All The Claims

1. A method of recovering a client clock comprising:
at a generator, receiving frame events indicative of frame boundaries;
at the generator, counting the amount of client data received between frame events to get a raw count,
at the generator, low pass filtering the raw count to get a smoothed value;
at a receiver, receiving an indication of the smoothed value; and
at the receiver, smoothing the indication using a low-pass filter and using the smoothed indication to produce a client data rate.
2. The method of claim 1, wherein the smoothed indication is divided by a frame event period to get client data rate.
3. The method of claim 2, wherein the receiver produces a clock from the client data rate.
4. The method of claim 3, wherein the clock is sent to a phase lock loop (PLL) to produce an improved clock.
5. The method of claim 1, wherein the receivers and generators are configurable for multiple protocols.
6. The method of claim 1, wherein the receivers and generators are configurable for optical protocols.
7. The method of claim 1, wherein the generator is adapted to map an ODUx signal into an OPUy signal where y is greater than x.
8. The method of claim 1, wherein the indication is a non-integer value.
9. The method of claim 1, wherein multiple configurable receivers and generators are on a single chip.
10. The method of claim 1, wherein in a Generic Framing Procedure (GFP) mode, client management frames are used to send the smoothed value as the indication.
11. The method of claim 1, wherein in an asynchronous mapping procedure (AMP) mode, the indication is a differential count produced from the smoothed count.
12. The method of claim 1, wherein a receiver sends outputs to multiple additional receivers configured for another protocol.
13. The method of claim 1, wherein the generator sends outputs to multiple additional generators.
14. The method of claim 1, wherein the indications and the smoothed values are timestamps and wherein the receiver and generator stores valid ranges of timestamps and keep any generated timestamp andor clock within the valid ranges.
15. The method of claim 1, wherein the generator stores a last known good rate value and upon a client signal fail, continues to send a signal at the last known good rate.
16. The method of claim 1, wherein the receiver continues to generate clocks andor frame event rates upon a signal failure.
17. An apparatus comprising:
multiple generators adapted to receive frame events and to count an amount of client data received between frame events to get a raw count, the multiple configurable generators adapted to low-pass filter the raw count to produce a smoothed value and to use the smoothed value to produce an indication of the smoothed value; and
multiple receivers adapted to smooth the indication using a low-pass filter and use the smoothed indication to produce a client data rate.
18. The apparatus of claim 17, wherein the smoothed indication is divided by a frame event period to get client data rate.
19. The apparatus of claim 18, wherein the receiver produces a clock from the client data rate.
20. The apparatus of claim 19, wherein the clock is sent to a phase lock loop (PLL) to produce an improved clock.
21. The apparatus of claim 17, wherein the receivers and generators are configurable.
22. The apparatus of claim 17, wherein the receivers and generators are configurable for optical protocols.
23. The apparatus of claim 17, wherein the generator is adapted to map an ODUx signal into an OPUy signal where y is greater than x.
24. The apparatus of claim 17, wherein the indication is a non-integer value.
25. The apparatus of claim 17, wherein in a Generic Framing Procedure (GFP) mode, client management frames are used to send the smoothed value as the indication.
26. The apparatus of claim 17, wherein in an asynchronous mapping procedure (AMP) mode, the indication is a differential count.
27. The apparatus of claim 17, wherein a receiver sends outputs to multiple additional receivers configured for another protocol.
28. The apparatus of claim 17, wherein the generator sends outputs to multiple additional generators.
29. The apparatus of claim 17, wherein the indications and the smoothed values are timestamps and wherein the receiver and generator stores valid ranges of timestamps and keep any generated timestamp andor clock within the valid ranges.
30. The apparatus of claim 17, wherein the generator stores a last known good rate value and upon a client signal fail, continues to send a signal at the last known good rate.
31. The apparatus of claim 17, wherein the receiver continues to generate clocks andor frame event rates upon a signal failure.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. An imager device, comprising:
a first substrate comprising an array of photosensitive elements formed thereon;
a first conductive layer formed above the first substrate;
a first conductive member extending through the first substrate, the first conductive member being conductively coupled to the first conductive layer;
a standoff structure formed above the first substrate;
a second conductive layer formed above the standoff structure, the second conductive layer being conductively coupled to the first conductive layer; and
an electrically powered device positioned above the standoff structure, the electrically powered device being electrically coupled to the second conductive layer.
2. The device of claim 1, wherein the first conductive layer is formed on a surface of the substrate.
3. The device of claim 1, wherein the first conductive member is a through-wafer interconnect structure.
4. The device of claim 1, wherein the standoff structure is positioned above the first conductive member.
5. The device of claim 1, wherein the second conductive layer is formed on a surface of the standoff structure.
6. The device of claim 1, wherein the electrically powered device comprises at least one of an electrically powered lens, an electrically powered aperture, an electrically powered filter and an electrically powered light.
