Author: claimsbot

1. An electronic component, comprising:
at least two vertical semiconductor power devices, each vertical semiconductor device comprising a first side and a second side opposing the first side, wherein at least one first load electrode is positioned on the first side and at least one second load electrode is positioned on the second side,
an electrically conductive contact clip, the contact clip comprising a flat web portion and at least one peripheral rim portion extending from an edge region of the flat web portion in a direction towards the lower side of the flat web portion,
a plurality of surface mountable outer contact surfaces,
a leadframe comprising a lower surface providing surface mountable outer contact surfaces and an upper surface and providing at least two die support portions,
wherein each of the at least two vertical semiconductor power devices is positioned between the upper surface of the leadframe and the lower surface of the flat web portion of the contact clip and is attached to, and electrically connected to, the upper surface of the leadframe and to the lower surface of the flat web portion of the contact clip.
2. An electronic component according to claim 1, wherein
the second load electrode of each semiconductor power device is attached to the lower surface of the flat web portion of the contact clip and first side of each semiconductor power device is attached to the upper side of the leadframe.
3. An electronic component according to claim 2, wherein
a first vertical semiconductor power device is one of the group consisting of a power MOSFET and an IGBT, the first side further comprising at least one control electrode, and wherein a second vertical semiconductor power device is one of the group consisting of a diode, a free-wheeling diode and a Schottky diode.
4. An electronic component according to claim 2, wherein
the first vertical semiconductor power device is one of the group consisting of a power MOSFET and an IGBT and the second semiconductor power device is one of the group consisting of a power MOSFET and an IGBT, wherein the first side of the first vertical semiconductor power device further comprises at least one control electrode and the first side of the second semiconductor power device further comprises at least one control electrode.
5. An electronic component according to claim 4, wherein
the first vertical semiconductor power device and the second vertical semiconductor power device are configured to provide a half-bridge circuit.
6. An electronic component according to claim 4, wherein
the first vertical semiconductor power device is an n-channel device and the second vertical semiconductor power device is a p-channel device.
7. An electronic component according to claim 4, further comprising a Schottky diode.
8. An electronic component according to claim 7, wherein
the Schottky diode is configured in parallel with the second vertical semiconductor power device.
9. An electronic component according to claim 1, wherein
the contact clip comprises at least two peripheral rim portions, a peripheral rim portion extending from two opposing edge regions of the flat web portion, wherein each peripheral rim portion extends into a foot region, wherein the lower surface of the foot region of each of the peripheral rim portions provides a surface mountable outer contact surface.
10. An electronic component according to claim 1, wherein
the contact clip comprises at least two peripheral rim portions, a peripheral rim portion extending from two opposing edges regions of the flat web portion, wherein each peripheral rim portion extends into a foot region, wherein the leadframe further comprises two outer portions, and wherein the foot region of one peripheral rim portion is attached and electrically connected to each outer portion of the leadframe.
11. An electronic component comprising a base component and at least one stack component, wherein the base component comprises:
at least two base vertical semiconductor power devices, each base vertical semiconductor device comprising a first side and a second side opposing the first side, wherein at least one first load electrode is positioned on the first side and at least one second load electrode is positioned on the second side,
an electrically conductive base contact clip, the base contact clip comprising a base flat web portion and at least one base peripheral rim portion, wherein the base flat web portion has a lower side and an upper side, wherein a base peripheral rim portion extends from an edge region of the base flat web portion in a direction towards the lower side of the base flat web portion,
a plurality of surface mountable outer contact surfaces,
wherein each of the at least two base vertical semiconductor power devices is attached to, and electrically connected to, the lower surface of the base flat web portion of the base contact clip,
and wherein the stack component comprises:
at least two stack vertical semiconductor power devices, each stack vertical semiconductor device comprising a first side and a second side opposing the first side, wherein at least one first load electrode is positioned on the first side and at least one second load electrode is positioned on the second side,
wherein each of the stack vertical semiconductor power devices is attached to, and electrically connected to, the upper surface of the base contact clip of the base component.
