Author: claimsbot

1. A coin return process applicable in coin returns in which at least two types i of coins of different values coexist in a single storage area, comprising the steps of:
a) obtaining a total value to be returned;
b) assigning different initial weights Weighti0 to each of said at least two types of coin, i<=2;
c) identifying the coin to be extracted or recovered by said return prior to its extraction or recovery;
d) modifying, after the identification of said coin to be extracted or recovered by the return, the weight assigned to said identified coin, Weighti\u2032 being said modified weight;
e) checking if said modified weight Weighti\u2032 is equal to a pre-established value, and extracting said coin with said modified weight equal to said pre-established value;
f) after said coin is extracted, modifying said value to be returned, subtracting the value of said extracted coin; and
g) repeating steps c)-e) until the value to be returned is zero or less than the value of the coin of less value available in the return.
2. The process according to claim 1, wherein said modification of the weight of a coin consists of decreasing by one unit the current weight of the coin the value of which corresponds to the identified coin.
3. The process according to claim 2, wherein said modification of the weight is carried out provided that the weight of the identified coin is greater than said pre-established value.
4. The process according to claim 1, wherein said initial weights Weighti0are calculated by dividing the value of the coin of greatest value existing in the return by the value of each of the types i of coin of the return.
5. The process according to claim 1, wherein said initial weights Weighti0 have a maximum value which is less than or equal to the result of dividing the value of the coin of greatest value by the value of the coin of less value.
6. The process according to claim 1, wherein said initial weights Weighti0 have a maximum value of 8.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method of communication, comprising:
receiving a communication having a message class at a mobile communication device carried by a vehicle;
obtaining the message class of the received communication at the mobile communication device;
sensing vibrations resulting from motion of the vehicle;
determining, using a processor, a state of motion of the vehicle at the mobile communication device based on the sensed vibrations upon receiving the communication;
comparing the present state of motion to a model indicative of a driving scenario;
determining a context of the state of the motion based on the comparison; and
using the message class, the determined state of motion, and the determined context of the state of motion to select an action to relay the communication to a driver of the vehicle.
2. The method of claim 1, wherein the model includes at least one log of vibrations recorded during a previous run through the driving scenario.
3. The method of claim 2, wherein the vibrations are recorded using a motion sensor integrated into the mobile communication device.
4. The method of claim 3, wherein the motion sensor includes at least one of: an accelerometer; a gyroscope; and an x-y-z motion sensor.
5. The method of claim 1, further comprising using the determined state of motion to anticipate an event in the driving scenario and using the anticipated event and the message class to relay the communication signal to the driver.
6. The method of claim 1, wherein the selected action includes selecting at least one of: a display for presenting the communication; a format for presenting the communication; and a time at which to present the communication.
7. The method of claim 1, wherein the received communication further comprises at least one of: an email message received from a wireless network; a text message received from a wireless network; and an incoming phone call received from a wireless network.
8. A mobile communication device for use in a vehicle, comprising:
a module configured to receive a communication from a network;
a motion sensor configured to sense vibrations resulting from motion of the vehicle; and
a processor configured to:
determine a state of motion of the vehicle based on the sensed vibrations upon receiving the communication,
obtain a message class of the communication,
compare the state of motion to a model indicative of a driving scenario,
determine a context of the state of the motion based on the comparison, and
select an action to relay the communication to a user of the mobile
communication device from the determined state of motion, the obtained message class, and the determined context of the state of motion.
9. The mobile communication device of claim 8, wherein the model includes at least one log of vibrations recorded during a previous run through the driving scenario.
10. The mobile communication device of claim 9, wherein the motion sensor includes at least one of: an accelerometer; a gyroscope; and an x-y-z motion sensor.
11. The mobile communication device of claim 8, wherein the processor is further configured to use the determined state of motion to anticipate an event in the driving scenario and use the anticipated event and the message class to relay the communication signal to the driver.
12. The mobile communication device of claim 8, wherein the processor is further configured to select the action from at least one of: selecting a display for presenting the communication signal; selecting a format for presenting the communication signal; and selecting a time at which to present the communication signal.
13. A method of providing a message to a driver of a vehicle, comprising:
receiving the message at a mobile communication device carried by the vehicle, wherein the message includes a message class;
obtaining the message class of the received message;
determining a state of motion of the vehicle at the mobile communication device using a motion sensor upon receiving the message, wherein the motion sensor is configured to sense vibrations resulting from motion of the vehicle;
comparing the determined state of motion to a model indicative of the behavior of a driving scenario;
determining a context of the state of the motion based on the comparison; and
using a processor to select an action for providing the message to the driver based on the determined state of motion of the vehicle, the determined context of the state of motion, and the obtained message class.
14. The method of claim 13, wherein determining the context further comprises determining the state of motion upon receiving the message.
15. The method of claim 13, further comprising using the determined state of motion to anticipate an event and using the anticipated event and the message class to relay the message to the driver.

