All The Claims

1. A sewing machine comprising:
a display configured to display display information related to sewing;
a projection portion configured to project a mark having a predetermined shape toward a sewing machine bed, wherein the sewing machine bed includes a needle plate;
a processor; and
a memory configured to store computer-readable instructions therein that, when executed by the processor, cause the sewing machine to:
project, by the projection portion, the mark toward the sewing machine bed,; and
display by the display, mark display information that represents the mark and stitch type display information of a planned stitch type to be sewn, in a first positional relationship that corresponds to a second positional relationship between the position of the planned stitch type to be sewn and the position of the mark configured to be projected on the sewing machine bed, wherein the stitch type display information represents a shape of a stitch type.
2. The sewing machine according to claim 1, wherein
the computer-readable instructions further cause the sewing machine to:
change, the position of the mark projected by the projection portion,
wherein the displaying the mark display information and the stitch type display information by the display includes
displaying the mark display information and the stitch type display information by the display in the first positional relationship that corresponds to the second positional relationship between the position of the planned stitch type to be sewn and the position of the mark on the sewing machine bed after changing the position of the mark.
3. The sewing machine according to claim 1, wherein
the computer-readable instructions further cause the sewing machine to:
acquire a distance between the mark configured to be projected on the sewing machine bed by the projection portion and a predetermined reference position on the sewing machine bed; and
display distance information indicating the acquired distance.
4. The sewing machine according to claim 1, wherein
the computer-readable instructions further cause the sewing machine to:
switch between projecting the mark by the projection portion and not projecting the mark by the projection portion,
wherein the displaying the mark display information and the stitch type display information by the display includes
displaying the mark display information and the stitch type display information by the display in response to switching to projecting the mark by the projection portion, and not displaying the mark display information by the display in response to switching to not projecting the mark by the projection portion.
5. The sewing machine according to claim 1, wherein,
the memory is further configured to store a plurality of stitch type display data items and a plurality of stitch type data items respectively associated with each other as correspondence data, wherein each of the plurality of stitch type display data items represents data for displaying the stitch type display information by the display, and each of the plurality of stitch type data items represents data for sewing a stitch type; and
the computer-readable instructions further cause the sewing machine to:
select a stitch type data item for the planned stitch type from the plurality of stitch type data items,
wherein the displaying the mark display information and the stitch type display information by the display includes
displaying the stitch type display information by the display based on one stitch type display data item of the plurality of stitch type display data items, wherein the one stitch type display data item is associated with the selected stitch type data item in response to selecting the stitch type data item.
6. The sewing machine according to claim 5,
wherein the memory is further configured to store a plurality of presser foot type data items further respectively associated with the plurality of stitch type data items in the correspondence data, wherein each of the plurality of presser foot type data items represents a type of a presser foot configured to be used when a stitch type is sewn based on each of the plurality of stitch type data items, and
the computer-readable instructions further cause the sewing machine to:
display a type of the presser foot by the display, based on one presser foot type data item of the plurality of presser foot type data items, wherein the one presser foot type data item is associated with the selected stitch type data item.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A controller including a modular heat-radiation structure, said structure comprising:
a printed circuit board;
a module which generates heat, including a first main unit having a fixing hole and a lead for connecting to the printed circuit board;
a heat-radiation fin, fixed to the top face of the first main unit, for radiating heat generated in the module;
a resin-made insulating heat shield inserted between the printed circuit board and the first main unit; and
a fixing element which fixes the heat shield, the module, and the heat-radiation fin; wherein:
a lead hole for allowing the lead to pass therethrough and a first fixing hole for allowing the fixing element to pass therethrough are provided in the heat shield, and
a second fixing hole for allowing the fixing element to pass therethrough is provided in the printed circuit board;
wherein said controller comprises:
an electric power source as a source for driving the module; and
a case, having a mouth for opening the top face of the module, for mounting the printed circuit board, the module, the electric power source, and the heat shield; wherein:
the case includes a separator for separating from the electric power source the heat-radiation fin and the module.
2. A controller as recited in claim 1, wherein the separator includes:
a first separator attached to the case so as to be arranged along a side face of the heat-radiation fin, and
a second separator, being approximately U-shaped, attached to the heat shield so as to be arranged contacting or close to the first separator.
3. A controller as recited in claim 2, wherein:
the case is made of resin,
the mouth of the case is formed slightly larger than the first main unit, and
a head is provided close to and facing the bottom face of the heat-radiation fin around the mouth of the case.
4. A controller including a modular heat-radiation structure, said structure comprising:
a printed circuit board;
a module which generates heat, including a first main unit having a fixing hole and a lead for connecting to the printed circuit board;
a heat-radiation fin, fixed to the top face of the first main unit, for radiating heat generated in the module;
a resin-made insulating heat shield inserted between the printed circuit board and the first main unit; and
a fixing element which fixes the heat shield, the module, and the heat-radiation fin; wherein:
a lead hole for allowing the lead to pass therethrough and a first fixing hole for allowing the fixing element to pass therethrough are provided in the heat shield, and
a second fixing hole for allowing the fixing element to pass therethrough is provided in the printed circuit board;
wherein said controller comprises:
a stack which generates heat, including a second main unit, whose lead is fixed to the printed circuit board, being rectangularly and vertically arranged;
a heat-radiation fin including a mouth for protruding the second main unit of the stack, and also including a fold; and
a clip which contacts the fold to the second main unit, having elasticity towards its openclose movement.
