All The Claims

1. A device for providing an agricultural ground working implement with down pressure and protective hydraulic cushion for obstacle impact comprising:
a pair of inner plates which are removably mounted to a coulter wheel by a hub bolted to the two inner plates on one end and a bearing on an opposing end;
the two inner plates are retained within two outer plates;
the two outer plates are removably attached on one end by a plurality of bolts, opposite the working surface of the coulter wheel with respect to where it would contact the ground;
a pivot bolt also connects the outer plates to the inner plates on an opposing end from the coulter wheel;
a hydraulic cylinder is removably mounted between two tabs located on outer plates and the opposing end of the hydraulic cylinder is mounted between the inner plates adjacent to the pivot bearing and opposite the coulter wheel;
the hydraulic cylinder is connected to a hydraulic accumulator.
2. The device of claim 1, further comprising
one or more trash wheels adjacent and parallel to the outer plates;
a pivoting trash wheel arms are bolted to the outer plates and inner plates using a single bolt going through the front pivot hole and bearing of the inner plates;
a retaining bar bolted to the outer plate above and below the pivoting trash wheel arm limits both vertical and horizontal movement;
one or more spacers are used to create a gap between the pivoting trash wheel plate and the outer plate;
plastic wear panels are bolted to the outer plate, retaining bar, and pivoting trash wheel arm to create a wear surface that can be easily and quickly repaired or replaced due to friction between the moving plates and pivoting trash wheel arm;
the trash wheels are bolted to the opposing end of the pivoting trash wheel arm and pivoting retaining bolt.
3. The device of claim 2, wherein the trash wheels can be bolted parallel to the coulter wheel or at any desired angle. The outer plates can also be provided with stops to limit the up and down motion of the trash wheels.
4. The device of claim 1, wherein the device is attached to the machine frame using U-bolts in the same manner as the spring loaded coulter wheels.
5. The device of claim 1, wherein the device is connected to the hydraulic system of the pulling tractor to provide the necessary pressure and force on the hydraulic cylinder required for proper operation.
6. The device of claim 1, wherein the device of the present invention is a replacement for a standard spring loaded coulter wheel on a corn planter or any similar agricultural or farming machine.
7. The device of claim 1, wherein the hub of the preset invention for attaching the coulter wheel to the inner is comprised of
a plurality of bolts that attached the hub to the wheel;
a sealed bearing that is recessed within the body of the hub; and
a dirt shield placed over the sealed bearing and retained within the recess.
8. The device of claim 1, wherein
inner plates are extended beyond the outer plates and the hydraulic cylinder is re-positioned to accommodate fame mounting where the hydraulic cylinder is mounted in a location underneath the frame of the vertical till machine instead of forward of the frame.
9. A device for providing an agricultural ground working implement with down pressure and protective hydraulic cushion for obstacle impact comprising:
a pair of inner plates which are removably mounted to two coulter wheels by a hub bolted to shaft connecting the two inner plates on one end and a bearing on an opposing end where the coulter wheels are secured to the shaft and inner plates;
the two inner plates are retained within two outer plates;
the two outer plates are removably attached on one end by a plurality of bolts, opposite the working surface of the coulter wheels with respect to where they would contact the ground;
a pivot bolt also connects the outer plates to the inner plates on an opposing end from the coulter wheels;
a hydraulic cylinder is removably mounted between two tabs located on outer plates and the opposing end of the hydraulic cylinder is mounted between the inner plates adjacent to the pivot bearing and opposite the coulter wheel;
the hydraulic cylinder is connected to a hydraulic accumulator.
10. The device of claim 9, wherein
a pair of inner plates are mounted to an axle shaft;
the axle shaft is mounted to a pair of coulter wheels by a hub mounted on each opposing end of the axle shaft;
against one side of a coulter wheel, a bearing, and dirt shields are used to secure the coulter wheel to the inner plate.
11. The device of claim 9, wherein
inner plates are extended beyond the outer plates and the hydraulic cylinder is re-positioned to accommodate fame mounting where the hydraulic cylinder is mounted in a location underneath the frame of the vertical till machine instead of forward of the frame.
