All The Claims

We claim:

1. A locator tool for orienting a medical device with an implanted adjustable valve with a physical characteristic that indicates a specific orientation of the valve, the tool comprising:
an indicator of a desired orientation of a valve; and
means for coupling with the physical characteristic of the valve to indicate a specific orientation of the valve.
2. An indicator tool for indicating the current setting of an implanted adjustable valve with a physical characteristic that indicates a specific orientation of the valve and a magnet indicating a current setting of the valve, the tool comprising:
means for magnetically coupling with the magnet in a valve to indicate a current setting of the valve; and
means for indicating the current setting of the valve
3. An adjustment tool for changing the current setting of an implanted adjustable valve with a physical characteristic that indicates a specific orientation of the valve and a magnet capable of changing a current setting of the valve by physical movement of the magnet, the tool comprising:
means for magnetically coupling with the magnet in the valve to move the magnet to change the current setting of the valve;
means for moving the magnet in the valve to move the magnet to change the current setting of the valve.
4. A system for indicating the current setting of an implanted adjustable valve with a physical characteristic that indicates a specific orientation of the valve and a magnet indicating a current setting of the valve, the system comprising:
a locator tool comprising:
an indicator of a desired orientation of a valve; and
means for coupling with the physical characteristic of the valve to indicate a specific orientation of the valve; an indicator tool comprising:
means for magnetically coupling with the magnet in a valve to indicate a current setting of the valve; and
means for indicating the current setting of the valve.
5. A system for changing the current setting of an implanted adjustable valve with a physical characteristic that indicates a specific orientation of the valve and a magnet capable of changing a current setting of the valve by physical movement of the magnet, the system comprising:
a locator tool comprising:
an indicator of a desired orientation of a valve; and
means for coupling with the physical characteristic of the valve to indicate a specific orientation of the valve;

an adjustment tool comprising:
means for magnetically coupling with the magnet in the valve to move the magnet to change the current setting of the valve;
means for moving the magnet in the valve to move the magnet to change the current setting of the valve.
6. A system for determining and changing the current setting of an implanted adjustable valve with a physical characteristic that indicates a specific orientation of the valve and a magnet capable of changing a current setting of the valve by physical movement of the magnet, the system comprising:
a locator tool comprising:
an indicator of a desired orientation of a valve; and
means for coupling with the physical characteristic of the valve to indicate a specific orientation of the valve;

an indicator tool comprising:
means for magnetically coupling with the magnet in a valve to indicate a current setting of the valve; and
means for indicating the current setting of the valve

