Author: claimsbot

1. A bump formation method comprising a sequence of:
a first step that forms a ball on a tip end of a wire that passes through a capillary and joins said ball to a conductor to form a press-bonded ball;
a second step that raises and then moves said capillary in a horizontal direction to a first position so that a flat portion on a lower end of said capillary on a side of said capillary opposite to said horizontal-direction movement is positioned to face said press-bonded ball;
a third step that lowers said capillary so that said press-bonded ball is pressed by said flat portion of said capillary to form a first bump;
a fourth step that raises and moves said capillary in an opposite horizontal direction from said horizontal-direction movement of said capillary in said second step to a second position so that a flat portion on said lower end of said capillary on a side of said capillary opposite to said opposite horizontal-direction movement is positioned to face said first bump;
a fifth step that lowers said capillary so that said wire is bent and pressed against a surface of said first bump by said flat portion of said capillary, thus forming a second bump; and
a sixth step that cuts said wire from said second bump.
2. A bump formation method comprising a sequence of:
a first step that forms a ball on a tip end of a wire that passes through a capillary and joins said ball to a conductor to form a press-bonded ball;
a second step that raises and moves said capillary in a horizontal direction so that a flat portion on a lower end of said capillary is positioned to face said press-bonded ball;
a third step that lowers said capillary so that said press-bonded ball is pressed to form a first bump;
a fourth step that raises and lowers said capillary in an opposite horizontal direction from said horizontal-direction movement of said capillary in said second step so that said flat portion on said lower end of said capillary is positioned to face said first bump;
a fifth step that lowers said capillary so that said wire is bent and pressed against a surface of said first bump, thus forming a second bump; and
a sixth step that raises and moves said capillary in an opposite horizontal direction from said horizontal-direction movement in said fourth step so as to cause said flat portion on said lower end of said capillary to be positioned to face said second bump;
a seventh step that lowers said capillary so that said wire is bent and pressed against a surface of said second bump to form a third bump; and
an eighth step that cuts said wire from a uppermost bump.
3. A wire bonding method in which wire bonding between a first conductor aid second conductor is executed by performing primary bonding to a surface of a first conductor and then performing secondary bonding to a surface of a second conductor, said method comprising a sequence of:
a first step that forms a ball on a tip end of a wire that passes through a capillary and joins said ball to a conductor to form a press-bonded ball;
a second step that raises and then moves said capillary in a horizontal direction to a first position so that a flat portion on a lower end of said capillary on a side of said capillary opposite to said horizontal-direction movement is positioned to face said press-bonded ball;
a third step that lowers said capillary so that said press-bonded ball is pressed by said flat portion of said capillary to form a first bump;
a fourth step that raises and moves said capillary in an opposite horizontal direction from said horizontal-direction movement of said capillary in said second step to a second position so that said flat portion on said lower end of said capillary on a side of said capillary opposite to said opposite horizontal-direction movement is positioned to face said first bump;
a fifth step that lowers said capillary so that said wire is bent and pressed against a surface of said first bump by said flat portion of said capillary, thus forming a second bump with a direction of inclination of an inclined wedge oriented toward an opposite side from said first conductor; and
a sixth step that cuts said wire from said second bump, thus forming a two-stage bump; and then
said primary bonding is thereafter performed, after which said wire is looped from the said first conductor with respect to said bump, and said secondary bonding is performed on said inclined wedge on the upper portion of said bump.