5. A controller including the modular heat-radiation structure as recited in claim 4, wherein the heat shield is provided with a mouth for allowing the second main unit of the stack to pass therethrough, and also with a protrusion for supporting the second main unit along the longitudinal orientation of the mouth.

1. A method for image-based status determination, comprising:
capturing, via a mobile device, at least one image of a moving path;
analyzing, via the mobile device, at least one feature within the at least one image;
based on analysis of the at least one feature, determining, via the mobile device, a direction of movement of the moving path; and
displaying, on a display of the mobile device, an advertisement along the moving path within a representation of the captured image based on the determined direction of movement of the moving path.
2. The method of claim 1 wherein the at least one feature comprises a body part of a person on the moving path.
3. The method of claim 1 wherein the at least one feature comprises an object adjacent to the moving path.
4. The method of claim 1 further comprising tracking and comparing the at least one feature between a plurality of the images.
5. The method of claim 1 further comprising displaying navigation directions on the mobile device based on the determined direction of movement of the moving path.
6. An apparatus for image-based status determination, comprising:
an image capture device configured to capture at least one image of a moving path;
a processor and a display device coupled to the image capture device;
the processor configured to:
analyze at least one feature within the at least one image;
determine a direction of movement of the moving path based on analysis of the at least one feature; and
command display, on the display device, of an advertisement along the moving path within a representation of the captured image based on the determined direction of movement of the moving path.
7. The apparatus of claim 6 wherein the at least one feature comprises a body part of a person on the moving path.
8. The apparatus of claim 6 wherein the at least one feature comprises an object adjacent to the moving path.
9. The apparatus of claim 6 wherein the processor is further configured to track and compare the at least one feature between a plurality of the images.
10. The apparatus of claim 6 wherein the processor is further configured to display navigation directions on the mobile device based on the determined direction of movement of the moving path.
11. An apparatus for image-based status determination, comprising:
means for capturing at least one image of a moving path;
means for analyzing at least one feature within the at least one image;
means for, based on analysis of the at least one feature, determining a direction of movement of the moving path; and
means for displaying an advertisement along the inclined path within a representation of the captured image based on the determined position from where the image was captured.
12. A processor-readable medium comprising processor-readable instructions configured to cause a processor to:
capture at least one image of a moving path;
analyze at least one feature within the at least one image;
based on analysis of the at least one feature, determine a direction of movement of the moving path; and
command display, on a display device, of an advertisement along the inclined path within a representation of the captured image based on the determined position from where the image was captured.
13. A method for image-based status determination, comprising:
capturing, via a mobile device, an image of an inclined path;
analyzing, via the mobile device, at least one feature within the image;
based on analysis of the at least one feature, determining, via the mobile device, whether the image was captured from a top position relative to the inclined path or bottom position relative to the inclined path; and
displaying, on a display of the mobile device, an advertisement along the inclined path within a representation of the captured image based on the determined position from where the image was captured.
14. The method of claim 13 wherein the determining step comprises detecting an object adjacent to the inclined path and determining an angle of the object with respect to a horizon line.
15. The method of claim 13 further comprising determining a tilt angle of a device used to capture the image, and wherein determination of whether the image was from a top position or bottom position is further based on the tilt angle.
16. The method of claim 13 further comprising displaying navigation directions on the mobile device based on the determined position from where the image was captured.
17. An apparatus for image-based status determination, comprising:
an image capture device configured to capture at least one image of an inclined path;
a processor and a display device coupled to the image capture device;
the processor configured to:
analyze at least one feature within the image; and
determine whether the image was captured from a top position relative to the inclined path or bottom position relative to the inclined path based on analysis of the at least one feature; and

command display, on the display device, of an advertisement along the inclined path within a representation of the captured image based on the determined position from where the image was captured.
18. The apparatus of claim 17 wherein the determining step comprises detecting an object adjacent to the inclined path and determining an angle of the object with respect to a horizon line.
19. The apparatus of claim 17 wherein the processor is further configured to determine a tilt angle of a device used to capture the image, and wherein determination of whether the image was from a top position or bottom position is further based on the tilt angle.
20. The apparatus of claim 17 wherein the processor is further configured to display navigation directions on the mobile device based on the determined position from where the image was captured.
21. An apparatus for image-based status determination, comprising:
means for capturing an image of an inclined path;
means for analyzing at least one feature within the image;
means for, based on analysis of the at least one feature, determining whether the image was captured from a top position relative to the inclined path or bottom position relative to the inclined path; and
means for displaying an advertisement along the inclined path within a representation of the captured image based on the determined position from where the image was captured.
