Author: claimsbot

1-6. (canceled)
7. A bandpass filter, comprising: a plurality of resonators connected to each other between an input and an output of the filter, and at least two main signal paths leading from the input to the output, the at least two main signal paths having overlapping passbands and being connected via different ones of the resonators to the input and the output.
8. The bandpass filter according to claim 7, in that the two main signal paths have no common resonators.
9. The bandpass filter according to claim 7, in that the at least two main signal paths have overall coupling coefficients with different signs.
10. The bandpass filter according to claim 7, in that at least one cavity resonator is under the resonators.
11. The bandpass filter according to claim 7, in that at least one conduction resonator is under the resonators.
12. The bandpass filter according to claim 7, in that at least one stripline resonator is under the resonators.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for manufacturing a semiconductor device having recess channels and asymmetrical junctions, the method comprising:
(a) providing a semiconductor substrate comprising laterally located regions for storage node junctions, and a bit line junction, and channel regions disposed laterally between the storage node junctions and the bit line junction;
(b) first implanting p-type ions into the region of the bit line junction and the channel regions to form an impurity region having a depth, and two side parts by using a mask film pattern having a width of one to three times of a feature size;
(c) forming recess channel trenches in the substrate by etching the channel regions to a designated depth, the depth of the recess channel trenches being greater than the depth of the impurity region, so that the recess channel trenches cut out both side parts of the impurity region to confine a width of the impurity region to a reduced width region between the trenches;
(d) forming gate stacks filling the recess channel trenches; and
(e) second implanting n-type ions into the confined impurity region and the regions of the storage node junctions by using the gate stacks as an implanting mask, to form asymmetric junctions such that the bit line junction is formed as a more shallow junction than the storage node junctions due to the confined impurity region.
2. The method according to claim 1, wherein the impurity region has a depth of 50 angstroms (\u212b) to 2,500 \u212b from the surface of the semiconductor substrate.
3. The method according to claim 1, wherein the recess channel trenches have a depth of 50 \u212b to 2,500 \u212b from the surface of the semiconductor substrate.
4. The method according to claim 1, wherein the p-type impurity ions are ones selected from the group consisting of B ions, BF2 ions, and I ions.
5. The method according to claim 1, wherein the width of a mask film pattern for forming the impurity region is in a range of one to three times of the width of a gate mask film pattern forming gates.
6. The method according to claim 1, wherein the n-type impurity ions are selected from the group consisting of P ions and As ions.
7. The method according to claim 1, wherein the n-type impurity ions are implanted such that the n-type impurity ions are disposed on the surface of the impurity region.
8. A method for manufacturing a semiconductor device having recess channels and asymmetrical junctions, the method comprising:
(a) providing a semiconductor substrate comprising laterally located regions for storage node junctions and a bit line junction, and channel regions disposed laterally between the storage node junctions and the bit line junction;
(b) first implanting p-type ions into the region of the bit line junction and the channel regions to form an impurity region;
(c) forming recess channel trenches in the substrate by etching the channel regions to a designated depth so that the recess channel trenches cut out both side parts of the impurity region to confine a width of the impurity region to a reduced width region between the trenches,
(d) forming gate stacks filling the recess channel trenches; and
(e) second implanting n-type ions into the confined impurity region and the regions of the storage node to form junctions to form asymmetric junctions such that the bit line junction is formed as a more shallow junction than the storage node junctions due to the confined impurity region.
9. The method according to claim 8, wherein the impurity region has a depth of 50 angstroms (\u212b) to 2,500 \u212b from the surface of the semiconductor substrate.
10. The method according to claim 8, wherein the recess channel trenches have a depth of 50 \u212b to 2,500 \u212b from the surface of the semiconductor substrate.
11. The method according to claim 8, wherein the p-type impurity ions are ones selected from the group consisting of B ions, BF2 ions, and I ions.
12. The method according to claim 8, wherein the width of a mask film pattern for forming the impurity region is in a range of one to three times of the width of a gate mask film pattern forming gates.
13. The method according to claim 8, wherein the n-type impurity ions are selected from the group consisting of P ions and As ions.
14. The method according to claim 8, wherein the n-type impurity ions are implanted such that the n-type impurity ions are disposed on the surface of the impurity region.

