Author: claimsbot

1. A method of covering a pot, floral grouping or a growing medium, comprising the steps of:
providing a preformed sleeve comprising:
a base portion having an upper end, a closed lower end, an outer peripheral surface, an inner peripheral surface, and an interior space when opened,
a skirt portion extending from the upper end of the base portion, and
a heat shrinkable element comprising a band disposed on a portion of the outer peripheral surface or inner peripheral surface of the base portion for forming a constricted area in a portion of the preformed sleeve;

disposing a pot, floral grouping, or growing medium into the interior space of the base portion; and
applying heat to the heat shrinkable element thereby forming the constricted area in the preformed sleeve thereby securing the preformed sleeve about the pot, floral grouping, or growing medium.
2. The method of claim 1 wherein in the step of providing a preformed sleeve, the shrinkable element is disposed upon the outer peripheral surface of the base portion.
3. The method of claim 1 wherein in the step of providing a preformed sleeve, the shrinkable element is disposed upon the inner peripheral surface of the base portion.
4. The method of claim 1 wherein in the step of providing the preformed sleeve, the preformed sleeve further comprises an upper portion extending from the skirt portion and which is detachable therefrom via a detaching element.
5. The method of claim 4 wherein in the step of providing the preformed sleeve, the detachable upper portion is sized to substantially surround a floral grouping disposed within the pot.
6. The method of claim 1 wherein in the step of providing the preformed sleeve, the preformed sleeve further comprises expansion elements in the base portion.
7. The method of claim 1 wherein in the step of providing a preformed sleeve, the base portion is sized to substantially cover an outer peripheral surface of the pot.
8. The method of claim 1 wherein in the step of providing the preformed sleeve, the lower end of the base portion has a gusset.
9. The method of claim 1 wherein the upper portion is adapted to support the preformed sleeve upon a support assembly.
10. A method of covering a pot, floral grouping or a growing medium, comprising the steps of:
providing a preformed sleeve comprising:
a base portion having an upper end, a lower end, an outer peripheral surface, an inner peripheral surface, and an interior space when opened,
a skirt portion extending from the upper end of the base portion,
an upper portion extending from the skirt portion and detachable therefrom via a detaching element ; and
a heat shrinkable element comprising a band disposed upon a portion of the outer peripheral surface or inner peripheral surface of the base portion for forming a constricted area in a portion of the preformed sleeve;

disposing a pot, floral grouping, or growing medium into the interior space of the base portion; and
applying heat to the heat shrinkable element thereby forming the constricted area in the preformed sleeve thereby securing the preformed sleeve about the pot, floral grouping, or growing medium.
11. The method of claim 10 wherein in the step of providing a preformed sleeve, the shrinkable element is disposed upon the outer peripheral surface of the base portion.
12. The method of claim 10 wherein in the step of providing a preformed sleeve, the shrinkable element is disposed upon the inner peripheral surface of the base portion.
13. The method of claim 10 wherein in the step of providing the preformed sleeve, the detachable upper portion is sized to substantially surround a floral grouping disposed within the pot.
14. The method of claim 10 wherein the upper portion is adapted to support the preformed sleeve upon a support assembly.
15. The method of claim 10 wherein in the step of providing the preformed sleeve, the preformed sleeve further comprises expansion elements in the base portion.
16. The method of claim 10 wherein in the step of providing a preformed sleeve, the base portion is sized to substantially cover an outer peripheral surface of the pot.
17. The method of claim 10 wherein in the step of providing the preformed sleeve, the lower end of the base portion has a gusset.
18. A method of covering a pot, floral grouping or a growing medium, comprising the steps of:
providing a preformed sleeve comprising:
a base portion having an upper end, a closed lower end, an outer peripheral surface, an inner peripheral surface, and an interior space when opened,
a skirt portion extending from the upper end of the base portion, and a shrinkable element comprising a band disposed on a portion of the outer peripheral surface or inner peripheral surface of the preformed sleeve for forming a constricted area in a portion of the preformed sleeve;

disposing a pot, floral grouping, or growing medium into the interior space of the base portion; and
shrinking the shrinkable element thereby forming the constricted area in the preformed sleeve thereby securing the preformed sleeve about the pot, floral grouping, or growing medium.