an adjustment tool comprising:
means for magnetically coupling with the magnet in the valve to move the magnet to change the current setting of the valve;
means for moving the magnet in the valve to move the magnet to change the current setting of the valve.
7. A method of orienting a medical device with an implanted adjustable valve with a physical characteristic that indicates a specific orientation of the valve, the method comprising the steps of:
providing a locator tool having an indicator of desired orientation of a valve and having means for coupling with the physical characteristic of the valve that indicates a specific orientation of the valve;
palpating the valve to determine its physical characteristics;
setting the locator tool over a portion of the valve so that the locator tool is mechanically coupled to the physical characteristic of the valve that indicates a specific orientation of the valve.
8. A method of indicating the current setting of an implanted adjustable valve with a physical characteristic that indicates a specific orientation of the valve and a magnet indicating a current setting of the valve, the method comprising the steps of:
providing a locator tool having an indicator of desired orientation of a valve and having means for coupling with the physical characteristic of the valve that indicates a specific orientation of the valve;
providing an indicator tool having means for magnetically coupling with a magnet in a valve indicating a current setting of the valve and having means for indicating the current setting of the valve;
palpating the valve to determine its physical characteristics;
setting the locator tool over a portion of the valve so that the locator tool is mechanically coupled to the physical characteristic of the valve that indicates a specific orientation of the valve;
coupling the indicator tool to the locator tool to align the indicator tool with the locator tool;
wherein, the current setting of the valve is indicated by the indicator tool.
9. A method of changing the current setting of an implanted adjustable valve with a physical characteristic that indicates a specific orientation of the valve and a magnet capable of changing a current setting of the valve by physical movement of the magnet, the method comprising the steps of:
providing a locator tool having an indicator of desired orientation of a valve and having means for coupling with the physical characteristic of the valve that indicates a specific orientation of the valve;
providing an adjustment tool having means for magnetically coupling with the magnet in the valve to move the magnet to change the current setting of the valve;
palpating the valve to determine its physical characteristics;
setting the locator tool over a portion of the valve so that the locator tool is mechanically coupled to the physical characteristic of the valve that indicates a specific orientation of the valve;
coupling the adjustment tool to the locator tool to align the adjustment tool with the locator tool;
moving the magnet to change the current setting of the valve.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An adhesive composition dissolved in an organic solvent, wherein the adhesive composition comprises:
(1) as a main component, a polymer obtained by copolymerizing a monomer composition comprising (i) an alkyl (meth)acrylate, (ii) a monomer having a maleimide group, and (iii) styrene, and
(2) a thermal polymerization inhibitor,
wherein the monomer having a maleimide group is contained in the monomer composition in an amount of not less than 5.0 wt. % but not more than 20 wt. %,
wherein an amount of the alkyl (meth)acrylate in the monomer composition is not less than 30 parts by weight but not more than 58 parts by weight,
an amount of the styrene in the monomer composition is not less than 30 parts by weight but not more than 60 parts by weight, and
the total amount of the monomer composition is 100 parts by weight, and
wherein the adhesive composition remains soluble in propylene glycol monomethyl ether acetate even if the adhesive composition is heated at 250\xb0 C. for 1 hour.
2. The adhesive composition as set forth in claim 1, wherein:
the thermal polymerization inhibitor is contained in the adhesive composition by not less than 0.1 wt. % but not more than 10.0 wt. %.
3. The adhesive composition as set forth in claim 1, wherein:
the thermal polymerization inhibitor is a phenolic thermal polymerization inhibitor.
4. The adhesive composition as set forth in claim 1, wherein:
the polymer has a styrene block segment.
5. The adhesive composition as set forth in claim 1, wherein:
a mass ratio of the alkyl (meth)acrylate with respect to the styrene is within a range of 0.1:1 to 3:1.
6. A film adhesive comprising:
a film; and
an adhesive layer provided on the film, comprising the adhesive composition as set forth in claim 1.
7. The adhesive composition as set forth in claim 1,
wherein the monomer having a maleimide group is a monomer represented by formula (1)
wherein R1 and R2 independently represent a hydrogen atom or a C1 through C20 organic group, and the organic group may contain an oxygen atom, a nitrogen atom, a sulfur atom, or a halogen atom; and R3 represents an alkyl group, an alicyclic hydrocarbon group, or an aryl group.
8. The adhesive composition as set forth in claim 1, further comprising
a compound having two functional groups.
9. A heat treatment method comprising the step of heating a material to be heated at a temperature in a range from 250\xb0 C. to 350\xb0 C.,
wherein the material to be heated is an adhesive composition comprising:
(1) as a main component, a polymer obtained by copolymerizing a monomer composition comprising (i) an alkyl (meth)acrylate, (ii) a monomer having a maleimide group, and (iii) styrene, and
(2) a thermal polymerization inhibitor,
wherein the monomer having a maleimide group is contained in the monomer composition in an amount of not less than 5.0 wt. % but not more than 20 wt. %,
wherein an amount of the alkyl (meth)acrylate in the monomer composition is not less than 30 parts by weight but not more than 58 parts by weight,
an amount of the styrene in the monomer composition is not less than 30 parts by weight but not more than 60 parts by weight, and
the total amount of the monomer composition is 100 parts by weight, and
wherein the adhesive composition remains soluble in propylene glycol monomethyl ether acetate even if the adhesive composition is heated at 250\xb0 C. for 1 hour.
10. The heat treatment method as set forth in claim 9, comprising the steps of:
(a) forming an adhesive layer from the adhesive composition on a surface of a substrate;
(b) heating the substrate at a temperature in a range of 250\xb0 C. to 350\xb0 C. after the step (a); and
(c) stripping off the adhesive layer from the substrate after the step (b).