4. A wire bonding method in which wire bonding between a first conductor and second conductor is executed by performing primary bonding to a surface of a first conductor and then performing secondary bonding to a surface of a second conductor, said method comprising a sequence of:
a first step that forms a ball on a tip end of a wire that passes through a capillary and joins said ball to a conductor to form a press-bonded ball;
a second step that raises and moves said capillary in a horizontal direction so that a flat portion on a lower end of said capillary is positioned to face said press-bonded ball;
a third step that lowers said capillary so that said press-bonded ball is pressed to form a first bump;
a fourth step that raises and lowers said capillary in an opposite horizontal direction from said horizontal-direction movement of said capillary in said second step so that said flat portion on said lower end of said capillary is positioned to face said first bump;
a fifth step that lowers said capillary so that said wire is bent and pressed against a surface of said first bump, thus forming a second bump; and
a sixth step that raises and moves said capillary in an opposite horizontal direction from said horizontal-direction movement of said capillary in said fourth step so as to cause said flat portion on said lower end of said capillary to be positioned to face said second bump;
a seventh step that lowers said capillary so that said wire is bent and pressed against a surface of said second bump to form a third bump; and
an eighth step that forms an inclined wedge on a final uppermost bump so that a direction of inclination of said inclined wedge is oriented toward an opposite side from said first conductor, said eighth step further cutting said wire from said final uppermost bump, thus forming a multi-stage bump; and then
said primary bonding is thereafter performed, after which said wire is looped from said first conductor with respect to said bump, and said secondary bonding is performed on said inclined wedge on the upper portion of said bump.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An apparatus for kneading a rubber material comprising:
one internal mixer arranged to an upstream side of a group of at least two kneading lines provided side by side, which kneads a rubber material with a non-vulcanization compounding agent, each line of the kneading lines having therein at least two open roll mixers serially connected with each other, and each of the open roll mixers being provided with a pair of kneading rolls, a rekneading conveyor, and a delivery conveyor;
one final mixer arranged to a downstream side of the group of kneading lines, which kneads intermediate kneaded rubber discharged from the group of kneading lines with a vulcanization compounding agent;
measuring means arranged between the internal mixer and the group of kneading lines;
distribution means arranged between the internal mixer and the group of kneading lines, which distributes, by selectively moving among the kneading lines, to at least one kneading line of the group of kneading lines, preparatory kneaded rubber measured by the measuring means; and
transport means, arranged between the group of kneading lines and the final mixer, which transports the intermediate kneaded rubber to the final mixer.
2. The apparatus for kneading a rubber material according to claim 1, wherein the final mixer further comprises a pair of kneading rolls, a rekneading conveyor, and a delivery conveyor.
3. The apparatus for kneading a rubber material according to any one of claims 1 and 2, wherein the measuring means includes a measuring conveyor and a cutting unit, and the distribution means includes a transport conveyor.
4. The apparatus for kneading a rubber material according to claim 3, wherein each of the open roll mixers is provided with roll gap adjusting means along with driving means for the pair of kneading rolls, and additionally provided with: a roll gap sensor; a rubber temperature sensor for a temperature of kneaded rubber; an operating unit, which controls the driving means for the kneading rolls and the roll gap adjusting means based on data detected by the roll gap sensor and the rubber temperature sensor.
5. The apparatus for kneading a rubber material according to claim 4, wherein each of the open roll mixers is further provided with cooling means for kneaded rubber, which is controlled by the operating unit.
6. The apparatus for kneading a rubber material according to claim 4, wherein, by further providing each of the open roll mixers with a bank amount sensor for a bank amount of rubber retained on the pair of kneading rolls, data detected by the bank amount sensor is inputted into the operating unit.
7. A method of kneading a rubber material using the kneading apparatus according to any one of claims 1 and 2, comprising the steps of;
preliminarily kneading a rubber material with a non-vulcanization compounding agent by use of the internal mixer; and
kneading preparatory kneaded rubber, which is discharged from the internal mixer, in at least one of the kneading lines of the roll mixers in a manner that a temperature of the kneaded rubber is controlled to be in a range of 40 to 90\xb0 C. while a roll gap of the pair of the kneading rolls is set in a range of 0.5 to 3.0 mm.
8. A method of kneading a rubber material using the kneading apparatus according to any one of claims 1 and 2, comprising the steps of;
preliminarily kneading a rubber material with a non-vulcanization compounding agent by use of the internal mixer; and
at the time when preparatory kneaded rubber, which is discharged from the internal mixer, is charged from the internal mixer into the first roll mixer in at least one of the kneading lines of the roll mixers, controlling a temperature of the preparatory kneaded rubber to be at least 90\xb0 C.; and
at the time when the kneaded rubber is discharged from the first roll miser into the second roll mixer, controlling a temperature of the kneaded rubber to be in a range of 60 to 80\xb0 C.