19. The method of claim 18 wherein in the step of providing a preformed sleeve, the shrinkable element is disposed upon the outer peripheral surface of the base portion.
20. The method of claim 18 wherein in the step of providing a preformed sleeve, the shrinkable element is disposed upon the inner peripheral surface of the base portion.
21. The method of claim 18 wherein in the step of providing the preformed sleeve, the preformed sleeve further comprises an upper portion extending from the skirt portion and which is detachable therefrom via a detaching element.
22. The method of claim 21 wherein in the step of providing the preformed sleeve, the detachable upper portion is sized to substantially surround a floral grouping disposed within the pot.
23. The method of claim 18 wherein in the step of providing the preformed sleeve, the preformed sleeve further comprises expansion elements in the base portion.
24. The method of claim 18 wherein in the step of providing a preformed sleeve, the base portion is sized to substantially cover an outer peripheral surface of the pot.
25. The method of claim 18 wherein in the step of providing the preformed sleeve, the lower end of the base portion has a gusset.
26. The method of claim 18 wherein the upper portion is adapted to support the preformed sleeve upon a support assembly.
27. A method of covering a pot, floral grouping or a growing medium, comprising the steps of:
providing a preformed sleeve comprising:
a base portion having an upper end, a lower end, an outer peripheral surface, an inner peripheral surface, and an interior space when opened,
a skirt portion extending from the upper end of the base portion,
an upper portion extending from the skirt portion and detachable therefrom via a detaching element ; and
a shrinkable element comprising a band disposed upon a portion of the outer peripheral surface or inner peripheral surface of the preformed sleeve for forming a constricted area in a portion of the preformed sleeve;

disposing a pot, floral grouping, or growing medium into the interior space of the base portion; and
shrinking the shrinkable element thereby forming the constricted area in the preformed sleeve thereby securing the preformed sleeve about the pot, floral grouping, or growing medium.
28. The method of claim 27 wherein in the step of providing a preformed sleeve, the shrinkable element is disposed upon the outer peripheral surface of the base portion.
29. The method of claim 27 wherein in the step of providing a preformed sleeve, the shrinkable element is disposed upon the inner peripheral surface of the base portion.
30. The method of claim 27 wherein in the step of providing the preformed sleeve, the detachable upper portion is sized to substantially surround a floral grouping disposed within the pot.
31. The method of claim 27 wherein the upper portion is adapted to support the preformed sleeve upon a support assembly.
32. The method of claim 27 wherein in the step of providing the preformed sleeve, the preformed sleeve further comprises expansion elements in the base portion.
33. The method of claim 27 wherein in the step of providing a preformed sleeve, the base portion is sized to substantially cover an outer peripheral surface of the pot.
34. The method of claim 27 wherein in the step of providing the preformed sleeve, the lower end of the base portion has a gusset.
35. A method of forming a cover about a potted plant comprising a pot and a floral grouping, the method comprising:
providing a preformed sleeve, the preformed sleeve comprising a base portion having an upper end, a closed lower end, an outer peripheral surface, an inner peripheral surface, and an interior space when opened;
disposing the potted plant into the interior space of the preformed sleeve; and
shrinking at least a portion of the preformed sleeve about the potted plant thereby securing the preformed sleeve about the potted plant.
36. The method of claim 35 wherein in the step of providing a preformed sleeve, the preformed sleeve further comprises a skirt portion extending from the base portion.
37. The method of claim 36 wherein in the step of shrinking, at least a portion of the skirt portion is shrunk by heat from a heat source.
38. A method of forming a cover about a potted plant comprising a pot and a floral grouping, the method comprising:
providing a preformed sleeve, the preformed sleeve comprising a base portion having an upper end, a closed lower end, an outer peripheral surface, an inner peripheral surface, and an interior space when opened, and an upper portion detachable via a detaching element;
disposing the potted plant into the interior space of the preformed sleeve; and
shrinking at least a portion of the base portion of the preformed sleeve about the potted plant thereby securing the preformed sleeve about the potted plant.