7. The device of claim 1, wherein the first substrate comprises at least one of silicon, silicon germanium and an SOI structure.
8. The device of claim 1, wherein the first conductive layer comprises at least one of aluminum, titanium, copper and nickel.
9. The device of claim 1, wherein the second conductive layer comprises at least one of platinum, gold, titanium-aluminum, copper and copper-nickel.
10. The device of claim 1, further comprising a third conductive layer that conductively couples the electrically powered device to the second conductive layer.
11. The device of claim 1, further comprising a second substrate and third conductive layer formed on the second substrate, the third conductive layer being conductively coupled to the second conductive layer and the electrically powered device.
12. The device of claim 1, further comprising a second substrate having a second conductive member that extends through the second substrate, the second conductive member being conductively coupled to the second conductive layer.
13. An imager device, comprising:
a first substrate comprising an array of photosensitive elements;
an electrically powered device positioned above the first substrate;
a standoff structure positioned above the first substrate; and
a first conductive member extending through the first substrate, the first conductive member being positioned at least partially under the standoff structure, wherein the first conductive member defines a portion of a conductive path for the electrically powered device.
14. The device of claim 13, further comprising a first conductive layer that is formed on a surface of the first substrate and wherein the first conductive layer is conductively coupled to the first conductive member.
15. The device of claim 13, wherein the first conductive member is a through-wafer interconnect structure.
16. The device of claim 13, wherein the entirety of the first conductive member is positioned under the standoff structure.
17. The device of claim 14, further comprising a second conductive layer formed above the standoff structure and wherein the second conductive layer is conductively coupled to the first conductive layer.
18. The device of claim 17, further comprising a third conductive layer that conductively couples the electrically powered device to the second conductive layer.
19. The device of claim 17, further comprising a second substrate and third conductive layer formed on the second substrate, the third conductive layer being conductively coupled to the second conductive layer and the electrically powered device.
20. The device of claim 17, further comprising a second substrate having a second conductive member that extends through the second substrate, the second conductive member being conductively coupled to the second conductive layer.
21. An imager device, comprising:
a first substrate comprising an array of photosensitive elements formed thereon;
a first conductive layer formed on the first substrate;
a first conductive member extending through the first substrate, the first conductive member being conductively coupled to the first conductive layer;
a standoff structure formed above the first conductive member;
a second conductive layer formed above the standoff structure, the second conductive layer being conductively coupled to the first conductive layer; and
an electrically powered device positioned above the standoff structure, the electrically powered device being electrically coupled to the second conductive layer.
22. The device of claim 21, wherein the first conductive member is a through-wafer interconnect structure.
23. The device of claim 21, wherein the second conductive layer is formed on a surface of the standoff structure.
24. An imager device, comprising:
a first substrate comprising an array of photosensitive elements formed thereon;
a first conductive layer formed above the first substrate;
a first conductive member extending through the first substrate, the first conductive member being conductively coupled to the first conductive layer;
a standoff structure formed above the first substrate;
a second conductive layer formed above the standoff structure, the second conductive layer being conductively coupled to the first conductive layer;
an electrically powered device positioned above the first substrate; and
a second substrate positioned above the standoff structure, the second substrate having a second conductive member extending through the second substrate, the second conductive member being conductively coupled to the second conductive layer and the electrically powered device.
25. The device of claim 24, wherein the first conductive layer is formed on a surface of the first substrate.
26. The device of claim 24, wherein the first conductive member is a through-wafer interconnect structure.
27. The device of claim 24, wherein the second conductive member is a through-wafer interconnect structure.
28. The device of claim 24, wherein the standoff structure is positioned under the second conductive member.
29. The device of claim 24, wherein the second conductive layer is formed on a surface of the standoff structure.
30. The device of claim 24, wherein the electrically powered device comprises at least one of an electrically powered lens, an electrically powered aperture, an electrically powered filter and an electrically powered light.
31. The device of claim 24, further comprising a third conductive layer formed on the second substrate, the third conductive layer being conductively coupled to the electrically powered device and the second conductive member extending through the second substrate.
32. The device of claim 24, further comprising a bond pad formed on a surface of the second substrate, the bond pad being conductively coupled to the second conductive member.
33. An imager device, comprising:
a first substrate comprising an array of photosensitive elements;
a first conductive layer formed on the first substrate;
a first conductive member extending through the first substrate, the first conductive member being conductively coupled to the first conductive layer;
a standoff structure formed above the first conductive member;
a second conductive layer formed above the standoff structure, the second conductive layer being conductively coupled to the first conductive layer; and
an electrically powered device positioned above the standoff structure, the electrically powered device comprising a second substrate having a second conductive member extending through the second substrate, the second conductive member being positioned above the standoff structure and being conductively coupled to the second conductive layer.
