Author: claimsbot

What is claimed is:

1. A method for obtaining a digital signature comprising the steps of:
receiving a request for a digital signature during an electronic transaction;
notifying a web browser of the request for the digital signature;
obtaining the digital signature from the wireless device;
appending the digital signature to the data;
notifying the web browser the digital signature has been obtained; and
transmitting the data with the appended digital signature to a requesting party.
2. The method of claim 1, wherein the step of obtaining further includes the steps of:
forwarding the data to an application within the computer;
establishing a short-range wireless connection between the computer and the wireless device; and
forwarding the digital signature to the computer from the wireless device via the short-range wireless link.
3. The method of claim 1, further including the step of recognizing a command within the request for a digital signature.
4. The method of claim 1, further including the step of including a command for the digital signature and the data to be digitally signed within an HTTP header transmitted to a customer.
5. The method of claim 1, wherein the step of transmitting the data with the appended digital signature further includes transmitting the data with the appended digital signature to a URL included within the request.
6. The method of claim 1, wherein the step of notifying further includes the step of periodically reloading a web page notifying the customer of the request for the digital signature.
7. A method for obtaining a digital signature in a transaction between a computer of a customer and a merchant, comprising the steps of:
receiving a request for a digital signature from the merchant during an electronic transaction;
recognizing a command for the digital signature and a data string to be digitally signed within the request;
notifying a web browser of the request for the digital signature;
forwarding the data string to an application within the computer;
establishing a shortrange wireless link between the computer and a wireless device;
forwarding the digital signature to the computer from the wireless device via the short range wireless link;
appending the digital signature to the data string;
notifying the web browser the digital signature has been obtained; and
transmitting the data string with the appended digital signature to a URL included within the request.
8. The method of claim 7, further including the step of including the command for the digital signature and the data string to be digitally signed within an HTTP header transmitted to the computer of the customer by the merchant.
9. The method of claim 7, wherein the step of notifying further includes the step of periodically reloading a web page notifying the customer of the request for the digital signature.
10. A mobile electronic transaction personal proxy device, comprising:
a first interface with a merchant computer;
a second interface with a web browser;
a third interface with a Mobile electronic transaction device; and
control logic configured to:
notify the web browser of a request for a digital signature from the merchant computer;
request a data string be digitally signed by the Mobile electronic transaction device;
receive a digitally signed data string from the Mobile electronic transaction device;
notify the web browser of the digitally signed data string; and
forward the digitally signed data string to the merchant computer.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method of manufacturing a stacked-type semiconductor device, comprising:
arranging a plurality of chip stacks obtained by stacking semiconductor chips on a plurality of stages in one surface direction on a support substrate;
setting the plurality of chip stacks at a preliminary temperature;
heating each of the plurality of chip stacks in sequence at a temperature higher than the preliminary temperature, and connecting a semiconductor chip of each stage in each heated chip stack and the support substrate by wire;
performing plastic molding of each chip stack; and
separating the chip stacks from each other,
wherein the heating in units of chip stacks is performed by divided heater blocks arranged with respect to the chip stacks.
2. The method of manufacturing a stacked-type semiconductor device according to claim 1, wherein the divided heater block is selectively heated in relation to a chip stack to be wire-bonded.
3. The method of manufacturing a stacked-type semiconductor device according to claim 1, wherein the divided heater block is disposed near to a corresponding one of the chip stacks when the corresponding one of the chip stacks is wire-bonded.