39. The method of claim 38 wherein in the step of providing a preformed sleeve, the preformed sleeve further comprises a skirt portion extending from the base portion.
40. The method of claim 39 wherein in the step of shrinking, at least a portion of the skirt portion is shrunk by heat from a heat source.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A multi-chip module (MCM), comprising:
a first substrate having a first surface, wherein the first substrate includes:
a first optical waveguide disposed on the first surface; and
a first optical coupler, optically coupled to the first optical waveguide, having a first vertical facet, wherein the first optical coupler has a first optical mode that is different than a second optical mode associated with the first optical waveguide; and

a second substrate having a second surface facing the first surface of the first substrate, wherein the second substrate includes:
a second optical waveguide disposed on the second surface; and
a second optical coupler, optically coupled to the second optical waveguide, having a second vertical facet, wherein the second optical coupler has a third optical mode that is different than a fourth optical mode associated with the second optical waveguide;
wherein the second vertical facet is horizontally displaced relative to and faces the first vertical facet, thereby facilitating direct optical coupling of an optical signal from the first vertical facet to the second vertical facet.
2. The MCM of claim 1, wherein the first optical mode has a larger spatial extent than the second optical mode; and
wherein the third optical mode has a larger spatial extent than the fourth optical mode.
3. The MCM of claim 1, wherein the first vertical facet and the second vertical facet define a cavity; and
wherein the cavity is filled with air.
4. The MCM of claim 1, wherein the first vertical facet and the second vertical facet define a cavity; and
wherein the cavity is filled with an index-matching material that has an index of refraction between an index of refraction of the first optical coupler and the second optical coupler and an index of refraction of air.
5. The MCM of claim 1, wherein the first optical coupler includes a taper that expands a cross-sectional area of the first optical waveguide proximate to the first vertical facet; and
wherein the second optical coupler includes another taper that expands a cross-sectional area of the second optical waveguide proximate to the second vertical facet.
6. The MCM of claim 1, wherein the first substrate includes a first recessed region below the first surface;
wherein the second substrate includes a second recessed region below the second surface; and
wherein the first vertical facet is aligned with the second recessed region and the second vertical facet is aligned with the first recessed region, thereby facilitating vertical alignment of the first vertical facet and the second vertical facet.
7. The MCM of claim 1, wherein the first optical coupler includes a third optical waveguide disposed on the first optical waveguide; and
wherein the second optical coupler includes a fourth optical waveguide disposed on the second optical waveguide.
8. The MCM of claim 7, wherein the first optical waveguide ends before the cavity and the first vertical facet is associated with the third optical waveguide; and
wherein the second optical waveguide ends before the cavity and the second vertical facet is associated with the fourth optical waveguide.
9. The MCM of claim 7, wherein the first vertical facet is associated with the first optical waveguide and the third optical waveguide; and
wherein the second vertical facet is associated with the second optical waveguide and the fourth optical waveguide.
10. The MCM of claim 9, wherein vertical overlap of the first vertical facet and the second vertical facet is associated with the third optical waveguide and the fourth optical waveguide.
11. The MCM of claim 1, wherein the first optical waveguide in the first optical coupler is untapered, and wherein the second optical waveguide in the second optical coupler is untapered.
12. The MCM of claim 1, wherein the first substrate includes first negative features recessed below the first surface;
wherein the second substrate includes second negative features recessed below the second surface; and
wherein the MCM further includes alignment features aligned with and mechanically coupled to pairs of the first negative features and the second negative features, thereby facilitating alignment and maintaining relative positions of the first vertical facet and the second vertical facet.
13. The MCM of claim 1, wherein the first negative features and the second negative features include etch pits.
14. The MCM of claim 1, wherein the alignment features include spherical balls.
15. The MCM of claim 1, wherein at least one of the first negative features and the second negative features includes redundant negative features.