1. A rivet tool capable of measuring size of blind rivet, comprising:
a body having:
multiple rivet body measuring holes formed therein, each rivet body measuring hole having a diameter being different from those of other rivet body measuring holes and adapted to match a rivet body of a corresponding blind rivet by inserting the rivet body of the blind rivet into the rivet body measuring holes to match a corresponding rivet body measuring hole;
a text associated with a diameter of the rivet body of a matching blind rivet marked beside each rivet body measuring hole; and
a drawing of rivet body of blind rivet with a diameter symbol marked beside the rivet body measuring holes for indicating that the rivet body measuring holes are adapted to measure and match the rivet bodies of the corresponding blind rivets; and

multiple nosepieces interchangeably mounted on the body, each nosepiece having an insertion hole being different from those of other nosepieces in diameter and adapted to receive a rivet mandrel of a corresponding blind rivet with the rivet body matching a corresponding rivet body measuring hole.
2. The rivet tool as claimed in claim 1, wherein the body has:
a fixed handle having a first end;
an actuation handle having:
a first end pivotally connected with the first end of the fixed handle;
multiple rivet body measuring holes formed through an outer wall of the actuation handle; and
the texts associated with the diameters of the rivet bodies of the corresponding blind rivets and the drawing of rivet body with the diameter symbol marked on the outer wall of the actuation handle; and

a rivet mandrel pulling unit movably connected with the first end of the actuation handle.
3. The rivet tool as claimed in claim 2, wherein the fixed handle has multiple nosepiece fixing holes with a same internal thread size formed through an outer wall of the fixed handle, and the nosepieces are interchangeably mounted in the rivet mandrel pulling unit and the nosepiece fixing holes.
4. The rivet tool as claimed in claim 1, wherein the body further has:
a base having the rivet body measuring holes formed through a bottom of the base;
a pressure tank mounted on a top of the base and having:
a connection portion formed on and protruding upwardly from a top of the pressure tank; and
an activation switch mounted on the connection portion; and

a rivet mandrel hydraulic pulling unit connected with the connection portion and communicating with the pressure tank through the connection portion.
5. The rivet tool as claimed in claim 4, wherein the texts associated with specifications of rivet bodies and the drawing of rivet body of blind rivet with the diameter symbol are marked beside the corresponding rivet body measuring holes on the bottom of the base.
6. The rivet tool as claimed in claim 5, wherein
a flange is formed on and protrudes from an edge on the bottom of the base;
multiple nosepiece fixing holes with a same internal thread size are formed through the bottom of the base and the nosepieces are interchangeably mounted in the rivet mandrel hydraulic pulling unit and the nosepiece fixing holes.
7. The rivet tool as claimed in claim 1, wherein the body further has:
a battery base;
a hand grip erectly formed on a top of the battery base and having:
an activation switch mounted thereon; and
the multiple rivet body measuring holes formed through one side of the hand grip; and

