All The Claims

1. A heating system for a subsurface formation, comprising:
three substantially u-shaped heaters, first end portions of the heaters being electrically coupled to a single, three-phase wye transformer, second end portions of the heaters being electrically coupled to each other andor to ground;
wherein each heater is located in one of three separate openings that span between a first common wellbore and a second common wellbore in a hydrocarbon containing layer in the formation, and wherein the three heaters enter the formation through the first common wellbore, pass through the separate openings, and exit the formation through the second common wellbore so that the magnetic fields of the three heaters at least partially cancel out in the common wellbores.
2. The system of claim 1, wherein at least two of the heaters have heating sections that are at least partially substantially parallel in the hydrocarbon layer of the formation.
3. The system of claim 1, wherein at least one of the three heaters comprises an exposed metal heating section.
4. The system of claim 1, wherein at least one of the three heaters comprises an insulated conductor heating section.
5. The system of claim 1, wherein at least one of the three heaters comprises a conductor-in-conduit heating section.
6. The system of claim 1, wherein the three heaters comprise 410 stainless steel in at least part of the heating sections of the heaters, and copper in at least part of the overburden sections of the heaters.
7. The system of claim 1, further comprising a ferromagnetic casing in at least part of the overburden section of the first common wellbore.
8. The system of claim 1, further comprising a ferromagnetic casing in at least part of the overburden section of the second common wellbore.
9. The system of claim 1, wherein each heater is coupled to one phase of the transformer.
10. The system of claim 1, further comprising multiples of three additional heaters entering through the first common wellbore.
11. The system of claim 1, further comprising multiples of three additional heaters entering through the first common wellbore and exiting through the second common wellbore.
12. The system of claim 1, wherein at least one of the heaters is used to directionally steer drilling of at least one of the openings in the formation used for at least one of the other heaters.
13. The system of claim 1, wherein the three heaters are electrically coupled together in the second common wellbore.
14. The system of claim 1, wherein at least one of the three heaters provides different heat outputs along at least part of the length of the heater.
15. The system of claim 1, wherein at least one of the three heaters has different materials along at least part of the length of the heater to provide different heat outputs along at least part of the length of the heater.
16. The system of claim 1, wherein at least one of the three heaters has different dimensions along at least part of the length of the heater to provide different heat outputs along at least part of the length of the heater.
17. The system of claim 1, wherein at least a majority of the first common wellbore is vertical, substantially vertical, or vertically inclined, and at least a majority of the second common wellbore is vertical, substantially vertical, or vertically inclined.
18. The system of claim 1, wherein at least a majority of at least one of the three heaters is horizontal, substantially horizontal, or horizontally inclined.
19. A method of heating a subsurface formation, comprising:
providing heat from three substantially u-shaped heaters, wherein first end portions of the heaters are electrically coupled to a single, three-phase wye transformer, and second end portions of the heaters are electrically coupled to each other andor to ground;
wherein each heater is located in one of three separate openings that span between a first common wellbore and a second common wellbore in a hydrocarbon containing layer in the formation, and wherein the three heaters enter the formation through the first common wellbore, pass through the separate openings, and exit the formation through the second common wellbore so that the magnetic fields of the three heaters at least partially cancel out in the common wellbores; and
allowing the heat to transfer from the heaters to a portion of the formation.
20. The method of claim 19, further comprising mobilizing at least some hydrocarbons in the portion of the formation with the transferred heat.
21. The method of claim 19, further comprising mobilizing at least some hydrocarbons in the portion of the formation with the transferred heat, and producing at least some of the mobilized hydrocarbons.
22. The system of claim 1, wherein the three heaters comprise a first heater, a second heater, and a third heater, the three separate openings comprise a first opening, a second opening, and a third opening, and wherein the first heater is in the first opening, the second heater is in the second opening, and the third heater is in the third opening.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method for manufacturing a semiconductor substrate, comprising:
a first step of implanting hydrogen ions to a main surface side of a silicon substrate at a dosage of 1.5\xd71017 atomscm2 or higher;
a second step of bonding a main surface of the silicon substrate and a main surface of a support substrate made of a low melting point material;
a third step of performing heat treatment on the bonded substrate at a temperature of 120\xb0 C. or higher and 250\xb0 C. or lower and below a melting point of the support substrate; and
a fourth step of delaminating a silicon crystal film along a hydrogen ion implanted boundary of the silicon substrate out of the bonded substrate after the heat treatment to form a silicon thin film on a surface of the support substrate.
2. The method for manufacturing a semiconductor substrate according to claim 1, wherein the support substrate is made of an organic material, and the second step of bonding the substrates is carried out by applying an adhesive to the main surface of the silicon substrate and the main surface of the support substrate.
3. The method for manufacturing a semiconductor substrate according to claim 2, wherein the support substrate is made of plastics.