12. An electronic component according to claim 11, wherein
the second load electrode of each of the stack vertical semiconductor power devices is mounted on the upper surface of the base flat web portion of the base contact clip and wherein the first load electrode of each of the stack vertical semiconductor power devices are electrically accessible from the surface mountable outer contact surfaces of the base component.
13. An electronic component according to claim 12, wherein
further comprising at least two stack contact clips, each stack contact clip comprising a flat web portion and a peripheral rim portion extending from one edge region of the flat web portion in a direction towards the lower surface of the flat web portion.
14. An electronic component according to claim 13, wherein
each stack peripheral rim portion extends into a foot region, wherein the lower surface of the foot region of each of the stack peripheral rim portions provides a surface mountable outer contact surface.
15. An electronic component according to claim 11, wherein
the base component further comprises a leadframe comprising a lower surface providing surface mountable outer contact surfaces, an upper surface and at least two die support portions, wherein the at least two base vertical semiconductor power devices are mounted on, and electrically connected to, the upper surface of the die support portions of the leadframe.
16. An electronic component according to claim 13, wherein
each stack peripheral rim portion extends into a foot region, and wherein a leadframe is provided which further comprises two outer portions, one foot region of a stack peripheral rim portion being attached and electrically connected to each outer portion of the leadframe.
17. An electronic component according to claim 11, wherein
a first base vertical semiconductor power device is one of the group consisting of a power MOSFET and an IGBT and the first side further comprises at least one control electrode and a second base vertical semiconductor power device is one of the group consisting of a diode, a free-wheeling diode and a Schottky diode.
18. An electronic component according to claim 17, wherein
a first stack vertical semiconductor power device is one of the group consisting of a power MOSFET and an IGBT and the first side further comprises at least one control electrode and a second stack vertical semiconductor power device is a one of the group consisting of a diode, a free-wheeling diode and a Schottky diode.
19. An electronic component according to claim 11, wherein
a first base vertical semiconductor power device is one of the group consisting of a power MOSFET and an IGBT, first side further comprising at least one control electrode, and wherein a second base vertical semiconductor power device is one of the group consisting of a power MOSFET and an IGBT, the first side further comprising at least one control electrode.
20. An electronic component according to claim 19, wherein
a first stack semiconductor power device is one of the group consisting of a power MOSFET and an IGBT and a second stack semiconductor power device is one of the group consisting of a power MOSFET and an IGBT, wherein the first side of the first stack semiconductor power device and the first side of the second stack semiconductor power device further comprises at least one control electrode.
21. A method comprising:
providing at least two base vertical semiconductor power devices, each base vertical semiconductor device comprising a first side and a second side opposing the first side, wherein at least one first load electrode is positioned on the first side and at least one second load electrode is positioned on the second side,
providing an electrically conductive base contact clip, the base contact clip comprising a base flat web portion and at least one base peripheral rim portion, wherein the base flat web portion has a lower side and an upper side, wherein a base peripheral rim portion extends from an edge region of the base flat web portion in a direction towards the lower side of the base flat web portion,
a plurality of surface mountable outer contact surfaces,
attaching and electrically connecting each of the at least two base vertical semiconductor power devices to the lower surface of the base flat web portion of the base contact clip,
providing at least two stack vertical semiconductor power devices, each stack vertical semiconductor device comprising a first side and a second side opposing the first side, wherein at least one first load electrode is positioned on the first side and at least one second load electrode is positioned on the second side,
attaching and electrically connecting each of the stack vertical power devices to the upper surface of the base contact clip of the base component.
22. A method according to claim 21, wherein
the second load electrode of each of the base vertical semiconductor devices is attached to the lower surface of the flat web portion of the base contact clip and wherein the second load electrode of each of the stack vertical semiconductor devices is attached to the upper surface of the flat web portion of the base contact clip.
23. A method according to claim 22, wherein
the second load electrode of each of the base vertical semiconductor devices is attached to the lower surface of the flat web portion of the base contact clip by a diffusion solder process and wherein the second load electrode of each of the stack vertical semiconductor devices is attached to the upper surface of the flat web portion of the base contact clip by a diffusion solder process.