What is claimed is:

1. A semiconductor device comprising:
a semiconductor chip having a side surface, a rear surface, and a front surface on which a circuit has been formed; and
a metal film for blocking light,
wherein the metal film covers the side surface and the rear surface of the semiconductor chip.
2. The semiconductor device according to claim 1, wherein the metal film covers the entire rear surface of the semiconductor chip.
3. The semiconductor device according to claim 1, wherein the metal film is formed of two layers, namely, a Ti layer and a Au layer, and the Au layer covers the Ti layer.
4. The semiconductor device according to claim 3, wherein the Ti layer has a thickness of 40 nm or more, and the Au layer has a thickness of 200 nm or more.
5. The semiconductor device according to claim 1, wherein the metal film is formed of two layers, namely, a Ni layer and a Au layer, and the Au layer covers the Ni layer.
6. The semiconductor device according to claim 5, wherein the Ni layer has a thickness of 40 nm or more, and the Au layer has a thickness of 200 nm or more.
7. A semiconductor device comprising:
a semiconductor chip having a side surface, a rear surface, and a front surface on which a circuit has been formed;
first and second resin films; and
bump electrodes electrically connected to the circuit,
the first resin film seals the front surface of the semiconductor chip,
the second resin film is formed of an epoxy-based resin or a silicone-based resin, blocks light, and covers the side surface and the rear surface of the semiconductor chip, and
the bump electrode is formed on the first resin film.
8. The semiconductor device according to claim 7, wherein the second resin film covers the entire rear surface of the semiconductor chip.
9. The semiconductor device according to claim 7, wherein the second resin film contains a pigment.
10. The semiconductor device according to claim 9, wherein the pigment is carbon.
11. A semiconductor device comprising:
a first main front surface on which circuit elements have been formed;
a second main front surface substantially opposing the first main front surface;
a semiconductor substrate having a plurality of side surfaces between the first main front surface and the second main front surface;
a first resin film covering the first main front surface;
a plurality of external terminals that are electrically connected to the circuit elements and project from the front surface of the first resin film; and
a metal film that covers side surfaces of the semiconductor substrate and the second main front surface, and blocks light.
12. The semiconductor device according to claim 11, wherein the metal film covers the entire second main front surface of the semiconductor substrate.
13. The semiconductor device according to claim 11, wherein the metal film is formed of two layers, namely, a Ti layer and a Au layer, and the Au layer covers the Ti layer.
14. The semiconductor device according to claim 13, wherein the Ti layer has a thickness of 40 nm or more, and the Au layer has a thickness of 200 nm or more.
15. The semiconductor device according to claim 11, wherein the metal film is formed of two layers, namely, a Ni layer and a Au layer, and the Au layer covers the Ni layer.
16. The semiconductor device according to claim 15, wherein the Ni layer has a thickness of 40 nm or more, and the Au layer has a thickness of 200 nm or more.
17. A semiconductor device comprising:
a first main front surface on which circuit elements have been formed;
a second main front surface substantially opposing the first main front surface;
a semiconductor substrate having a plurality of side surfaces between the first main front surface and the second main front surface;
a first resin film covering the first main front surface;
a plurality of external terminals that are electrically connected to the circuit elements and project from the front surface of the first resin film; and
a second resin film that covers side surfaces of the semiconductor substrate and the second main front surface, blocks light, and is formed of an epoxy-based resin or a silicone-based resin.
18. The semiconductor device according to claim 17, wherein the second resin film covers the entire second main front surface of the semiconductor substrate.
19. The semiconductor device according to claim 17, wherein the second resin film contains a pigment.
20. The semiconductor device according to claim 19, wherein the pigment is carbon.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. A polyvinyl alcohol polymer film comprising difference in retardation between two points separated by 1 cm along the TD direction of the film is 5 nm or less.
2. The polyvinyl alcohol polymer film according to claim 1, wherein the polyvinyl alcohol polymer film is used for a polarization film.
3. A polarization film produced by using the polyvinyl alcohol polymer film for a polarization film according to claim 2.
4. A method of producing a polyvinyl alcohol polymer film which comprises the step of contacting a polyvinyl alcohol polymer with a surface for drying (first drying surface) to obtain the polyvinyl alcohol polymer film, wherein the length of the first drying surface is within the range of 3 m to 200 m, and the water content of the film when peeled after passing through the first drying surface is 50% by weight or less.
5. The method of producing a polyvinyl alcohol polymer film according to claim 4, wherein both sides of the polyvinyl alcohol polymer film are dried to form a film in two stages of said first drying surface and a subsequent second drying surface or in more stages, while one side of the film being dried by the first drying surface and the other side of the film being dried by the second drying surface.
6. The method of producing a polyvinyl alcohol polymer film according to claim 5 wherein the length of said second drying surface is set as 1.2 times or less of the length of said first drying surface.
7. A method of producing a polyvinyl alcohol polymer film for a polarization film by the method of producing a polyvinyl alcohol polymer film according to claim 4.
8. A method of producing a polyvinyl alcohol polymer film for a polarization film by the method of producing a polyvinyl alcohol polymer film according to claim 5.
9. A method of producing a polyvinyl alcohol polymer film for a polarization film by the method of producing a polyvinyl alcohol polymer film according to claim 6.
10. The polyvinyl alcohol polymer film according to claim 1 produced by the method of producing a polyvinyl alcohol polymer film according to claim 4.
11. The polyvinyl alcohol polymer film according to claim 1 produced by the method of producing a polyvinyl alcohol polymer film according to claim 5.
12. The polyvinyl alcohol polymer film according to claim 1 produced by the method of producing a polyvinyl alcohol polymer film according to claim 6.