12. A device for providing an agricultural ground working implement with down pressure and protective hydraulic cushion for obstacle impact comprising:
independent wheel arms affixed to inner plates;
a cylinder is connected on one end to the plates by a shaft which secures the cylinder to the plates by a bolt creating a pivot shaft; and
the opposing end of the cylinder is connected to the independent wheel arms using a second shaft, which when the cylinder is cycled in and out creates a corresponding up and down motion of the opposing arm ends and wheels.
13. The device of claim 12, wherein
the plates are attached to two pivoting wheel arm, each with a corresponding wheel;
each of the wheel arms is controlled by a corresponding hydraulic cylinder, where the extension or compression of the hydraulic cylinders correspond to an up and down movement of the corresponding wheels;
the plates are secured to each other by a first, fixed cylinder;
a second, fixed, cylinder connects the plates together and maintains a fixed distance between the plates;
the second, fixed cylinder also provides the fixed mounting points for the two hydraulic cylinders;
a third fixed cylinder keeps the plates at a fixed distance while also providing the pivot point for the wheel arms where the extension or compression of the hydraulic cylinders correspond to an up and down movement of the corresponding wheels.
14. The device of claim 13, further comprising a cleaner bar running parallel to the blades removing excess dirt and debris as the blades rotate.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A manufacturing method of circuit board comprising:
a step of manufacturing an upper board having an opening and forming a circuit and an insulation coat film layer on a surface layer,
a step of manufacturing a lower board forming a circuit and an insulation coat film layer on a surface layer,
a step of forming conductive holes filled with conductive paste in through-holes, in a connection sheet between boards having an opening, and
a step of stacking up, heating and pressing the lower board, the connection sheet between boards, and the upper board,
wherein the upper board and the lower board are made of cured resin impregnated in a base material, and
the material of the connection sheet between boards is an adhesion layer containing inorganic filler and thermosetting resin and not containing padding formed on a carrier film.
2. The manufacturing method of circuit board of claim 1, wherein the coefficient of thermal expansion in thickness direction of the sheet material between boards is lower than the coefficient of thermal expansion in thickness direction of the material for composing the upper board and the lower board.
3. The manufacturing method of circuit board of claim 1, wherein an insulation coat film layer is formed selectively at least on one side of the upper board and the lower board.
4. The manufacturing method of circuit board of claim 1, wherein an insulation coat film layer is formed at an end face of the opening of the upper board.
5. The manufacturing method of circuit board of claim 1, wherein an insulation coat film layer is formed in convex shape at scattered spots on the upper side of the upper board, and on the side of the lower board contacting with the connection sheet between boards.
6. The manufacturing method of circuit board of claim 1, wherein the area of the opening of the connection sheet between boards is wider than the area of the opening of the upper board.
7. The manufacturing method of circuit board of claim 1, wherein conductive holes filled with conductive paste in through-holes are formed in the upper board and the lower board, and the circuits on the surface layers of the both are connected between layers by way of the conductive holes.
8. The manufacturing method of circuit board of claim 1, wherein the step of heating and pressing is followed by a step of forming an insulation coat film layer selectively in a region excluding a part of the surface of the upper board and the lower board, and a step of forming a gold plating layer on the exposed surface.
9. The manufacturing method of circuit board of claim 1, wherein the step of forming the connection sheet between layers includes:
a step of forming an opening in a sheet material forming the adhesion layer on the carrier film,
a step of laminating a parting film on the opposite side of the carrier film of the sheet material,
a step of peeling the carrier film,
a step of laminating other parting film on the peeled side of the carrier film in a vacuum state, and forming a contact portion contacting with the parting film on both sides in the opening,
a step of drilling and forming through-holes,
a step of filling the through-holes with conductive paste, and
a step of peeling the parting film.
10. The manufacturing method of circuit board of claim 9, wherein the step of forming the opening in the sheet material is conducted by laser processing.
11. The manufacturing method of circuit board of claim 1, wherein the step of stacking up, heating and pressing the lower board, the connection sheet between boards, and the upper board is intended to laminate a parting film on one side of the connection sheet between boards, and includes:
a step of stacking up the connection sheet between boards on the lower board by contacting with the opposite side of the forming side of the parting film, a step of bonding the entire surface temporarily by laminating or heat pressing the stacked layers in a vacuum state, a step of peeling the parting film, and a step of stacking up the upper board on the connection sheet between boards.