16. The MCM of claim 1, wherein the first substrate and the second substrate include mechanical stops.
17. The MCM of claim 1, wherein a given substrate, which is one of the first substrate and the second substrate, includes:
a buried-oxide layer disposed on the given substrate; and
a semiconductor layer disposed on the buried-oxide layer, wherein a given optical waveguide, which is one of the first optical waveguide and the second optical waveguide, is defined in the semiconductor layer.
18. The MCM of claim 1, wherein a given substrate, which is one of the first substrate and the second substrate, includes a semiconductor.
19. A method for direct optical coupling an optical signal from a first substrate to a second substrate, the method comprising:
transporting the optical signal in a first optical waveguide disposed on a first surface of the first substrate;
optically coupling the optical signal from the first optical waveguide to a first optical coupler having a first vertical facet which is disposed on the first substrate, wherein the first optical coupler has a first optical mode that is different than a second optical mode associated with the first optical waveguide;
direct optical coupling the optical signal from the first vertical facet to a second vertical facet of a second optical coupler disposed on the second substrate, wherein the first vertical facet faces the second vertical facet;
optically coupling the optical signal from the second optical coupler to a second optical waveguide disposed on a second surface of the second substrate, wherein the second surface faces the first surface, and wherein the second optical coupler has a third optical mode that is different than a fourth optical mode associated with the second optical waveguide; and
transporting the optical signal in the second optical waveguide.
20. A method for assembling an MCM, the method comprising:
placing alignment features in first negative features disposed on a first surface of a first substrate; and
mechanically coupling the alignment features to second negative features disposed on a second surface of a second substrate, thereby aligning and maintaining relative positions of a first vertical facet of a first optical coupler on the first substrate and a second vertical facet of a second optical coupler on the second substrate, wherein the first surface faces the second surface; and
wherein the first vertical facet faces the second vertical facet, thereby facilitating direct optical coupling of an optical signal from the first substrate to the second substrate.

1. A device for the simultaneous double-side grinding of workpieces in wafer form, comprising two substantially circular grinding wheels arranged collinearly, the grinding surfaces of which are positioned opposite one another in the axial direction based on the axes of rotation of the grinding wheels, and define a midplane located between the grinding wheels, and two devices, likewise positioned opposite each other, for hydrostatically bearing the workpiece in wafer form, each of which comprise at least one hydrostatic bearing and in each case at least one dynamic pressure tube for measuring the spacing between the workpiece and the device for hydrostatic bearing, wherein that surface of each of the two devices for hydrostatic bearing which faces the workpiece is nonplanar, such that the spacing between the surface and the midplane between the grinding wheels has a minimum value proximate that edge of the device for hydrostatic bearing which faces the grinding wheels, and the spacing increases with increasing distance from the grinding wheels.
2. The device of claim 1, wherein that surface of each of the two devices for hydrostatic bearing which faces the workpiece is conical.
3. The device of claim 1, wherein that surface of each of the two devices for hydrostatic bearing which faces the workpiece is convex.
4. The device of claim 1, wherein that surface of each of the two devices for hydrostatic bearing which faces the workpiece is stepped.
5. The device of claim 1, further comprising at least one bore, through which liquid and any material abraded by grinding can be discharged from the vicinity of the dynamic pressure tube, positioned in the vicinity of each dynamic pressure tube.
6. The device of claim 5, wherein the bore, at the surface of the device for hydrostatic bearing of the workpiece in wafer form, terminated within a groove which surrounds the dynamic pressure tube in the form of a ring.
7. The device of claim 1, wherein that surface of each of the two devices for hydrostatic bearing which faces the workpiece, at its edge adjacent to the grinding wheel, does not have any grooves originating from the edge.
8. A device for the simultaneous double-side grinding of a workpiece in wafer form, comprising two substantially circular grinding wheels with collinearly arranged axes of rotation wherein the grinding surfaces of the grinding wheels are positioned opposite one another in axial direction, based on the axes of rotation, and two devices, likewise positioned opposite each other, for hydrostatically bearing the workpiece in wafer form, which each comprise at least one hydrostatic bearing and in each case at least one dynamic pressure tube for measuring the spacing between the workpiece and the device for hydrostatic bearing, wherein at least one bore, through which liquid and any material abraded by grinding can be discharged from the vicinity of the dynamic pressure tube, is arranged in the vicinity of each dynamic pressure tube.