1. A switch comprising a body formed with a chamber, a member disposed in said chamber for movement along a predetermined path, a pivotally mounted element having a pair of arms, one either side of said member, such that said member impinges on one arm or the other in the event of movement in one direction or the other along said path, to correspondingly turn said element and change said switch from one operational state to another.
2. A switch as claimed in claim 1, wherein said switch is activated by tilt movement.
3. A switch as claimed in claim 1, arranged for said member to move along said path according to the gravitational force component acting on said member along said path.
4. A switch as claimed in claim 1, wherein said member can move along said channel when said channel is declined relative to said member at an angle of at least 1 degree.
5. A switch as claimed in claim 1, wherein said member comprises a ball.
6. A switch as claimed in claim 5, wherein the diameter of said ball is in the range 16-26 mm.
7. A switch as claimed in claim 5, wherein the diameter of said ball is in the range 18-24 mm.
8. A switch as claimed in claim 5, wherein the diameter of said ball is in the range 20-22 mm.
9. A switch as claimed in claim 1, wherein said chamber is filled with hydraulic fluid.
10. A switch as claimed in claim 1, wherein said chamber acts as a dump for hydraulic fluid.
11. A switch as claimed in claim 10, wherein said hydraulic fluid is oil.
12. A switch as claimed in claim 10, wherein said hydraulic fluid lubricates said member and said element.
13. A switch as claimed in claim 12, wherein said hydraulic fluid dampens any vibration of the switch.
14. A switch as claimed in claim 1, wherein a mounting spindle of said element comprises at least one through passage arranged to align in at least one rotational position thereof, with a duct formed in said body and forming part of a hydraulic circuit.
15. A switch as claimed in claim 1, wherein said switch is used to limit the removal of components within a circuit to specific operating circumstances.
16. A switch as claimed in claim 1, wherein said switch provides a limit to the working range of a hydraulically operated device.
17. A hydraulic circuit comprising:
a switch having a body formed with a chamber, a member disposed in said chamber for movement along a predetermined path, a pivotally mounted element having a pair of arms, one either side of said member, such that said member impinges on one arm or the other in the event of movement in one direction or the other along said path, to correspondingly turn said element and change said switch from one operational state to another.
18. A locking mechanism comprising:
a switch having a body formed with a chamber, a member disposed in said chamber for movement along a predetermined path, a pivotally mounted element having a pair of arms, one either side of said member, such that said member impinges on one arm or the other in the event of movement in one direction or the other along said path, to correspondingly turn said element and change said switch from one operational state to another.
19. An excavator comprising:
a bucket for excavation, said bucket being operated by a hydraulic circuit incorporating a switch, the switch having a body formed with a chamber, a member disposed in said chamber for movement along a predetermined path, a pivotally mounted element having a pair of arms, one either side of said member, such that said member impinges on one arm or the other in the event of movement in one direction or the other along said path, to correspondingly turn said element and change said switch from one operational state to another.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

What is claimed is:

1. A socket comprising:
a top cover;
at least one contact, each at least one contact containing an opening for receiving a pin from an electronic package insertable into the socket;
a base, the base supporting the at least one contact; and
a conductive plate, the conductive plate residing between the top cover and the base and electrically connected to ground, the conductive plate containing an opening for each pin to pass through from the cover to one at least one contact in the base, the diameter of each opening in the conductive plate being customizable to produce a desired inductance between the pin inserted in the contact and the conductive plate, wherein impedance discontinuity seen by a signal passing through the socket from the pin is minimized.
2. The socket according to claim 1, wherein the electronic package is a Pin Grid Array (PGA) package.
3. The socket according to claim 1, wherein the top cover is movable during insertion of the electronic package.
4. The socket according to claim 1, wherein the openings in the conductive plate have at least two different diameters.
5. The socket according to claim 1, wherein the openings in the conductive plate are of the same diameter.
6. The socket according to claim 1, wherein the conductive plate is imbedded within the top cover.
7. The socket according to claim 1, wherein the conductive plate is imbedded within the base.
8. The socket according to claim 1, wherein the conductive plate is connected to ground through at least one contact within the base that does not contain openings for receiving a pin from an electronic package.
9. The socket according to claim 1, the conductive plate further comprising pins, the pins insertable into some of the at least one contacts to provide the electrical connection to ground.
10. A conductive plate for a socket comprising:
a plurality of openings, the openings allowing pins from an electronic package to pass through to contacts in the socket, the diameter of each opening being customizable to produce a desired inductance between the electronic package pin inserted in the contact and the conductive plate, and
at least one pin, the at least one pin insertable into contacts in the socket electrically connected to ground,
wherein impedance discontinuity seen by signals passing through the socket from the electronic package pins is minimized.
11. The conductive plate according to claim 10, wherein the electronic package is a Pin Grid Array (PGA) package.
12. The conductive plate according to claim 10, wherein the openings in the conductive plate have at least two different diameters.
13. The conductive plate according to claim 10, wherein the openings in the conductive plate are of the same diameter.
14. The conductive plate according to claim 10, wherein the conductive plate may be imbedded within a top cover of the socket.
15. The conductive plate according to claim 10, wherein the conductive plate may be imbedded within a base of the socket.
16. A method for reducing impedance discontinuity in a socket comprising:
identifying a pin used in an electronic package;
identifying a contact used in a socket;
determining an inductance when the pin is inserted into the contact;
determining a desired impedance between the pin inserted into the contact and a conductive plate electrically connected to ground, the pin passing through a hole in the conductive plate to be inserted into the contact; and
determining a diameter of the hole in the conductive plate that achieves the desired impedance, wherein impedance discontinuity seen by a signal passing through the socket from the pin is minimized.
17. The method according to claim 16, further comprising identifying a pin used in a Pin Grid Array (PGA) package.
18. The method according to claim 16, further comprising the pin passing through holes in the conductive plate to be inserted into the contact, the holes having at least two different diameters for pins from the electronic package.
19. The method according to claim 16, further comprising the pin passing through holes in the conductive plate to be inserted into the contact, the holes being of the same diameter.
20. The method according to claim 16, further comprising imbedding the conductive plate within a top cover of the socket.
21. The method according to claim 16, further comprising embedding the conductive plate within a base of the socket.