34. The device of claim 33, wherein the first conductive member is a through-wafer interconnect structure.
35. The device of claim 33, wherein the second conductive member is a through-wafer interconnect structure.
36. The device of claim 33, wherein the second conductive layer is formed on a surface of the standoff structure.
37. The device of claim 33, further comprising a third conductive layer formed on the second substrate, the third conductive layer being conductively coupled to the electrically powered device and the second conductive member extending through the second substrate.
38. A method, comprising:
providing a first substrate comprising a first conductive layer and an array of photosensitive elements;
forming a conductive member that extends through the first substrate and is conductively coupled to the first conductive layer;
forming a standoff structure above the first substrate;
forming a patterned conductive layer above the standoff structure, the patterned conductive layer being conductively coupled to the first conductive layer; and
conductively coupling an electrically powered device to the patterned conductive layer positioned above the standoff structure.
39. The method of claim 38, wherein the first conductive layer is formed on a surface of the first substrate.
40. The method of claim 38, wherein the first conductive member is a through-wafer interconnect structure.
41. The method of claim 38, wherein the patterned conductive layer is formed on a surface of the standoff structure.
42. The method of claim 38, further comprising forming a third conductive layer on a second substrate, the third conductive layer being conductively coupled to the second conductive layer and the electrically powered device.
43. A method, comprising:
providing a first substrate comprising a first conductive layer and an array of photosensitive elements;
forming a first conductive member that extends through the first substrate and is conductively coupled to the first conductive layer;
forming a standoff structure above the first substrate;
forming a patterned conductive layer above the standoff structure, the patterned conductive layer being conductively coupled to the first conductive layer;
positioning a second substrate above the standoff structure, the second substrate having a second conductive member extending therethrough; and
conductively coupling the second conductive member to the patterned conductive layer positioned above the standoff structure.
44. The method of claim 43, further comprising conductively coupling an electrically powered device to the second conductive member.
45. The method of claim 43, wherein the first conductive layer is formed on a surface of the first substrate.
46. The method of claim 43, wherein the first conductive member is a through-wafer interconnect structure.
47. The method of claim 43, wherein the second conductive member is a through-wafer interconnect structure.
48. The method of claim 43, wherein the second conductive layer is formed on a surface of the standoff structure.
49. The method of claim 43, further comprising forming a third conductive layer above the second substrate, wherein the third conductive layer conductively couples the second conductive member to an electrically powered device.
50. A method, comprising:
providing a first substrate comprising an array of photosensitive elements and a standoff structure positioned above a surface of the first substrate;
forming an electrically conductive structure, a first portion of which extends under the standoff structure;
positioning an electrically powered device above the first substrate; and
conductively coupling the electrically conductive structure to the electrically powered device.
51. The method of claim 50, wherein the electrically conductive structure also comprises a second portion that is positioned under the standoff structure and extends through the first substrate.
52. The method of claim 51, wherein the second portion is a through-wafer interconnect structure.
53. The method of claim 50, further comprising supplying electrical power to the electrically powered device through the electrically conductive structure.

1. A seatbelt system for generating electrical energy, comprising:
a first engagement unit configured to rotate upon movement of a portion of a seatbelt in contact therewith;
a second engagement unit having at least one portion configured to rotatably engage the first engagement unit and to rotate relative to movement of the first engagement unit in an engaged position; and
an electrical energy generation unit operably coupled to the second engagement unit and configured to generate electrical energy upon rotation of the second engagement unit.
2. The seatbelt system of claim 1, further comprising a charging mechanism configured to charge a battery with the electrical energy generated by the electrical energy generation unit.
3. The seatbelt system of claim 1, further comprising a locking mechanism configured to cause the first and second engagement units to engage so that the first engagement unit may rotate the second engagement unit.
4. The seatbelt system of claim 3, further comprising a sensor configured to sense engagement of a lock insert at one end of the seatbelt with a lock and to move the locking mechanism so that the first and second engagement units disengage.
5. The seatbelt system of claim 1, wherein each of the first and second engagement units comprise a gear having a plurality of teeth, the plurality of teeth on the gear of the first engagement unit configured to engage the plurality of teeth on the gear of the second engagement unit.
6. The seatbelt system of claim 1, wherein the electrical energy generation unit comprises a motor having electrical energy generation circuitry that rotates in response to rotation of the second engagement unit to generate the electrical energy.
7. The seatbelt system of claim 1, further comprising a rewinding mechanism disposed adjacent the first engagement unit and configured to unwind the portion of the seatbelt when the seatbelt is pulled and to wind the portion of the seatbelt when the seatbelt is released.