12. The manufacturing method of circuit board of claim 1, wherein the step of manufacturing the upper board, the step of manufacturing the connection sheet between boards, and the step of stacking up, heating and pressing the lower board, the connection sheet between boards, and the upper board include:
a step of forming a board by stacking up and adhering the upper board before forming the opening and the connection sheet between boards before forming the opening, a step of forming an opening in the board, and a step of stacking up the board to the lower board so as to contact with the side of the connection sheet between boards of the board.
13. The manufacturing method of circuit board of claim 1, wherein the step of manufacturing the upper board includes:
a step of laminating parting films on both side of a board material in B-stage state,
a step of forming through-holes,
a step of filling the through-holes with conductive paste,
a step of peeling the parting films,
a step of stacking up, heating and pressing metal foils on both sides of the board material,
a step of forming circuits in metal foils and removing the metal foils in a partial region including the central portion, and
a step of forming an opening by removing the board material in a partial region including the central portion of the board material.
14. The manufacturing method of circuit board of claim 1, wherein the upper board or the lower board is a multi-layer board, and the circuits of the surface layer connect between layers with the inner layer board as core board by way of conductive holes formed by conductive plating.
15. A circuit board comprising:
an upper board having an opening and forming a circuit and an insulation coat film layer on a surface layer,
a lower board forming a circuit and an insulation coat film layer on a surface layer,
the both being stacked up by way of a connection sheet between boards having an opening and forming conductive holes for interlayer connection, and
a cavity formed by the opening of the upper board and the opening of the connection sheet between layers,
wherein the upper board and the lower board are made of cured resin impregnated in a base material, and
the connection sheet between boards is an adhesion layer containing inorganic filler and thermosetting resin and not containing padding, being cured in the thermosetting resin.
16. The circuit board of claim 15, wherein the end face of the opening of the connection sheet between boards is formed of a modified layer composed of a filler and a thermosetting resin modified by laser processing.
17. The circuit board of claim 15, wherein the insulation coat film layer is formed in convex shape at scattered spots on the stacking and adhering side of the connection sheet between boards with the upper board or the lower board, and pre-fitted into the adhesion layer of the connection sheet between boards.
18. The circuit board of claim 17, wherein the thermosetting resin for composing the insulating coat film layer is a same material as the adhesion layer of the connection sheet between boards.
19. A circuit board comprising:
an upper board having an opening and forming a surface layer circuit and conductive holes for interlayer connection, and
a lower board forming a surface layer circuit and conductive holes for interlayer connection,
the both being stacked up by way of a connection sheet between boards having an opening and forming conductive holes for interlayer connection,
wherein the coefficient of thermal expansion in thickness direction of material of the connection sheet between boards is lower than the coefficient of thermal expansion in thickness direction of the material for composing the upper board and the lower board.
20. The circuit board of claim 19, wherein the upper board and the lower board are made of cured resin impregnated in a base material, and the connection sheet between boards is an adhesion layer containing inorganic filler and thermosetting resin and not containing padding, being cured in the thermosetting resin.

1. A method for forming a nanoimprint mold, the method comprising:
filling nanoholes formed in a substrate with a material to form nanopillars on the substrate;
performing at least a first partial oxidation of the nanopillars and then removing at least a portion of the oxidized material;
depositing a hard substance on the nanopillars to begin forming the nanoimprint mold on the nanopillars;
depositing a second material on the hard substance; and
removing the substrate from a molding surface of the nanoimprint mold.
2. The method of claim 1, wherein filling the nanoholes formed in a substrate with a material to form nanopillars further comprises depositing additional material on at least the nanopillars, wherein the material is preferentially deposited on the nanopillars at a faster rate than on the substrate.
3. The method of claim 1, wherein the nanoholes in a substrate are arranged in a geometric pattern.
4. The method of claim 1, wherein the material comprises silicon.
5. The method of claim 1, wherein depositing a hard substance comprises depositing metal in a space between the nanopillars, wherein the nanopillars define a shape of the molding surface.