4. The method for manufacturing a semiconductor substrate according to claim 2, wherein the adhesive is silicon oil.
5. The method for manufacturing a semiconductor substrate according to claim 3, wherein the adhesive is silicon oil.
6. The method for manufacturing a semiconductor substrate according to claim 2, wherein the fourth step is carried out by applying a mechanical shock onto a hydrogen ion implanted region at an edge of the silicon substrate.
7. The method for manufacturing a semiconductor substrate according to claim 3, wherein the fourth step is carried out by applying a mechanical shock onto a hydrogen ion implanted region at an edge of the silicon substrate.
8. The method for manufacturing a semiconductor substrate according to claim 4, wherein the fourth step is carried out by applying a mechanical shock onto a hydrogen ion implanted region at an edge of the silicon substrate.
9. The method for manufacturing a semiconductor substrate according to claim 5, wherein the fourth step is carried out by applying a mechanical shock onto a hydrogen ion implanted region at an edge of the silicon substrate.

1. An ambient light sensor structure, comprising:
a pair of light sensors for providing a current responsive to impingement of incident light thereon, each of said light sensors providing a dark current absent said impingement of incident light thereon;
a power supply, said power supply providing at least one group of voltage interfaces;
a converter coupled to said pair of light sensors and said power supply, said converter including a pair of current to pulse converters respectively coupled to said pair of light sensors, each of said pair of current to pulse converters having a plurality of first inputs coupled to said group of voltage interfaces and a second input coupled to a corresponding one of said light sensors, each of said pair of current-to-pulse converters providing output pulse signals responsive to said current of said corresponding light sensor, wherein said output pulse signals of each of said pair of current-to-pulse converters include an equal number of output pulse signals in said absence of impingement of incident light on said pair of light sensors representing said dark current of said pair of light sensors; and
a pulse processing unit having a pair of inputs respectively coupled to said output pulse signals of said pair of current-to-pulse converters and providing an output voltage corresponding to a luminosity of the incident light with said dark current nulled.
2. The ambient light sensor structure of claim 1, wherein said group voltage interfaces of said power supply comprises at least three voltage interfaces, each voltage interface being a different voltage from the others.
3. The ambient light sensor structure of claim 2, wherein each said current-to-pulse converter comprises at least one Metal Oxide Semiconductor Field Effect transistor coupled between one of said voltage interfaces and said corresponding light sensor, said Metal Oxide Semiconductor Field Effect transistor having a gate electrode coupled said output pulse signals of said current-to-pulse converter.
4. The ambient light sensor structure of claim 1, wherein each said current-to-pulse converter includes a pair of switches having an output node therebetween providing said output pulse signals.
5. The ambient light sensor structure of claim 1, wherein each said light sensor is made of a material that converts light into current.
6. The ambient light sensor structure of claim 1, wherein said pulse processing unit includes at least one signal subtraction component having a pair of inputs respectively coupled to said output pulse signals of said pair of current-to-pulse converters for nulling said dark current.
7. The ambient light sensor structure of claim 1, wherein said pulse processing unit includes at least one counter coupled to an output of said signal subtraction unit.
8. The ambient light sensor structure of claim 7, wherein said pulse processing unit includes at least one digital-to-analog converter coupled to an output of said counter.
9. The ambient light sensor structure of claim 8, wherein said pulse processing unit includes at least one buffer coupled to an output of said digital-to-analog converter.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An apparatus comprising:
a first comb plate coupled to a first slide assembly movable along a rail that is, in turn coupled to a block, the first comb plate including at least one tooth segment;
a second comb plate coupled to a second slide assembly that is movable along the rail, and thereby movably disposed relative to the first comb plate and the second comb plate including at least one tooth segment, the first and second comb plates cooperatively forming a comb and the at least one tooth segment of the first comb plate and the at least one tooth segment of the second comb plate cooperatively forming a comb tooth; and
a cam assembly including a camming wedge and a device to move the camming wedge along an actuation stroke to adjust a relative position of the first and second comb plates to adjust a thickness dimension of the comb tooth, the camming wedge including a first surface and a second surface, the first surface configured to engage a first cam follower coupled to the first comb plate and the first slide assembly, the second surface configured to engage a second cam follower coupled to the second comb plate and the second slide assembly to move the first and second comb plates in opposed directions to increase or decrease the thickness dimension of the comb tooth wherein the first and second slide assemblies include at least one alignment hole or slot and the block includes first and second alignment holes or slots to align the first and second slide assemblies relative to the block.
2. The apparatus of claim 1 wherein the first comb plate includes a pin and the second comb plate includes an elongate slot and the pin of first comb plate is slidably disposed in the elongate slot of the second comb plate.