a rivet mandrel pulling unit connected with the hand grip and electrically connected with the activation switch.
8. The rivet tool as claimed in claim 7, wherein the texts associated with specifications of rivet bodies and the drawing of rivet body of blind rivet with the diameter symbol are marked beside the corresponding rivet body measuring holes on the side of the hand grip.
9. The rivet tool as claimed in claim 8, wherein the battery base has:
a flange formed on and protruding downwardly from a bottom of the battery base; and
multiple nosepiece fixing holes with a same internal thread size formed through the bottom of the battery base for the nosepieces to be interchangeably mounted in the rivet mandrel pulling unit and the nosepiece fixing holes.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A diagnosis control method of an air conditioner comprising:
receiving a test run command or a self-diagnosis command for diagnosis of the air conditioner;
performing a first test run to diagnose an assembly state of the air conditioner;
performing a second test run to diagnose pipe connection of the air conditioner and an amount of refrigerant in the air conditioner;
performing a determination including diagnosing a state of the air conditioner based on operation results of the first test run and the second test run and displaying the diagnosis result through a display device provided at an indoor unit of the air conditioner.
2. The diagnosis control method according to claim 1, wherein the performing the first test run comprises diagnosing a communication state and a component assembly state of the air conditioner.
3. The diagnosis control method according to claim 1, wherein the performing the second test run comprises determining a high-pressure clogging error and a refrigerant shortage error of the air conditioner.
4. The diagnosis control method according to claim 3, wherein the performing the second test run further comprises determining, if a difference (Teva_in)\u2212(Teva_in+1) between an inlet temperature (Teva_in) of an indoor heat exchanger of an indoor unit before a compressor of an outdoor unit is operated and an inlet temperature (Teva_in+1) of the indoor heat exchanger of the indoor unit after the compressor of the outdoor unit is operated is less than a predetermined reference value, that a pipe connection error has occurred between the outdoor unit and the indoor unit.
5. The diagnosis control method according to claim 4, further comprising determining, if the difference (Teva_in)\u2212(Teva_in+1) between the inlet temperature (Teva_in) of the indoor heat exchanger before the compressor is operated and an inlet temperature (Teva_in+1) of the indoor heat exchanger after the compressor is operated is equal to or greater than the predetermined reference value and a difference (Teva_out)\u2212(Teva_in) between the inlet temperature (Teva_in) and an outlet temperature (Teva_out) of the indoor heat exchanger is greater than a reference degree of superheat, that the refrigerant shortage error has occurred.
6. The diagnosis control method according to claim 3, wherein the performing the second test run further comprises determining, if a difference (Tair_in)\u2212(Teva_in) between an indoor air temperature (Tair_in) and an inlet temperature (Teva_in) of an indoor heat exchanger is equal to or less than a predetermined reference value (Ka) and a difference (Tair_in)\u2212(Teva_out) between the indoor air temperature (Tair_in) and an outlet temperature (Teva_out) of the indoor heat exchanger is equal to or less than another predetermined reference value (Kb), that the high-pressure clogging error has occurred in an outdoor unit.
7. The diagnosis control method according to claim 6, wherein conditions to determine the refrigerant shortage error in the second test run comprise:
a first determination condition to determine, if the inlet temperature (Teva_in) of the indoor heat exchanger is equal to or less than a predetermined reference evaporation temperature (\u03b3), that the refrigerant shortage error has occurred;
a second determination condition to determine, if a difference (Teva_mid)\u2212(Teva_in) between a middle temperature (Teva_mid) of the indoor heat exchanger and the inlet temperature (Teva_in) of the indoor heat exchanger is equal to or greater than a predetermined reference degree of evaporator superheat (\u03b4), that the refrigerant shortage error has occurred; and
a third determination condition to determine, if a difference (Tdis)\u2212(Tcond) between a discharge temperature (Tdis) of a compressor and an outlet temperature (Tcond) of an outdoor heat exchanger is equal to or greater than a predetermined degree of discharged superheat (\u03b5), that the refrigerant shortage error has occurred.
8. The diagnosis control method according to claim 7, further comprising detecting, if an operation time of the compressor exceeds a predetermined time, the indoor air temperature (Tair_in), an outdoor air temperature (Tair_out), the inlet temperature (Teva_in) of the indoor heat exchanger, the middle temperature (Teva_mid) of the indoor heat exchanger, the outlet temperature (Tcond) of the outdoor heat exchanger, and the discharge temperature (Tdis) of the compressor.
9. The diagnosis control method according to claim 8, further comprising determining, if at least two of the first, second, and third determination conditions are satisfied, that the refrigerant shortage error has occurred.
10. The diagnosis control method according to claim 9, wherein the predetermined reference evaporation temperature (\u03b3) of the first determination condition is a value defined by \u03b3=(Tair_out\u221235)\xd70.01\xd7C1+(Tair_in\u221227)\xd70.01\xd7C2+C3, where Tair_out is an outdoor air temperature, Tair_in is an indoor air temperature, and C1, C2, and C3 are constants.
11. The diagnosis control method according to claim 3, further comprising changing an operation frequency of a compressor so as to correspond to the number of indoor units test running during operation of the compressor.
12. The diagnosis control method according to claim 1, further comprising displaying progress of the first test run and the second test run through the display device.
13. The diagnosis control method according to claim 12, further comprising displaying progress of the first test run and the second test run as a percentage.
14. The diagnosis control method according to claim 12, further comprising announcing progress and completion time of the first test run and the second test run using a voice.
15. The diagnosis control method according to claim 12, further comprising dividing the first test run and the second test run into a plurality of processes and displaying progress of the first test run and the second test run using one of the processes.
16. The diagnosis control method according to claim 12, wherein
the display device comprises a plurality of light emitting devices, and
the diagnosis control method further comprises displaying progress of the first test run and the second test run by turning on the light emitting devices.
17. The diagnosis control method according to claim 12, further comprising displaying, in a self-diagnosis mode performed by the self-diagnosis command, a message indicating the self-diagnosis result through the display device.
18. The diagnosis control method according to claim 1, wherein the performing the first test run comprises operating an indoor fan provided in an indoor unit of the air conditioner to saturate a temperature detector provided in the indoor unit.
19. The diagnosis control method according to claim 1, further comprising preventing a locked state of the air conditioner from being released such that the operation of the air conditioner is restricted in a case in which test run of the air conditioner has not been performed.
20. The diagnosis control method according to claim 19, further comprising resuming the test run if an error occurs during test run of the air conditioner and preventing the locked state of the air conditioner from being released such that the use of the air conditioner is restricted if the test run of the air conditioner is not normally completed.
21. The diagnosis control method according to claim 13, further comprising releasing a locked state of the air conditioner even when test run of the air conditioner is not normally completed in a self-diagnosis mode performed by the self-diagnosis command.
22. The diagnosis control method according to claim 1, further comprising transmitting settinginstallation information to a remote server through a network module to store the settinginstallation information in a database if a test run mode performed by the test run command or a self-diagnosis mode performed by the self-diagnosis command is completed.
23. The diagnosis control method according to claim 22, further comprising providing, if occurrence of an error is detected in the test run mode or the self-diagnosis mode, a method of resolving the error of the air conditioner and component information necessary to resolve the error through a mobile terminal to provide guidelines to resolve the error.
24. The diagnosis control method according to claim 22, further comprising allowing a user to have thorough knowledge of the component information necessary to resolve the error though provision of the component information when the error occurs.