6. The method of claim 1, wherein removing the substrate from a molding surface comprises:
grinding the substrate;
oxidizing any remaining substrate and the nanopillars; and
etching the remaining substrate and nanopillars from the molding surface.
7. The method of claim 1, further comprising depositing a layer on the nanomold surface, the layer comprising at least one of gold, an F-containing polymer, or a self assembled monolayer.
8. The method of claim 1, further comprising attaching a second substrate to a surface opposite the molding surface, the second substrate comprising a handle.
9. The method of claim 1, wherein the molding surface comprises nanowells having a shape that is formed from the nanopillars.
10. The method of claim 1, wherein depositing a hard substance and depositing a second material are repeated two or more times to form layers of the hard substance and of the second material in the nanoimprint mold, wherein the layers of the hard substance and of the second material each have a thickness between about 3 nanometers and about 30 nanometers.
11. The method of claim 10:
wherein the second material provides flexibility to the nanoimprint mold and the second material comprises one of carbon nanotube and graphene and aluminum; and
wherein the hard substance comprises at least one of metal carbide and iron carbide.
12. A method for forming a nanoimprint mold, the method comprising:
forming nanopillars on a substrate with a first material;
partially oxidizing the nanopillars and a portion of the substrate between the nanopillars;
depositing a second material on the nanopillars, wherein the second material is harder than the first material and wherein the nanopillars define a shape of a molding surface of the nanoimprint mold; and
removing the substrate and the nanopillars from the molding surface of the nanoimprint mold.
13. The method of claim 12, wherein forming nanopillars on a substrate with a first material further comprises:
forming nanoholes in the substrate;
filling the nanoholes with the first material using photoresist to form the nanopillars;
depositing additional first material on the nanopillars, wherein some of the additional first material is deposited on the substrate between the nanopillars;
oxidizing at least a portion of the nanopillars and the first material deposited on the substrate; and
removing the oxidized portion of the first material and the oxidized portion of the nanopillars, wherein the nanopillars are thinner than when first formed after the oxidized portion is removed.
14. The method of claim 12, further comprising depositing a layer on the molding surface, the layer comprising at least one of gold, an F-containing polymer, or a self assembled monolayer.
15. The method of claim 12, further comprising depositing additional layers on the second material, wherein the additional layers include at least an additional layer of the first material and an additional layer of the second material, wherein at least some of the additional layers are oxidized.
16. The method of claim 15, wherein spaces between the nanopillars are filled by the additional layers when depositing the additional layers.
17. The method of claim 15, further comprising oxidizing the substrate and the nanopillars.
18. The method of claim 17, wherein the nanopillars are arranged in a geometric pattern.
19. The method of claim 17, wherein the first material comprises silicon and the second material comprises at least one of metal carbide and iron carbide.
20. A method for forming a nanoimprint mold, the method comprising:
forming nanopillars in a defined region on a substrate with a first material;
depositing additional first material on the nanopillars to increase a height of the nanopillars;
performing a first oxidation to oxidize a portion of the nanopillars, wherein the additional first material deposited on the substrate between the nanopillars is oxidized;
removing both the oxidized additional first material on the substrate and at least some of the portion of the nanopillars that has been oxidized;
performing a second oxidation to oxidize a second portion of the nanopillars and to oxidize a portion of the substrate;
depositing a second material on the oxidized nanopillars and on the oxidized substrate, wherein the second material is harder than the first material and harder than the oxidized first material; and
depositing additional layers on the second material, wherein the additional layers fill spaces between the nanopillars; and
removing the substrate and the nanopillars effective to define a molding surface including nanowells in the defined region.
21. The method of claim 20 further comprising depositing a layer on the molding surface, the layer comprising at least one of gold, an F-containing polymer, or a self assembled monolayer.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method performed on a computing device for distributing a plurality of financial instruments between a plurality of accounts, said method comprising:
calculating and storing in a memory location an average instrument value for said plurality of financial instruments; and
determining and storing in a memory location a distribution of said plurality of financial instruments among said plurality of accounts, said distribution determined by iteratively allocating said instruments among said accounts to decrease a total of: differences between a current average instrument value for each of the accounts and the average instrument value for said plurality of instruments.