9. The method of kneading a rubber material according to claim 8, further comprising the step of controlling a temperature of the kneaded rubber, which has been kneaded in and is discharged from the second roll mixer, to be in a range of 40 to 75\xb0 C.
10. The method of kneading a rubber material according to claim 8, further comprising the steps of:
inputting data detected by the roll gap sensor and the rubber temperature sensor into the operating unit; and
controlling at least any one of the driving means for the kneading rolls, the roll gap adjusting means, and the cooling means based on a difference between a viscosity, which is calculated by the operating unit by way of a preset viscosity estimation formula, and a target viscosity.
11. The method of kneading a rubber material according to claim 10, further comprising the steps of:
inputting data detected by the bank amount sensor into the operating unit; and
controlling at least any one of a transport speed of the rekneading conveyor, and a position thereof based on a difference between the calculated viscosity obtained by the operating unit and a target viscosity.

1. A cash handling device, comprising:
a debris sensor arranged within a housing of the cash handling device and configured to monitor a level of dust within the cash handling device; and
a controller configured to adjust operation of the cash handling device based on the monitored level of dust, wherein the controller is configured to adjust an operating speed of the cash handling device based on the monitored dust level.
2. The cash handling device of claim 1, further including an environmental condition monitoring system configured to monitor at least one of a temperature and a humidity within the housing of the cash handling device and at least one of an ambient temperature and an ambient humidity outside the housing of the cash handling device.
3. The cash handing device of claim 1, further including an environmental condition monitoring system configured to:
create an optimized preventative maintenance schedule based on at least one monitored environmental condition; and
transmit an alert based on the optimized preventive maintenance schedule.
4. The cash handling device of claim 1, further including at least a second sensor arranged within the housing of the cash handling device, wherein the second sensor is selected from a group comprising:
a temperature sensor configured to sense a temperature within the housing; and
a humidity sensor configured to sense a humidity within the housing.
5. A method of controlling operation of a cash handling device, comprising:
receiving, by a controller, an indication of a level of dust within a housing of the cash handling device; and
responsive to receiving the indication of the level of dust within the housing, adjusting, by the controller, operation of the cash handling device based on the indication of the level of dust within the housing, wherein the adjusting of the operation of the cash handling device includes adjusting an operation speed of the cash handling device.
6. The method of claim 5, further including transmitting a notification of the level of dust within the housing to at least one of a financial institution, central server of a retail store, and retail store manager.
7. One or more computer-readable media storing computer readable instructions that, when executed by a processor, cause the processor to:
receive an indication of a level of dust within a housing of a cash recycler device; and
responsive to receiving the indication of the level of dust within the housing, adjust operation of the cash recycler device based on the indication of the level of dust within the housing, wherein the instructions, when executed by the processor, cause the processor to, responsive to receiving the indication of the level of dust within the housing, adjust an operation speed of the cash handling device based on the indication of the level of dust within the housing.
8. The one or more computer-readable media of claim 7, wherein the instructions, when executed by the processor, further cause the processor to:
transmit a notification of the level of dust within the housing to at least one of a financial institution, central server of a retail store, and retail store manager.
9. The one or more computer-readable media of claim 7, wherein the instructions, when executed by the processor, further cause the processor to:
create a preventative maintenance schedule based on at least one monitored environmental condition; and
transmit an alert based on the preventive maintenance schedule.
10. A method of controlling operation of a cash handling device, comprising:
receiving an indication of a note quality of a note at a location within the cash handling device;
receiving an indication of an environmental condition;
determining a note quality threshold based on the environmental condition;
determining that the note quality is below the determined note quality threshold;
responsive to determining that the note quality is below the determined note quality threshold, adjusting, by a controller, operation of the cash handling device based on the received indication of the environmental condition;
responsive to the determining that the note quality is below the determined note quality threshold, adjusting, by the controller, the operation of the cash handling device by moving said note to a location outside of the cash handling device;
responsive to determining that the note quality is above a second note quality threshold, adjusting, by the controller, operation of the cash handling device by moving the note to a first storage location within the cash handling device; and
responsive to determining that the note quality is between the determined note quality threshold and the second threshold, adjusting, by the controller, operation of the cash handling device by moving the note to a second storage location within the cash handling device.