8. A vehicle configured to generate electrical energy from the use of a seatbelt, comprising:
a seat disposed within the vehicle;
a seatbelt associated with the seat;
a seatbelt rewinding mechanism attached to the seatbelt and configured to release and retract at least a portion of the seatbelt;
a first engagement unit rotatably engaged with at least one region of the seatbelt so that the first engagement unit rotates upon movement of the seatbelt by the seatbelt rewinding mechanism;
a second engagement unit configured to rotatably engage the first engagement unit so that, upon engagement, the second engagement unit rotates relative the first engagement unit; and
an electrical energy generation unit configured to generate electrical energy upon rotation of the second engagement unit.
9. The vehicle of claim 8, further comprising a charging mechanism configured to convert the electrical energy into a form suitable for charging a battery.
10. The vehicle of claim 9, wherein the battery is operably coupled to an electrical system of the vehicle.
11. The vehicle of claim 8, wherein the seatbelt rewinding mechanism further comprises a spring configured to retract the seatbelt when the seatbelt is released from a seatbelt lock and configured to release the seatbelt when the seatbelt is attached to the seatbelt lock.
12. The vehicle of claim 11, further comprising a locking mechanism configured to cause the first and second rotational engagement units to engage, the locking unit causing the engagement when the seatbelt is not attached to the seatbelt lock.
13. The vehicle of claim 12, wherein the locking mechanism comprises a bracket or clamp positioned adjacent the first and second engagement units.
14. The vehicle of claim 8, wherein the first and second engagement units each comprise a plurality of teeth configured to engage one another.
15. A method for fabricating a seatbelt system, comprising:
positioning a first engagement unit in rotatable engagement with a second engagement unit, the first engagement unit configured to engage a portion of a seatbelt and to rotate upon movement of the seatbelt; and
operably coupling the second engagement unit to an electrical energy generating mechanism configured to generate electrical energy in response to rotation of the second unit.
16. The method of claim 15, further comprising disposing a moveable locking mechanism adjacent at least one of the first and second engagement unit, the moveable locking mechanism configured to disengage and engage the first and second engagement units.
17. The method of claim 15, further comprising positioning a seatbelt rewinding mechanism adjacent the first engagement unit, the seatbelt rewinding unit configured to retract or release the seatbelt.
18. The method of claim 15, wherein positioning a first engagement unit in rotatable engagement with a second engagement unit comprises engaging teeth on a circumferential edge of the first engagement unit with teeth on a circumferential edge of the second engagement unit.
19. The method of claim 15, wherein operably coupling the second engagement unit to an electrical energy generating mechanism comprises operably coupling the second engagement unit to an AC motor.
20. The method of claim 15, further comprising operably coupling the electrical energy generating mechanism to a charging mechanism configured to store the electrical energy in a battery.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. Gas block apparatus for a firearm barrel having a gas bore through which combustion gases flow comprising in combination:
a first portion including
a block having a bottom disposed on the firearm barrel and a rear face,
a first bore in the block extending upwardly into the block from the bottom,
a second bore communicating with the first bore and extending to the rear face;

a clamp portion having a top disposed on the firearm barrel and aligned with the block;
means for aligning the first bore of the block with the gas bore in the barrel through which the combustion gases flow; and
means for securing the clamp portion to the first portion.
2. The apparatus of claim 1 in which the means for aligning the first bore of the block with the gas bore in the barrel comprises a slot on the barrel and a key on the clamp portion, and the key extends into the slot.
3. The apparatus of claim 1 in which the means for aligning the first bore with the gas bore in the barrel comprises an alignment pin on the clamp portion and a hole in the barrel, and the pin extends into the hole.
4. The apparatus of claim 1 in which the means for aligning the first bore with the gas bore in the barrel comprises an alignment pin on the barrel and a hole in the clamp portion, and the pin extends into the hole.
5. The apparatus of claim 1 in which the means for securing the clamp portion to the first portion includes a pair of screws extending between the first portion and the clamp portion.
6. The apparatus of claim 1 in which the second bore receives a tube through which the combustion gases flow from the block.
7. The apparatus of claim 1 in which the first portion further includes at least a single set of rails for securing desired elements to the block.
8. The apparatus of claim 1 in which the first portion further includes a plurality of sets of rails for securing a plurality of desired elements to the block.
9. The apparatus of claim 1 in which the means for aligning the first bore in the block with the gas bore in the barrel includes a pair of recesses on the barrel and a pair of screws disposed in the recesses and extending from the clamp portion to the first portion.
10. The apparatus of claim 9 in which the means for securing the clamp portion to the first portion includes the pair of screws disposed in the pair of recesses and extending from the clamp portion to the first portion.