2. The method of claim 1, further comprising:
a) allocating said instruments among the accounts;
b) calculating and storing in a memory location an error for each account and an overall error for the allocation, wherein said error for each account is based on a difference between a current average instrument value for said account and the average instrument value for said plurality of instruments, and wherein said overall error for the allocation is based on a sum of said errors for each account;
c) reallocating the instruments in the accounts to produce a different instrument allocation;
d) calculating and storing in a memory location a new error for each account and a new overall error for the different instrument allocation; and
e) after steps c) and d) have been performed for at least two possible allocations, selecting as said distribution and storing in a memory location an allocation having a lowest overall error, and allocating the instruments according to the selected allocation.
3. The method of claim 2, further comprising:
f) determining whether the overall error for a possible allocation is zero, and if so, then selecting that possible allocation as the distribution.
4. A method performed on a computing device for distributing a plurality of instruments between a plurality of accounts, said method comprising:
a) calculating an average instrument value for all of the instruments;
b) defining memory locations representing said accounts and instrument positions within said accounts;
c) allocating the values of said instruments into said memory locations, thus creating a representative allocation of said instruments;
d) calculating an error for each representative account and an overall error for the representative allocation, wherein said error for each account is based on a difference between a current average instrument value for said account and the average instrument value, and wherein said overall error for the allocation is based on a sum of said errors for each account;
e) reallocating the values of said instruments into said memory locations to produce a different representative allocation;
f) calculating a new error for each representative account and a new overall error for the different representative allocation; and
g) after steps e) and f) have been performed for at least two possible allocations, selecting as said distribution a representative allocation having a lowest overall error, and allocating the instruments according to the selected allocation.
5. The method of claim 4 further comprising:
h) determining whether the overall error for a possible representative allocation is zero, and if so, then selecting that possible representative allocation as the distribution.
6. A method performed on a computing device for distributing a plurality of instruments between a plurality of accounts, said method comprising:
a) calculating and storing in a memory location an average instrument value for said instruments;
b) allocating the instruments randomly into instrument positions in the plurality of accounts;
c) sorting said accounts into:
a first group where a current average value of the account is greater than the average instrument value;
a second group where a current average value of the account is less than the average instrument value; and
a third group where a current average value of the account is equal to the average instrument value;

d) selecting a first account from the first group and a second account from the second group;
e) calculating and storing in a memory location a first error based on a difference between a current average value for the first account and the average instrument value, and a second error based on a difference between the average instrument value and a current average value for the second account;
f) exchanging an instrument in the second account with an instrument in the first account;
g) calculating and storing in a memory location a new first error as an absolute value of a difference between a new current average value for the first account and the average instrument value, and a new second error as an absolute value of a difference between the average instrument value and a new current average value for the second account;
h) determining whether a sum of the new first error and the new second error is less than a sum of the first error and the second error; and if so, then reapplying step c) to reevaluate the distribution and attempt further improvement; and if not, then returning the exchanged instruments to their respective accounts; and
i) determining whether all possible instrument combinations between all accounts in the first group and all accounts in the second group have been evaluated; and if not, then reapplying step d) to select a different instrument combination; and if so, then stopping.
7. The method of claim 6, wherein step d) includes selecting an account with the largest current average from said first group and selecting an account with the smallest current average from said second group, and wherein step f) includes:
selecting a second instrument in said second account;
selecting a first instrument in said first account having a value within a range comprising the value of the second instrument and the value of the second instrument plus two times a number of instruments in the second account times a result of: the difference between the average instrument value and the current average value for the second account; and
exchanging said second instrument with said first instrument.
8. The method of claim 7, wherein there are at least two instruments in said first account that have a value within the range, wherein step f) includes selecting a smallest instrument within the range described in said first account as said first instrument.