24. A method according to claim 22, wherein
a leadframe is provided, the leadframe comprising a lower surface providing surface mountable outer contact surfaces and an upper surface and at least two die support portions, wherein the base vertical semiconductor power devices are attached and electrically connected to the upper surface of the die support portions.
25. A method according to claim 22, wherein at least two stack contact clips are provided, each stack contact clip comprising a flat web portion and a peripheral rim portion extending from one edge region of the flat web portion in a direction towards the lower surface of the flat web portion, wherein a stack contact clip is mounted on at least the first load electrode of the first and second stack vertical semiconductor power devices and wherein the first load electrode of the first and second vertical semiconductor power devices are electrically accessible from surface mountable outer contact surfaces of the electronic component.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. In a wireless-controlled lighting system including system components and a control master which communicate via commonly-received wireless transmissions, a method of initializing said system components, said method comprising:
a. transmission by one of the system components of a request for initialization;
b. allocation and transmission by the control master of a unique ID code for the requesting system component, said transmission also being receivable by ones of the system components other than the requesting system component;
c. transmission by the control master of a verification signal indicating that the ID code has been transmitted;
d. transmission by the requesting system component of an affirmative response to the verification signal if the transmitted ID code has been received;
e. if the affirmative response is not received by the control master, transmission by the control master of a signal indicating that an error has occurred;
f. if the affirmative response is received by the control master, storing the ID code allocated to the requesting component.
2. The method as in claim 1 where one of the system components comprises a remote control.
3. The method as in claim 1 where one of the system components comprises a lighting unit.
4. The method as in claim 1 where the verification signal is in the form of a radio signal.
5. The method as in claim 1 where one of the system components comprises a sensor.
6. A method as in claim 1 where each the requesting system component has a pre-assigned ID number.
7. A method as in claim 1 where the affirmative response is user initiated.
8. The method as in claim 1 where the requesting system component identifies itself as a specific type of component.
9. The method as in claim 8 where the control master initializes a remote control type of system component before initializing lighting unit types of system components.
10. The method as in claim 1 where the verification signal is in the form of a visual signal.
11. The method as in claim 10 where the verification signal is in the is form of a flashing light.
12. The method as in claim 1 where the system component transmits the request for enumeration automatically upon powering up.
13. The method as in claim 12 where the system component is a lighting unit.

1. A power train of a hybrid vehicle, comprising:
a first planetary gear set including three elements where an engine, a first motor generator, and an output shaft are separately connected;
a second planetary gear set including three elements, one element of which is directly connected with the element of the first planetary gear set connected with the output shaft and another element of which can be selectively connected from the first motor generator; the other element of which is connected with an element of the third planetary gear set;
a third planetary gear set including three elements, two elements of which are connected with the second planetary gear set and the other element of which is connected with a second motor generator;
a first brake is connected with an element of the third planetary gear sets other than an element of which is connected with the second motor;
a clutch is connected with the first motor generator and an element of the second planetary gear sets other than the element connected with the output shaft and the element connected with the first brake; and
a second brake is connected directly connected an element other than elements of the first planetary gear sets
2. The power train as defined in claim 1, wherein the output shaft is sequentially connected with one element of each of the first planetary gear set, the second planetary gear set, and the third planetary gear set,
the first brake fixes an element of the second planetary gear set by fixing an element of the third planetary gear set directly connected with the element of the second planetary gear set or fixes the element of the third planetary gear set by fixing the element of the second planetary gear set directly connected with the element of the third planetary gear set, and the clutch is provided to simultaneously engage and disengage an element of
the second planetary gear set withfrom an element of the first planetary gear set.
3. The power train as defined in claim 2, wherein the first planetary gear set is a single-pinion type planetary gear set, including a first sun gear connected with the first motor generator, a first carrier connected with the engine, and a first ring gear connected with the output shaft,
the second planetary gear set is a double-pinion type planetary gear set, including a second sun gear connected with the second brake and first clutch and the second brake through the clutch, a second carrier connected with the output shaft through the first ring gear, and a second ring gear connected with the first brake through the third planetary gear set, and
third planetary gear set is a single-pinion type planetary gear set, including a third sun gear connected with the second motor generator, a third carrier connected with the output shaft through the second planetary gear set and the first planetary gear set, and a third ring gear connected with the first brake.
