Author: claimsbot

1. A logging method that comprises:
receiving at least one of a set of amplitude and phase measurements as a function of azimuthal angle and tool position from a set of receivers having no more than two different receiver orientations in response to signals from a set of transmitters having no more than one transmitter orientation;
determining from said set of measurements at least seven components of a coupling matrix as a function of tool position;
finding at least one of vertical resistivity and anisotropy as a function of tool position from the coupling matrix components; and
storing said vertical resistivity or anisotropy in the form of a log.
2. The method of claim 1, wherein said at least one of a phase and amplitude measurement is at least one of a phase difference between responses of the receiver antennas and an amplitude ratio between responses of the receiver antennas.
3. The method of claim 1, further comprising: averaging measurements in a plurality of bins associated with different azimuthal angles.
4. The method of claim 1, wherein said determining is performed based on a linear system of equations that express a dependence of each receiver’s response on azimuthal angle.
5. The method of claim 1, further comprising geosteering based at least in part on said vertical resistivity or anisotropy as a function of tool position.
6. The method of claim 1, further comprising detecting a bed boundary based at least in part on said vertical resistivity or anisotropy as a function of tool position.
7. The method of claim 1, wherein said determining, finding, and storing are performed by a downhole processor.
8. The method of claim 1, wherein said determining, finding, and storing are performed by a surface computing facility.
9. An electromagnetic resistivity logging tool that comprises:
a rotational position sensor;
a set of receiver antennas, wherein the set of receiver antennas includes at least one receiver antenna in a first receiver orientation and at least one receiver antenna in a second receiver orientation that is different than the first receiver orientation;
a set of transmitter antennas, wherein the set of transmitter antennas includes at least one transmitter antenna in a first transmitter orientation and at least one transmitter antenna in a second transmitter orientation that is different than the first transmitter orientation;
a processor to receive at least one of a phase and amplitude measurement for each receiver antenna in the set of receiver antennas in response to signals from transmitter antennas with no more than two orientations for each of a plurality of azimuthal angles and to calculate at least one component of a coupling matrix using only receiver antennas having the first and second receiver antenna orientations.
10. The system of claim 9, wherein the processor finds at least one of vertical resistivity and anisotropy as a function of tool position from coupling matrix components including the at least one component.
11. The system of claim 9, wherein the processor causes said vertical resistivity or anisotropy to be stored in the form of a log.
12. The system of claim 9, wherein said at least one of a phase and amplitude measurement is at least one of a phase difference between responses of the set of receiver antennas and an amplitude ratio between responses of the set of receiver antennas.
13. The system of claim 9, wherein the processor averages measurements in a plurality of bins associated with different azimuthal angles.
14. The system of claim 9, wherein the processor calculates the at least one component of a coupling matrix based on a linear system of equations that express a dependence of each receiver’s response on azimuthal angle.
15. The system of claim 9, wherein the processor determines a geosteering signal based at least in part on the at least one component of the coupling matrix.
16. The system of claim 10, wherein the processor determines a bed boundary based at least in part on said vertical resistivity or anisotropy as a function of tool position.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An integrated circuit packaging system comprising:
forming a substrate including;
patterning a bonding pad on the substrate,
patterning a first signal trace coupled to the bonding pad,
patterning a second signal trace on the substrate, and
connecting a pedestal on the second signal trace;

mounting an integrated circuit on the substrate; and
coupling an electrical interconnect between the integrated circuit, the bonding pad, the pedestal, or a combination thereof.
2. The system as claimed in claim 1 wherein connecting a pedestal includes:
forming a ball bond on the second signal trace; and
coining the ball bond for creating a flat surface.
3. The system as claimed in claim 1 further comprising forming a staggered second row of the bonding pads for connecting the integrated circuit.
4. The system as claimed in claim 1 wherein forming the substrate includes:
forming the first signal trace on the substrate;
forming the second signal trace adjacent to the first signal trace;
mounting the pedestal on the second signal trace; and
positioning the bonding pad, coupled to the first signal trace, in line with the pedestal.
5. The system as claimed in claim 1 further comprising forming an integrated circuit package by encapsulating the substrate, the integrated circuit, and the electrical interconnect.
6. An integrated circuit packaging system comprising:
forming a substrate including;
patterning a bonding pad on the substrate by applying a foil,
patterning a first signal trace coupled to the bonding pad by plating the first signal trace,
patterning a second signal trace on the substrate adjacent to the first signal trace, and
connecting a pedestal on the second signal trace having a staggered position from the bonding pad;