9. A method performed on a computing device for distributing a plurality of instruments between a plurality of accounts, said method comprising the steps of:
a) calculating an average instrument value for all of the instruments;
b) defining memory locations representing said accounts and instrument positions within said accounts;
c) randomly allocating values of said instruments into said memory locations to create a representative allocation of said instruments;
d) calculating an account average instrument value for each representative account;
e) sorting said representative accounts into:
a first group where the average account values are greater than an overall average instrument value;
a second group where the average account values are less than the overall average instrument value; and
a third group where the average account values are equal to the overall average instrument value;

f) selecting a first representative account from said first group, and calculating errorA as a difference between the average value for the first account and the average instrument value;
g) selecting a second representative account from said second group, and calculating errorB as a difference between the average instrument value and the average value for the second account;
h) exchanging an instrument value in said second account with an instrument value in said first account, and calculating new average values for each of said first account and said second account;
i) calculating new_errorA as a difference between the new average value for the first account and the average instrument value; and calculating new_errorB as a difference between the average instrument value and the new average value for the second account;
j) determining if new_errorA plus new_errorB is less than errorA plus errorB, such that the exchange has resulted in an improved allocation and, if so, then returning to step e) to reevaluate the improved allocation and attempt further improvement; and if not, then returning the exchanged instrument values to their original accounts;
k) determining if all possible instrument value combinations between the first group and the second group have been tried and, if not, then returning to step f) to select a different instrument value combination; and if so, then distributing said instruments to said accounts according to said representative allocation.
10. The method of claim 9, wherein step f) includes selecting an account with the largest average instrument value, wherein step g) includes selecting the account with a smallest average instrument value, and wherein step h) comprises:
selecting a second instrument value in said second account;
selecting a first instrument value in said first account having a value within a range comprising the value of the second instrument and the value of the second instrument plus two times a number of instruments in the second account times a result of: a difference between the overall average instrument value and the account average instrument value for the second account; and
exchanging said second instrument value with said first instrument value.
11. The method of claim 10, wherein there are at least two instrument values in said first account that fall within the range, wherein step h) includes selecting the smallest instrument value within the range described in said first account as said first instrument value.
12. A computer readable storage medium having stored thereon computer executable instructions which, when executed by a processor, perform a method for distributing a plurality of instruments between a plurality of accounts, said method comprising:
a) calculating and storing in a memory location an average instrument value for said instruments;
b) allocating the instruments randomly into instrument positions in the accounts;
c) sorting said accounts into:
a first group where a current average value of the account is greater than average instrument value;
a second group where a current average value of the account is less than average instrument value; and
a third group where a current average value of the account is equal to the average instrument value;

d) selecting a first account from the first group and a second account from the second group;
e) calculating and storing in a memory location a first error as the difference between a current average value for the first account and the average instrument value, and a second error as the difference between the average instrument value and a current average value for the second account;
f) exchanging an instrument in the second account with an instrument in the first account;
g) calculating and storing in a memory location a new first error as a absolute value of a difference between a new current average value for the first account and the average instrument value, and a new second error as an absolute value of a difference between the average instrument value and a new current average value for the second account;
h) determining if a sum of the new first error and the new second error is less than a sum of the first error and the second error, such that the exchange has improved the distribution; if so, then returning to step c) to reevaluate the distribution and attempt further improvement; and if not, then returning the exchanged instruments to their respective accounts; and
i) determining if all possible instrument combinations between the first group and the second group have been evaluated; if not, then returning to step d) to select a different instrument combination; and if so, then stopping as no further improvements can be made.
13. The computer readable storage medium of claim 12, wherein step d) includes selecting an account with the largest current average from said first group and selecting an account with the smallest current average from said second group, and wherein step f) includes:
selecting a second instrument in said second account;
selecting a first instrument in said first account having a value within a range comprising between the value of the second instrument and the value of the second instrument plus two times a number of instruments in the second account times a result of: the difference between the average instrument value and the current average value for the second account; and
exchanging said second instrument with said first instrument.
14. The computer readable storage medium of claim 13, wherein there are at least two instruments in said first account that have a value within the range, wherein step f) includes selecting a smallest instrument within the range described in said first account as said first instrument.
15. A computer readable storage medium having stored thereon computer executable instructions which, when executed by a processor, perform a method for distributing a plurality of instruments between a plurality of accounts, said method comprising:
calculating and storing in a memory location an average instrument value for said plurality of financial instruments; and
determining and storing in a memory location a distribution of said plurality of financial instruments among said plurality of accounts, said distribution determined by iteratively allocating said instruments among said accounts to decrease a total of: differences between a current average instrument value for each of the accounts and the average instrument value for said plurality of instruments.