4. The power train as defined in claim 3, wherein the planetary gear sets are coaxially arranged in parallel in the order of the first planetary gear set, the second planetary gear set, and the third planetary gear set,
the engine is connected with the first planetary gear set,
the output shaft is connected with the third planetary gear set through the first planetary gear set and the second planetary gear set,
the second motor generator is connected with the third planetary gear set, and
the first motor generator is connected with the second planetary gear set and the first planetary gear set from the third planetary gear set.
5. The power train as defined in claim 1, wherein the first planetary gear set, in a lever analysis diagram, is arranged on a first straight line in the order of an element connected with the first motor generator, an element connected with the engine, and an element connected with the output shaft,
the second planetary gear set, in a lever analysis diagram, is arranged on a second straight line that crosses the first straight line at at least one point in the order of an element connected with the output shaft, an element directly connected with the third planetary gear set, and an element connected with the first motor generator and the second brake through the clutch, and
the third planetary gear set, in a lever analysis diagram, is arranged on the second straight line in the order of an element connected with the second motor generator, an element connected with the output shaft, and an element directly connected with the second planetary gear set, in which as the clutch is engaged, the first straight line and the second straight line make a single straight line.
6. The power train as defined in claim 5, wherein the elements of the planetary gear sets are arranged on the second straight line in the order of the element of the third planetary gear set connected with the second motor generator, the elements of the second planetary gear set and the third planetary gear set which are directly connected with each other and connected with the output shaft, the elements of the second planetary gear set and the third planetary gear set which are directly connected with each other and connected with the first brake, and the element of the second planetary gear set which is connected with the first motor generator and the second brake through the clutch.
7. The power train as defined in claim 6, wherein, on the single straight line made by the first straight line and the second straight line by engagement of the clutch, the element of the first planetary gear set connected with the engine is disposed between two pairs of the elements, which are directly connected with each other, of the second planetary gear set and the third planetary gear set.
8. A power train of a hybrid vehicle, comprising:
a first planetary gear set including three elements where an engine, a first motor generator, and an output shaft are separately connected;
a second planetary gear set including three elements, one element of which is directly connected with the element of the first planetary gear set connected with the output shaft and another element of which can be selectively connected with first motor generator an element of the first planetary gear set and the other element is directly connected an element other than the first motor generator or a second motor generator;
a third planetary gear set including three elements, two elements of which are connected with the second planetary gear set and the other element of which is connected with a second motor generator;
a first brake that is provided to engage an elements of the second and the third planetary gear sets, both elements of which are directly connected; and
a clutch that selectively engages with the first motor generator and an element of the second planetary gear set other than the element connected with the output shaft and the element connected with the first brake and connected a second brake
9. The power train as defined in claim 8, wherein the output shaft is sequentially connected with one element of each of the first planetary gear set, the second planetary gear set, and the third planetary gear set, a first brake that is provided to engage an elements of the second and the third planetary gear sets, both elements of which are directly connected. an element or elements of the second planetary gear set and the third planetary gear set, which is or are connected with the output shaft through at least one of the three planetary gear sets and engage an element or elements of the second planetary gear set and the third planetary gear set other than an element or elements that is or are connected at least intermittently with the first motor generator or the second motor generator a clutch that intermittently engages with the first motor generator an element of the second planetary gear set other than the element connected with the output shaft and the element connected with the first brake; and

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A stacked package structure for reducing the package volume of an acoustic micro-sensor, comprising:
a recessed protective substrate;
a recessed conductive substrate, formed on the recessed protective substrate;
an integrated circuit (IC) device, connected to the recessed conductive substrate;
an acoustic micro-sensor, stacked on the IC device; and
a lid having a tone hole, the lid covering the acoustic micro-sensor so that the IC device and the acoustic micro-sensor are enveloped by the lid, the protective substrate and the conductive substrate;
wherein a recess is formed on the IC device as a back chamber of the acoustic micro-sensor.