9. The device as claimed in claim 8, wherein the bore, at the surface of the device for hydrostatic bearing of the workpiece in wafer form, ends in a groove which surrounds the dynamic pressure tube in the form of a ring.
10. A device for the simultaneous double-side grinding of a workpiece in wafer form, comprising two substantially circular grinding wheels with collinearly arranged axes of rotation, wherein the grinding surfaces of the grinding wheels are positioned opposite one another in axial direction, based on the axes of rotation, and two devices, likewise positioned opposite each other, for hydrostatically bearing the workpiece in wafer form, which each comprise at least one hydrostatic bearing and in each case at least one dynamic pressure tube for measuring the spacing between the workpiece and the device for hydrostatic bearing, wherein that surface of each of the two devices for hydrostatic bearing which faces the workpiece, has at least one groove which begins at the edge not facing the grinding wheels, runs in the direction of the edge facing the grinding wheels, before it reaches that edge.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A resetting method in a Passive Optical Network (PON), the method comprising:
receiving, by a burst receiver, a preamble sequence and synchronizing data;
after synchronizing, continuing to receive data, and matching a Burst Terminator (BT); and
resetting the burst receiver after successfully matching the BT.
2. The method according to claim 1, wherein after synchronizing the method further comprises:
matching a burst delimiter for the received data, and determining a start position of a burst;
wherein the continuing to receive data comprises:
continuing to receive burst data after successfully matching the burst delimiter.
3. The method according to claim 1, wherein matching the BT comprises one of:
matching the BT according to a bit shift or matching the BT based on a shift of a length, wherein when a Hamming distance between the received data and the terminator is smaller than a preset threshold, the matching is successful.
4. The method according to claim 1, wherein the BT is a sequence with all zeros.
5. The method according to claim 2, wherein the BT is a binary sequence with alternating zeros and ones.
6. The method according to claim 4, wherein the BT uses one byte as a unit, and a length of the BT is an integral multiple of one byte.
7. The method according to claim 4, wherein when the BT is the sequence with all zeros, the BT is a protection time slot between bursts.
8. A burst receiver in a Passive Optical Network (PON), comprising:
a receiving module, configured to receive burst data, wherein the burst data comprises a preamble sequence, a data payload, and a Burst Terminator (BT);
a synchronization module, configured to synchronize data according to the received preamble sequence;
a BT matching module, configured to match a BT; and
a reset module, configured to reset the burst receiver after the BT is successfully matched.
9. The burst receiver according to claim 8, further comprising:
a burst delimiter matching module, configured to match a burst delimiter for the received burst data and determine a start position of the burst data.
10. The burst receiver according to claim 8, wherein the BT matching module performs matching according to one of a bit shift or based on a shift of a length, and when a Hamming distance between the received data and the terminator is smaller than a preset threshold, the matching is successful.
11. An upstream burst transmission method in a Passive Optical Network (PON), the method comprising:
sending a Physical Layer Overhead upstream (PLOu), wherein the PLOu comprises a preamble, a delimiter, and a burst header;
sending an assigned time slot, wherein the assigned time slot comprises a transmission convergence layer frame overhead and a transmission convergence layer frame payload; and
sending a Burst Terminator (BT), wherein the BT is configured to delimit a burst to enable the burst receiver which receives the burst to reset after a matching of the BT is successful,
wherein the matching of the BT comprises one of: matching the BT according to a bit shift or matching the BT based on a shift of a length.
12. The method according to claim 11, wherein a length and a format of the BT are set according to requirements of a system on reliability of BT matching detection.
13. The method according to claim 11, wherein the BT is a binary sequence with one of alternating zeros and ones, or a sequence with all zeros.
14. The method according to claim 13, wherein when the BT is the sequence with all zeros, the BT is a protection time slot between bursts.
15. The method according to claim 13, wherein when a Hamming distance between the received data and the terminator is smaller than a preset threshold, the matching is successful.