapping with each other.
12. The method according to claim 8, wherein step (d) includes detecting variations in phase among the wavepackets;
and further comprising:
presenting the detected variations in phase in the form of a color map comprising a plurality of colors each of which represents a respective phase.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A fuel cell stack comprising a cell stack in which a plurality of fuel battery single cells are stacked, a pair of end plates which sandwich the cell stack from respective sides in a stack direction, and a system component which is mounted on one end plate, and in which there is formed a manifold that extends in and through the cell stack in the stack direction and for supplying and discharging a fuel gas or an oxidizing agent gas for each of the fuel battery single cells, wherein
the one end plate has a stack-facing surface which faces the cell stack and a system component mounting surface on a side opposite of the stack facing surface, and a system component mounting portion for mounting the system component being formed in a projected manner on the system component mounting surface, and
the system component mounting portion has a trapezoidal side surface with a tip surface of the system component mounting portion having an inclination angle with respect to the stack-facing surface so that, when the fuel cell stack is placed such that the manifold has a downward inclination toward the one end plate, the surface of the system component mounting portion is oriented along a vertical direction,
wherein the system component includes at least a pump and a pipe.
2. The fuel cell stack according to claim 1, wherein
the one end plate is composed of a flat plate section having a constant thickness on a surface of which the system component mounting portion is formed in a projected manner.
3. The fuel cell stack according to claim 1, wherein
a lower side corner of the other end plate of the pair of end plates is removed.
4. The fuel cell stack according to claim 1, wherein
an upper side corner of the other end plate of the pair of end plates is removed.