mounting an integrated circuit on the substrate includes mounting an integrated circuit having a fine pitch array of the contact pads; and
coupling an electrical interconnect between the integrated circuit, the bonding pad, the pedestal, or a combination thereof.
7. The system as claimed in claim 6 wherein connecting a pedestal includes:
forming a ball bond on the second signal trace includes positioning the ball bond in a staggered array; and
coining the ball bond for creating a flat surface.
8. The system as claimed in claim 6 further comprising forming a staggered second row of the bonding pad for connecting the integrated circuit including positioning the staggered second row in the gaps of a first row.
9. The system as claimed in claim 6 wherein forming the substrate includes:
forming the first signal trace on the substrate;
forming the second signal trace adjacent to the first signal trace;
mounting the pedestal on the second signal trace; and
positioning the bonding pad, coupled to the first signal trace, in line with the pedestal including coupling an electrical interconnect having a vertical clearance form the bonding pad.
10. The system as claimed in claim 6 further comprising forming an integrated circuit package by encapsulating the substrate, the integrated circuit, and the electrical interconnect including assembling a printed circuit board with the integrated circuit package.
11. An integrated circuit packaging system comprising:
a substrate including;
a bonding pad on the substrate,
a first signal trace coupled to the bonding pad,
a second signal trace on the substrate, and
a pedestal on the second signal trace;

an integrated circuit mounted on the substrate; and
an electrical interconnect coupled between the integrated circuit, the bonding pad, the pedestal, or a combination thereof.
12. The system as claimed in claim 11 wherein the pedestal connected includes:
a ball bond on the second signal trace; and
the ball bond coined for creating a flat surface.
13. The system as claimed in claim 11 further comprising a staggered second row of the bonding pad for connecting the integrated circuit.
14. The system as claimed in claim 11 wherein the substrate includes:
the first signal trace on the substrate;
the second signal trace adjacent to the first signal trace;
the pedestal mounted on the second signal trace; and
the bonding pad, coupled to the first signal trace, in line with the pedestal.
15. The system as claimed in claim 11 further comprising an integrated circuit package formed by the substrate, the integrated circuit, and the electrical interconnect encapsulated.
16. The system as claimed in claim 11 wherein:
the substrate includes;
the bonding pad formed of a thin foil,
the first signal trace, coupled to the bonding pad, plated,
the second signal trace on the substrate adjacent to the first signal trace, and
the pedestal on the second signal trace having a staggered position from the bonding pad;

the integrated circuit mounted on the substrate includes the integrated circuit having a fine pitch array of the contact pad; and
the electrical interconnect coupled between the integrated circuit, the bonding pad, the pedestal, or a combination thereof.
17. The system as claimed in claim 16 wherein the pedestal includes:
a ball bond on the second signal trace includes the ball bond positioned in a staggered array; and
the ball bond coined for creating a flat surface.
18. The system as claimed in claim 16 further comprising a staggered second row of the bonding pad for connecting the integrated circuit includes the staggered second row positioned in the gaps of the first row.
19. The system as claimed in claim 16 wherein the substrate includes:
the first signal trace on the substrate;
the second signal trace adjacent to the first signal trace;
the pedestal on the second signal trace; and
the bonding pad, coupled to the first signal trace, positioned in line with the pedestal includes an electrical interconnect having a vertical clearance form the bonding pad.
20. The system as claimed in claim 16 further comprising an integrated circuit package formed by the substrate, the integrated circuit, and the electrical interconnect encapsulated includes a printed circuit board assembled with the integrated circuit package.

What is claimed and desired to be secured by letters patent of the United States is:

1. An antenna, comprising:
a substrate;
at least two dipole elements disposed on a first surface of the substrate;
a feed structure disposed on the first surface of the substrate and connected to said at least two dipole elements;
at least two additional conductive strips disposed on the first surface of the substrate, each additional conductive strip corresponding to a respective one of the dipole elements and coupled to the corresponding dipole element by an LC trap;
a radiator element disposed on a second side of the substrate; and
a separate conductive strip disposed on the second side of the substrate and coupled to the radiator element by an LC trap.
2. The antenna according to claim 1, wherein the dipole elements and additional conductive strips are symmetrically arranged about the feed structure.
3. The antenna according to claim 1, wherein at least one of the LC traps comprise only an inductor, said inductor having a parasitic capacitance sufficient to create an LC trap.
4. The antenna according to claim 1, wherein each of the LC traps comprise only an inductor having a parasitic capacitance sufficient to create an LC trap.
5. The antenna according to claim 1, wherein said LC trap operates such that the feed structure and radiator element operate alone as an antenna when a signal at a first frequency is applied to the feed structure and radiator element, and the feed structure and radiator element operate in conjunction with the additional conductive strips and the separate conductive strip when a signal at a second frequency is applied.
6. The antenna according to claim 5, wherein the first frequency is 5.5 GHz and the second frequency is 2.4 GHz.
7. The antenna according to claim 1, wherein:
each LC trap comprises a spiral pattern, having an end point and a center point, printed on a side of the substrate;
in the case of a dipole element, the LC traps are connected at one of the end point and center point to the dipole element and connected at the other of the end point and center point to the corresponding conductive strip; and
in the case of the radiator element, the LC trap is connected by one of the end point and center point to the radiator element and connected to the other of the end point and center point to the separate conductive strip.
8. The antenna according to claim 1, wherein at least one of the LC traps comprises a spiral pattern printed on a side of the substrate.
9. The antenna according to claim 8, wherein the spiral pattern is a Manhattan spiral pattern.
10. The antenna according to claim 8, wherein the spiral pattern is a decreasing radius circular pattern.
11. The antenna according to claim 8, wherein:
at least one of the dipole elements is disposed on a side of the substrate opposite to a side on which the dipole elements’ corresponding additional conductive strips are disposed; and
at least one of the LC traps between the dipole elements with corresponding conductive strips on opposite sides of the substrate include a single connection between the sides of the substrate.
12. The antenna according to claim 11, wherein each single connection of the LC traps comprises a via between the sides of the substrate.
13. The antenna according to claim 11, wherein each single connection for each dipole elementadditional conductive strip element is constructed using via in the substrate.
14. An antenna device, comprising:
a substrate having an antenna disposed thereon, the antenna including,
a first antenna element disposed on the substrate,
a second antenna element disposed on the substrate, and
an LC trap coupling the first antenna element and the second antenna element;
wherein:
the LC Trap comprises,
a conductive strip disposed on a surf ace of the substrate in a spiral pattern,
an end of the spiral pattern connected to one of the first and second antenna elements, and a center of the spiral pattern connected to the other of the first and second antenna elements,
a first capacitive plate connected to the first antenna element and disposed on a side of the substrate, and
a second capacitive plate connected to the second antenna element and disposed at a location substantially opposing the first conductive plate on a side of the substrate opposite the side which the first capacitive plate is disposed.
15. The antenna device according to claim 14, wherein the first and second antenna element are disposed on opposite sides of the substrate.
16. The antenna device according to claim 15, wherein the LC Trap is constructed using a single connection between the sides of the substrate.
17. The antenna device according to claim 16, wherein the single connection includes a via between the sides of the substrate.
18. The antenna according to claim 14, wherein the first and second antenna elements comprise an antenna element pair, and the antenna device includes more than one antenna element pairs.
19. The antenna according to claim 14, wherein the first and second antenna elements are dipole antenna elements.
20. The antenna device according to claim 14, wherein the first antenna element is a 5.5 GHz antenna element.
21. The antenna according to claim 14, wherein the second antenna element in combination with the first antenna element comprises a 2.4 GHz antenna element.
22. An antenna device, comprising:
a substrate having an antenna disposed thereon, the antenna including,
a first frequency antenna element disposed on a first side of the substrate,
a second frequency antenna element disposed on a second side of the substrate, and
an LC trap coupling the first frequency antenna element and the second frequency antenna element;
wherein:
the LC Trap comprises conductive parts printed on the first and second sides of the substrate and including a single electrical connection between the first and second sides of the substrate.
23. The antenna device according to claim 22, wherein the conductive parts include a conductive strip disposed in a spiral pattern,
an end of the spiral pattern connected to one of the first and second frequency antenna elements, and a center of the spiral pattern connected to the other of the first and second frequency antenna elements,
a first capacitive plate connected to the first antenna element and disposed on a side of the substrate, and
a second capacitive plate connected to the second antenna element and disposed at a location substantially opposing the first conductive plate on a side of the substrate opposite the side which the first capacitive plate is disposed.