1. A magnetic tunnel junction (MTJ) device for a magnetic random access memory (MRAM) device, comprising:
a substrate having a first metal interconnect;
a first dielectric passivation barrier layer formed on the substrate, the first dielectric passivation barrier layer having a first contact via opening formed with a first mask pattern to expose the first metal interconnect;
a first electrode layer formed on the first dielectric passivation barrier layer and extending through the first contact via opening, the first electrode layer in communication with the first metal interconnect;
a fixed magnetization layer formed on the first electrode layer;
a tunnel barrier layer formed on the fixed magnetization layer;
a free magnetization layer formed on the tunnel barrier layer;
a second electrode layer formed on the free magnetization layer, at least the second electrode layer and the free magnetization layer having a shape based upon a second mask pattern and being located over the first contact via opening; and
a second dielectric passivation barrier layer formed on the fixed magnetization layer and around the tunnel barrier layer, the free magnetization layer and the second electrode layer, the second dielectric passivation barrier layer only partially covering the second electrode layer, the second dielectric passivation barrier layer and at least a first portion of the fixed magnetization layer having a shape based upon a third mask pattern.
2. The magnetic tunnel junction device of claim 1, in which a tunnel barrier layer shape is based upon the second mask pattern.
3. The magnetic tunnel junction device of claim 1, in which the first contact via opening is at least as wide as the first metal interconnect.
4. The magnetic tunnel junction device of claim 1, in which at least a second portion of the fixed magnetization layer has a shape defined by the second mask pattern.
5. The magnetic tunnel junction device of claim 1, further comprising a third electrode layer formed on the second dielectric passivation barrier layer in communication with the second electrode layer, the third electrode layer having a shape defined by the third mask pattern.
6. The magnetic tunnel junction device of claim 5, further comprising a global dielectric passivation barrier layer disposed over the third electrode layer.
7. The magnetic tunnel junction device of claim 6, further comprising:
a second interlayer dielectric deposited on the global dielectric passivation barrier layer; and
a via opening in the global dielectric passivation barrier layer to expose a portion of the third electrode layer.
8. The magnetic tunnel junction device of claim 1, in which the second mask pattern has an ellipsoid shape.
9. The magnetic tunnel junction device of claim 1, in which the MRAM device is a spin-torque-transfer (STT) MRAM device.
10. The magnetic tunnel junction device of claim 1, integrated into a semiconductor die.
11. The magnetic tunnel junction device of claim 1, integrated into a device selected from a group consisting of a set top box, music player, video player, entertainment unit, navigation device, communications device, personal digital assistant (PDA), fixed location data unit, and a computer.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A data encoding device for coding of LDPC codes that have a plurality of code rates and whose all parity check matrices are composed of a plurality of cyclic matrices, the data encoding device comprising:
circuitry performing coding by converting data words into code words such that
the relationships 1<w0 and w1<w0 are satisfied where a maximum column weight of the cyclic matrices in the certain check matrix whose code rate is not a minimum value among the LDPC codes is defined as w0 and a maximum column weight of the cyclic matrices in the check matrix of a code having a code rate lower than the code rate is defined as w1, and further wherein one or more of the check matrices is obtained based on row splitting.
2. The data encoding device according to claim 1, wherein
when one side of the cyclic matrix in a parity check row is defined as m, based on assumption that a certain row address indicating a position of bit 1 in a certain column in the parity check matrix of a code having a high code rate is b, a row address indicating a position of bit 1 in the column in the parity check matrix of a code having a lower code rate can be represented as b+cm with use of an integer c that is constant for each cyclic matrix and is equal to or larger than 0.
3. The data encoding device according to claim 2, wherein
a value of b or c is so adjusted that all of positions of parity in the check matrices of the codes are on a right side on the check matrix, or on a left side, or with constant intervals.
4. The data encoding device according to claim 3, wherein
the number of cyclic matrices in the parity check matrix of a code having a highest code rate is only one in a row direction, and 2<w0 is satisfied.
5. The data encoding device according to claim 4, wherein
column weight of the cyclic matrices in the parity check matrix of a code having a lowest code rate is 0 or 1.
6. The data encoding device according to claim 5, wherein
column weight of the parity check matrix is constant for the codes of all of the code rates.
7. The data encoding device according to claim 6, wherein
a column weight of the parity check matrix is 3.
8. The data encoding device according to claim 7, wherein
all of the codes are self-orthogonal.
9. The data encoding device according to claim 8, wherein
a minimum hamming distance of all of the codes is at least 6.
10. The data encoding device according to claim 4, wherein
coding is performed, including a code that is obtained by changing length m of one side of an identity matrix and has a different code length.