2. The stacked package structure as recited in claim 1, wherein the lid is a glass substrate or a planar substrate.
3. The stacked package structure as recited in claim 1, wherein a metal material layer is deposited on each of the protective substrate and the conductive substrate.
4. The stacked package structure as recited in claim 1, wherein the protective substrate and the conductive substrate are formed of a polymer material, a metal material or an alloy by injection molding or compression molding.
5. The stacked package structure as recited in claim 1, wherein the protective substrate is electrically conductive with at least a conductive wire formed thereon.
6. The stacked package structure as recited in claim 1, wherein the conductive substrate is a printed circuit board or a flexible printed circuit board.
7. The stacked package structure as recited in claim 1, wherein an adhesive or at least a solder ball is used between the conductive substrate and the IC device and between the IC device and the acoustic micro-sensor for connection.
8. The stacked package structure as recited in claim 1, wherein the stacked package structure is capable of being used in a pressure sensor, an accelerometer sensor or an ultrasonic sensor.
9. A stacked package structure for reducing the package volume of an acoustic micro-sensor, comprising:
a recessed protective substrate;
a recessed conductive substrate, formed on the recessed protective substrate;
an integrated circuit (IC) device, connected to the recessed conductive substrate;
an acoustic micro-sensor, stacked on the IC device; and
a lid having a tone hole, the lid covering the acoustic micro-sensor;
wherein the IC device is enveloped by the protective substrate and the conductive substrate;
wherein a recess is formed on the IC device as a back chamber of the acoustic micro-sensor.
10. A stacked package structure for reducing the package volume of an acoustic micro-sensor, comprising:
a recessed protective substrate;
a recessed conductive substrate, formed on the recessed protective substrate;
an integrated circuit (IC) device, connected to the recessed conductive substrate;
an acoustic micro-sensor, stacked on the IC device; and
a lid having a tone hole, the lid covering the acoustic micro-sensor so that the IC device and the acoustic micro-sensor are enveloped by the lid, the protective substrate and the conductive substrate;
wherein a recess is formed on the IC device as a back chamber of the acoustic micro-sensor, and at least a conductive frame between the IC device and the acoustic micro-sensor is formed on the sidewall of the conductive substrate to define the height and the volume of the back chamber and to electrically connect the acoustic micro-sensor and the conductive substrate.
11. The stacked package structure as recited in claim 10, wherein the lid is a glass substrate or a planar substrate.
12. The stacked package structure as recited in claim 10, wherein a metal material layer is deposited on each of the protective substrate and the conductive substrate.
13. The stacked package structure as recited in claim 10, wherein the protective substrate and the conductive substrate are formed of a polymer material, a metal material or an alloy by injection molding or compression molding.
14. The stacked package structure as recited in claim 10, wherein the protective substrate is electrically conductive with at least a conductive wire formed thereon.
15. The stacked package structure as recited in claim 10, wherein the conductive substrate is a printed circuit board or a flexible printed circuit board.
16. The stacked package structure as recited in claim 10, wherein an adhesive or at least a solder ball is used between the conductive substrate and the IC device and between the IC device and the acoustic micro-sensor for connection.
17. The stacked package structure as recited in claim 10, wherein the stacked package structure is capable of being used in a pressure sensor, an accelerometer sensor or an ultrasonic sensor.
18. A stacked package structure for reducing the package volume of an acoustic micro-sensor, comprising:
a recessed protective substrate;
a recessed conductive substrate, formed on the recessed protective substrate;
an integrated circuit (IC) device, connected to the recessed conductive substrate;
an acoustic micro-sensor, stacked on the IC device; and
a lid having a tone hole, the lid covering the acoustic micro-sensor;
wherein the IC device is enveloped by the protective substrate and the conductive substrate;
wherein a recess is formed on the IC device as a back chamber of the acoustic micro-sensor, and at least a conductive frame between the IC device and the acoustic micro-sensor is formed on the sidewall of the conductive substrate to define the height and the volume of the back chamber and to electrically connect the acoustic micro-sensor and the conductive substrate.