16. The computer readable storage medium of claim 15, wherein the method further comprises:
a) allocating said instruments among the accounts;
b) calculating and storing in a memory location an error for each account and an overall error for the allocation, wherein said error for each account is based on a difference between a current average instrument value for said account and the average instrument value for said plurality of instruments, and wherein said overall error for the allocation is based on a sum of said errors for each account;
c) reallocating the instruments in the accounts to produce a different instrument allocation;
d) calculating and storing in a memory location a new error for each account and a new overall error for the different instrument allocation; and
e) after steps c) and d) have been performed for at least two possible allocations, selecting as said distribution and storing in a memory location an allocation having a lowest overall error, and allocating the instruments according to the selected allocation.
17. The computer readable storage medium of claim 16, wherein the method further comprises:
f) determining whether the overall error for a possible allocation is zero, and if so, then selecting that possible allocation as the distribution.
18. A computer readable storage medium having stored thereon computer executable instructions which, when executed by a processor, perform a method for distributing a plurality of instruments between a plurality of accounts, said method comprising:
a) calculating an average instrument value for all of the instruments;
b) defining memory locations representing said accounts and instrument positions within said accounts;
c) allocating the values of said instruments into said memory locations, thus creating a representative allocation of said instruments;
d) calculating an error for each representative account and an overall error for the representative allocation, wherein said error for each account is based on a difference between a current average instrument value for said account and the average instrument value, and wherein said overall error for the allocation is based on a sum of said errors for each account;
e) reallocating the values of said instruments into said memory locations to produce a different representative allocation;
f) calculating a new error for each representative account and a new overall error for the different representative allocation; and
g) after steps e) and f) have been performed for at least two possible allocations, selecting as said distribution a representative allocation having a lowest overall error, and allocating the instruments according to the selected allocation.
19. The computer readable storage medium of claim 18, wherein the method further comprises:
h) determining whether the overall error for a possible representative allocation is zero, and if so, then selecting that possible representative allocation as the distribution.
20. A computer readable storage medium having stored thereon computer executable instructions which, when executed by a processor, perform a method for distributing a plurality of instruments between a plurality of accounts, said method comprising:
a) calculating an average instrument value for all of the instruments;
b) defining memory locations representing said accounts and instrument positions within said accounts;
c) randomly allocating values of said instruments into said memory locations to create a representative allocation of said instruments;
d) calculating an account average instrument value for each representative account;
e) sorting said representative accounts into:
a first group where the average account values are greater than an overall average instrument value;
a second group where the average account values are less than the overall average instrument value; and
a third group where the average account values are equal to the overall average instrument value;

f) selecting a first representative account from said first group, and calculating errorA as a difference between the average value for the first account and the average instrument value;
g) selecting a second representative account from said second group, and calculating errorB as a difference between the average instrument value and the average value for the second account;
h) exchanging an instrument value in said second account with an instrument value in said first account, and calculating new average values for each of said first account and said second account;
i) calculating new_errorA as a difference between the new average value for the first account and the average instrument value; and calculating new_errorB as a difference between the average instrument value and the new average value for the second account;
j) determining if new_errorA plus new_errorB is less than errorA plus errorB, such that the exchange has resulted in an improved allocation and, if so, then returning to step e) to reevaluate the improved allocation and attempt further improvement; and if not, then returning the exchanged instrument values to their original accounts;
k) determining if all possible instrument value combinations between the first group and the second group have been tried and, if not, then returning to step f) to select a different instrument value combination; and if so, then distributing said instruments to said accounts according to said representative allocation.
21. The computer readable storage medium of claim 20, wherein step f) includes selecting an account with the largest average instrument value, wherein step g) includes selecting an account with the smallest average instrument value, and wherein step h) comprises:
selecting a second instrument value in said second account;
selecting a first instrument value in said first account having a value within a range comprising the value of the second instrument and the value of the second instrument plus two times a number of instruments in the second account times a result of: a difference between the overall average instrument value and the account average instrument value for the second account; and
exchanging said second instrument value with said first instrument value.
22. The computer readable storage medium of claim 21, wherein there are at least two instrument values in said first account that fall within the range, wherein step h) includes selecting the smallest instrument value within the range described in said first account as said first instrument value.