11. The method of claim 10, wherein the adjusting of the operation of the cash handling device includes adjusting at least one of: processing speed, gap height of a feeding mechanism, tension on a roller, and tension on a belt.
12. The method of claim 10, wherein the note quality is an average note quality at a geographic location of the cash handling device.
13. The method of claim 10, wherein the adjusting of the operation of the cash handling device is performed automatically upon determining that an average note quality at a geographic location of the cash handling device is below the determined threshold level.
14. The method of claim 10, further including automatically returning the cash handling device to a normal operation upon receiving an indication that an average note quality at a geographic location of the cash handling device is above the determined threshold.
15. The one or more computer-readable media of claim 10, wherein the determining of the threshold based on the environmental condition includes autonomously adjusting the threshold based on changes in the indication of the environmental condition.
16. The method in claim 10, wherein the environmental condition includes at least one of:
temperature within a housing of the cash handling device, humidity within the housing of the cash handling device, and dust level within the housing of the cash handling device.
17. The method of claim 10, wherein the cash handling device is configured to recirculate the note stored in the first storage location, and configured to not recirculate the note stored in the second storage location.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An insulated-gate type semiconductor device having a longitudinal structure, comprising:
a semiconductor main body of a first conductivity type;
a first semiconductor region of a second conductivity type, which is formed in a portion of said semiconductor main body;
a second semiconductor region of the first conductivity type, which is formed in a portion of said first semiconductor region; and
a trench gate which reaches from a major surface of said second semiconductor region to a region of said semiconductor main body; wherein:
a portion of a gate pillar which is made of both said trench gate and an insulating film covering an upper surface of said trench gate is projected from the major surface of said second semiconductor region;
a side wall spacer is provided on a side wall of said projected gate pillar; and
a source electrode connected to said second semiconductor region is provided on a contact region defined by said side wall spacer.
2. An insulated-gate type semiconductor device having a longitudinal structure, comprising:
a semiconductor main body of a first conductivity type;
a first semiconductor region of a second conductivity type, which is formed in a portion of said semiconductor main body;
a second semiconductor region of the first conductivity type, which is formed in a portion of said first semiconductor region; and
a trench gate which reaches from a major surface of said second semiconductor region to a region of said semiconductor main body; wherein:
a portion of said trench gate is projected from the major surface of said second semiconductor region;
a side wall spacer is provided on both said projected trench gate and a side wall of an insulating film covering an upper surface of said trench gate; and
a source electrode connected to said second semiconductor region is provided in a contact hole defined by said side wall spacer.
3. An insulated-gate type semiconductor device as claimed in claim 1 wherein:
said side wall is formed via a thermal oxidation film which is formed on a surface of the projected portion of said trench gate.
4. A semiconductor device comprising:
(a) a semiconductor substrate of a first conductivity type;
(b) a gate trench formed in a main surface of the semiconductor substrate;
(c) a gate insulating film formed over an inner wall and a bottom portion of the gate trench;
(d) a gate electrode formed so as to fill the gate trench and a portion of which protrudes from the semiconductor substrate;
(e) a side wall formed over a side wall portion of the gate electrode protruding from the semiconductor substrate such that the height of an uppermost portion of the side wall is higher than the height of an uppermost portion of the gate electrode;
(f) a source region of the first conductivity type, formed so as to be adjacent to the gate electrode;
(g) a body trench formed between said side wall and another said side wall formed over a side wall portion of an adjacent gate electrode by self-alignment with the gate electrodes, so as to be deeper than a depth of the source region;
(h) a first semiconductor region formed at a bottom portion of the body trench and having a second conductivity type that is different from the first conductivity type; and
(i) a drain region of the first conductivity type, formed in a portion opposite to the main surface of the semiconductor substrate.
5. The semiconductor device according to claim 4, further comprising:
a first insulating film formed over the gate electrode,
wherein the side wall is also formed over a side wall portion of the first insulating film.
6. The semiconductor device according to claim 4, further comprising:
a conductive film extending over the gate electrode and electrically connected to the first semiconductor region.