24. An antenna device, comprising:
a substrate having an antenna disposed thereon, the antenna including,
a first antenna element disposed on the substrate,
a second antenna element disposed on the substrate, and
an LC trap coupling the first antenna element and the second antenna element;
wherein:
the LC Trap comprises,
an inductor component having an inductance and a capacitance sufficient to implement the LC trap such that the first antenna element radiates electrical energy efficiently at a first frequency and the first and second antenna elements radiate electrical energy efficiently at a second frequency.
25. The antenna device according to claim 24, wherein the first frequency is the 5.5 GHz RF band and the second frequency is the 2.4 GHz RF band.
26. The antenna according to claim 24, wherein:
the first antenna element, second antenna element, and LC trap comprise a first half dipole;
the antenna device further comprising multiple dipoles;
each dipole having first and second halves constructed similar to the first half dipole, and
the antenna elements of the first half of each dipole half are disposed on opposite sides of the substrate compared to the antenna elements of the second half of the same dipole.
27. The antenna device according to claim 26, further comprising:
a first feed line disposed on a first side of the substrate and coupled to dipole halves on the first side of the substrate;
a second feed line disposed on a second side of the substrate and coupled to dipole halves on the second side of the substrate;
wherein the dipoles are arranged in pairs symmetrically opposed around the feed lines.
28. The antenna device according to claim 27, wherein each set of dipole halves coupled to a same feed line and symmetrically opposed around the same feed line are in situated in series with a second set of dipole halves also coupled to and symmetrically opposed around the same feed line.
29. The antenna device according to claim 28, wherein each set of dipole halves are connected by a feed point to the feed line to which they are coupled.
30. The antenna device according to claim 27, wherein each set of dipole halves coupled to a same feed line and symmetrically opposed around the same feed line are situated in parallel with a second set of dipole halves also coupled to and symmetrically opposed around the same feed line.
31. The antenna device according to claim 30, wherein each set of dipole halves are connected by equal length feed lines to a common feed point connected to the feed line to which they are coupled.
a second feed line disposed on a second side of the substrate;
32. An antenna, comprising:
a substrate;
at least two antenna elements disposed on the substrate, each antenna element comprising a first frequency sub-element coupled by an LC trap to a second frequency sub-element;
wherein:
each second frequency sub-element is disposed on a side of the substrate opposite to a side of the substrate on which the first frequency sub-element is disposed; and
each LC trap is constructed using a single connection between the sides of the substrate.
33. The antenna element according to claim 32, wherein the single connection between the sides of the substrate is a via.
34. The antenna according to claim 32, wherein each LC trap comprises a single inductor having a parasitic capacitance sufficient to implement the LC trap.
35. The antenna according to claim 32, wherein each LC trap comprises only printed components.
36. The antenna according to claim 32, wherein the LC trap comprises only conductive strips disposed on the substrate.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. A method of operating an electrochemical cell system, comprising:
flowing supply water to an anode electrode of an electrolysis cell;
applying a first current density to the electrolysis cell;
electrolyzing the supply water at the anode electrode wherein hydrogen ions and a first portion water migrate to a cathode electrode of the electrolysis cell;
collecting the first portion of water in a chamber in fluid communication with the cathode electrode;
monitoring a first portion water level in the chamber;
when the first portion water level attains a first selected level, decreasing the supply water flow to the anode electrode a sufficient amount to draw the first portion water from the chamber to the anode electrode; and
electrolyzing the first portion water.
2. The method of claim 1, further comprising increasing the supply water flow to the anode electrode when the first portion water level decreases to a second selected level.
3. The method of claim 2, further comprising decreasing a current density applied to the electrolysis cell when the first portion water level attains the first selected level.
4. The method of claim 3, further comprising decreasing the current density until a hydraulic flux plus a back diffusion are greater than or equal to an electro-osmotic flux plus water electrolysis.
5. The method of claim 1, further comprising decreasing a current density applied to the electrolysis cell when the first portion water level attains the first selected level.
6. The method of claim 5, further comprising decreasing the current density until a hydraulic flux plus a back diffusion are greater than or equal to an electro-osmotic flux plus water electrolysis.
7. The method of claim 1, further comprising ceasing the supply water flow when the first portion water level attains the first selected level.
8. The method of claim 1, wherein flowing the supply water to the anode electrode is solely with gravity water feed.
9. An electrolysis system, comprising:
an electrolysis cell comprising a fluid accumulation chamber disposed in fluid communication with a cathode side of the electrolysis cell;
a gravity feed water source disposed in fluid communication with an anode side of the electrochemical cell;
a control valve disposed upstream of the electrolysis cell and downstream of the water source; and
a level sensing unit disposed in the fluid accumulation chamber, wherein the level sensing unit is in operable communication with a power source and the control valve, and wherein the power source is in operable communication with the electrolysis cell.
10. The electrolysis system of claim 9, wherein all pumps and compressors are disposed downstream of the electrolysis cell.