22. A processor-readable medium comprising processor-readable instructions configured to cause a processor to:
capture an image of an inclined path;
analyze at least one feature within the image;
based on analysis of the at least one feature, determine whether the image was captured from a top position relative to the inclined path or bottom position relative to the inclined path; and
command display, on a display device, of an advertisement along the inclined path within a representation of the captured image based on the determined position from where the image was captured.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A semiconductor device comprising:
a semiconductor chip which comprises a semiconductor substrate and a multilayer interconnection structure formed thereon, the multilayer interconnection structure including an interlayer insulating film smaller in relative dielectric constant than an SiO2 film;
an encapsulating resin layer which covers a first major surface of the semiconductor chip on a side of the multilayer interconnection structure and covers a side surface of the semiconductor chip; and
a stress relaxing resin layer which is interposed between the semiconductor chip and the encapsulating resin layer, covers at least a part of an edge of the semiconductor chip on the side of the multilayer interconnection structure, and is smaller in Young’s modulus than the encapsulating resin layer.
2. The device according to claim 1, wherein a part of the stress relaxing resin layer which covers the side surface of the semiconductor chip extends across a boundary between the multilayer interconnection structure and the semiconductor substrate.
3. The device according to claim 2, further comprising:
a wiring substrate facing a second major surface of the semiconductor chip which is opposite to the first major surface; and
a mounting material which is interposed between the semiconductor chip and the wiring substrate and fixes the semiconductor chip on the wiring substrate,
wherein the mounting material covers a part of the side surface of the semiconductor chip on a side of the wiring substrate, and
wherein the part of the stress relaxing resin layer which covers the side surface of the semiconductor chip is in contact with a part of the mounting material which covers the side surface of the semiconductor chip.
4. The device according to claim 1, wherein the stress relaxing resin layer covers the first major surface only at a periphery thereof.
5. The device according to claim 1, wherein the stress relaxing resin layer covers a center and a periphery of the first major surface.
6. The device according to claim 1, wherein the semiconductor chip further comprises a buffer coating layer which contains a resin and covers a major surface of the multilayer interconnection structure.
7. The device according to claim 1, wherein the stress relaxing resin layer entirely covers the edge of the semiconductor chip on the side of the multilayer interconnection structure.
8. The device according to claim 1, wherein the stress relaxing resin layer covers a corner of the semiconductor chip on the side of the multilayer interconnection structure.
9. The device according to claim 1, wherein Young’s modulus of the stress relaxing resin layer at room temperature is 2 GPa or less.
10. The device according to claim 1, further comprising a wiring substrate which supports the semiconductor chip.
11. The device according to claim 10, wherein a second major surface of the semiconductor chip which is opposite to the first major surface faces the wiring substrate.
12. The device according to claim 10, wherein the wiring substrate is an interposer.
13. A semiconductor assembly comprising:
a wiring substrate;
a semiconductor chip which comprises a semiconductor substrate and a multilayer interconnection structure formed thereon and is disposed such that the semiconductor substrate is interposed between the multilayer interconnection structure and the wiring substrate, the multilayer interconnection structure including an interlayer insulating film smaller in relative dielectric constant than an SiO2 film;
a mounting material which is interposed between the semiconductor chip and the wiring substrate and fixes the semiconductor chip on the wiring substrate;
an encapsulating resin layer which covers the semiconductor chip fixed on the wiring substrate; and
a stress relaxing resin layer which is interposed between the semiconductor chip and the encapsulating resin layer, covers at least a part of an edge of the semiconductor chip on a side of the multilayer interconnection structure, and is smaller in Young’s modulus than the encapsulating resin layer.
14. The assembly according to claim 13, wherein a part of the stress relaxing resin layer which covers a side surface of the semiconductor chip extends across a boundary between the multilayer interconnection structure and the semiconductor substrate.
15. The assembly according to claim 14, wherein the mounting material covers a part of the side surface of the semiconductor chip on a side of the wiring substrate, and
wherein the part of the stress relaxing resin layer which covers the side surface of the semiconductor chip is in contact with a part of the mounting material which covers the side surface of the semiconductor chip.
16. The assembly according to claim 13, wherein the stress relaxing resin layer covers a major surface of the semiconductor chip on the side of the multilayer interconnection structure only at a periphery of the major surface.
17. The assembly according to claim 13, wherein the stress relaxing resin layer covers a center and a periphery of a major surface of the semiconductor chip on the side of the multilayer interconnection structure.
18. The assembly according to claim 13, wherein the semiconductor chip further comprises a buffer coating layer which contains a resin and covers a major surface of the multilayer interconnection structure.
19. The assembly according to claim 13, wherein the stress relaxing resin layer entirely covers the edge of the semiconductor chip on the side of the multilayer interconnection structure.
20. The assembly according to claim 13, wherein the stress relaxing resin layer covers a corner of the semiconductor chip on the side of the multilayer interconnection structure.