3. The apparatus of claim 2 wherein the second comb plate includes a pin slideably disposed in an elongate slot of the first comb plate.
4. The apparatus of claim 1 wherein the at least one tooth segments of the first and second comb plates include body surfaces which cooperatively form opposed spaced contact surfaces of the comb tooth having an adjustable thickness dimension between the contact surfaces.
5. The apparatus of claim 1 wherein the at least one tooth segments of the first and second comb plates include asymmetrically tapered tips to cooperatively form a wedge shaped tip of the comb tooth formed by the at least one tooth segments of the first and second comb plates.
6. The apparatus of claim 1 wherein the first and second comb plates include a plurality of spaced tooth segments to form a plurality of comb teeth.
7. The apparatus of claim 1 wherein the device to move the camming wedge is an indexer.
8. The apparatus of claim 7 wherein the indexer includes an indexing device that moves the camming wedge an incremental distance in incremental steps.
9. The apparatus of claim 1 wherein the first and second slide assemblies are spring biased relative to a closed position and movable thereagainst increase the thickness dimension of the comb tooth.
10. The apparatus of claim 1 further comprising
a head stack assembly including at least one suspension arm having a head coupled thereto.
11. The apparatus of claim 1 wherein the camming wedge includes a \u201cV\u201d shaped tip configured to engage the first and second cam followers.
12. The apparatus of claim 1 wherein the at least one tooth segment of the first comb plate and the at least one tooth segment of the second comb plate are cantilevered from, and offset from, body portions of the first and second comb plates to provide a first width dimension for the first and second comb plates along the body portions of the comb plates and a second narrow width dimension along the comb tooth formed by the at least one tooth segments of the first and second comb plates.
13. The apparatus of claim 1 wherein the first slide assembly includes a first cam block and the first comb plate is coupled thereto, and the second slide assembly includes a second cam block and the second comb plate is coupled thereto, and the first cam follower is coupled to the first cam block and the second cam follower is coupled to the slot, on the first and second slide second cam block and the at least one alignment hole or slot on the first and second slide assemblies is formed on the first and second cam blocks.
14. An apparatus comprising
a first comb plate coupled to a first slide assembly that is movable along a first rail that is, in turn coupled to a block, the first comb plate including at least one tooth segment;
a second comb plate coupled to a second slide assembly that is movable along the first rail, and thereby movably disposed relative to the first comb plate, the second comb plate including at least one tooth segment, the first and second comb plates cooperatively forming a comb, the at least one tooth segment of the first comb plate and the at least one tooth segment of the second comb plate cooperatively forming a comb tooth;
a cam assembly including a camming wedge movable along an actuation stroke and a device to move the camming wedge along the actuation stroke and the camming wedge configured to engage a first cam follower coupled to the first comb plate and the first slide assembly and a second cam follower coupled to the second comb plate and the second slide assembly to operably move the first and the second comb plates apart from each other in one direction of the actuation stroke and alternatively toward each other in another direction of the actuation stroke to adjust a thickness dimension of the comb tooth; and
a third slide assembly to which the block is affixed, the third slide assembly being movably disposed on a second rail that is, in turn, coupled to a base so that the block is moveable in relation to the base to operably move the first and second comb plates to adjust an elevation height of the first and second comb plates;
first alignment features including an alignment hole or slot on the first and second slide assemblies and alignment holes or slots on the block to align the first and second slide assemblies relative to the block; and
second alignment features including an alignment slot or hole on the block and an alignment hole or slot on the base to align the block relative to the base.
15. The apparatus of claim 14 wherein the first slide assembly includes a first cam block and the second slide assembly includes a second cam block wherein the first and second cam followers are supported by the first and second cam blocks respectively, and the first and second cam blocks include the alignment holes or slots to align the first and second cam blocks relative to the block.
16. The apparatus of claim 14 and comprising:
a device configured to selectively move the block relative to the base.
17. An assembly comprising:
a first comb plate including at least one tooth segment;
a second comb plate slideably disposed relative to the first comb plate and the second comb plate including at least one tooth segment, the first and second comb plates cooperatively forming a comb and the at least one tooth segment of the first comb plate and the at least one tooth segment of the second comb plate cooperatively forming a comb tooth;
a cam assembly including a camming wedge movable along an actuation stroke and configured to engage a first cam follower coupled to the first comb plate and a second cam follower coupled to the second comb plate to move the first and the second comb plates in opposed directions to increase or decrease a thickness of the comb tooth; and
an indexer configured to move the camming wedge along the actuation stroke wherein the indexer includes a cylinder having a plurality of \u201cV\u201d shaped nests about a circumference thereof and a spring loaded ball, which is movable between adjacent nests, to move the camming wedge in increment steps.
18. The assembly of claim 17 wherein the spring loaded ball is movable between the adjacent nests via rotation of the cylinder.